Cyanate resin modified by polyether imide

A technology of polyetherimide and cyanate ester resin, which can be used in coatings, adhesives, etc., can solve problems such as insufficient toughness, and achieve the effects of simple method, easy implementation of process conditions and excellent mechanical properties.

Inactive Publication Date: 2004-03-10
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although cyanate resin has better impact resistance than other thermosetting resins such as epoxy and bismaleimide, its toughness still cannot meet the requirements of high-performance aerospace structural materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0022] Example 1: Dissolve 15wt% BISP type polyetherimide (η=0.3dl / g) in dichloromethane in a container equipped with stirring, and then add 85wt% bis Phenol A type cyanate resin, 2wt% nonylphenol and 360ppm copper acetylacetonate were stirred and dissolved until the solution became transparent. The obtained solution was casted on a glass sheet, and after most of the solvent evaporated at room temperature, it was placed in a vacuum oven to cure at 150°C for 6 hours, and then cured at 210°C for 2 hours. The obtained blend film was observed by scanning electron microscope to be bicontinuous phase structure. The tensile mechanical properties test result of the blend film is that the tensile modulus is 2.39GPa (contrast: 2.27GPa), the tensile strength is 84.7MPa (contrast: 63.7MPa), and the elongation at break is 5.86% (contrast: 4.14 %).

example 2

[0023] Example 2: Dissolve 20wt% BISP polyetherimide (η = 0.3dl / g) in dichloromethane in a container equipped with stirring, and then add 80wt% bis Phenol A type cyanate resin, 2wt% nonylphenol and 360ppm copper acetylacetonate were stirred and dissolved until the solution became transparent. The obtained solution was casted on a glass sheet, and after most of the solvent evaporated at room temperature, it was placed in a vacuum oven to cure at 150°C for 6 hours, and then cured at 210°C for 2 hours. The obtained blend film was observed by scanning electron microscope to have an inverted phase structure. The tensile mechanical properties test result of the blend film is that the tensile modulus is 2.00GPa (contrast: 2.27GPa), the tensile strength is 73.4MPa (contrast: 63.7MPa), and the elongation at break is 5.50% (contrast: 4.14 %).

example 3

[0024] Example 3: In an oil bath at 120°C, melt blend 30wt% of BISM type polyetherimide (η=0.25dl / g) and 70wt% of bisphenol A type cyanate resin, after mixing uniformly , cooled to 90° C., then added 6 wt % nonylphenol and 400 ppm copper acetylacetonate, and stirred until the mixture was transparent. The resulting mixture was poured into a mold coated with a release agent while it was hot, cured in a vacuum oven at 180°C for 3 hours, and post-cured at 250°C for 1 hour. The fracture toughness of the resulting blend was 2.20 MPa m 1 / 2 (compared to 0.80MPa m 1 / 2 ), the fracture energy is 1150J m -2 (compared to 160J m -2 ).

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Abstract

A polyether imide modified cyanate resin is prepared from cyanate resin, polyether imide, main catalyst and cocatalyst through fusing or dissolving, proportionally mixing, and solidifying. Its advantages are high impact performance, high toughness and high tension strength.

Description

technical field [0001] The present invention relates to thermoplastic polyetherimide modified cyanate resin, to improve the use of cyanate resin in high digital and high frequency printed circuit boards, adhesives, coatings, high-performance wave-transparent materials and high-performance structures for aerospace Properties of composite resin matrix. Background technique [0002] Cyanate resin refers to a phenol derivative containing two or more cyanate functional groups, which undergoes a three-cyclization reaction under the action of heat or a catalyst to form a network structure with a high cross-linking density containing a triazine ring. molecular. Cured cyanate ester resin has been widely used in advanced composite materials in recent years because of its low dielectric coefficient, high glass transition temperature, low shrinkage rate, low moisture absorption rate, excellent mechanical properties and bonding properties. Applications. Although cyanate resin has bett...

Claims

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Application Information

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IPC IPC(8): C08L79/00C09D179/00C09J179/00
Inventor 李善君陶庆胜唐晓林
Owner FUDAN UNIV
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