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Copper-based workpiece electroplated with thick silver and manufacturing method thereof

A production method, copper-based technology, applied in the direction of metal material coating process, etc., can solve the problems of reducing the service life of metal parts, environmental production personnel hazards, affecting the appearance of metal parts, etc., to prolong the service life, eliminate internal stress, avoid The effect of coating cracking

Inactive Publication Date: 2021-11-12
ANHUI NORMAL UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, people generally use water wet silver plating method for electroplating treatment, but the silver salt usually used in water wet silver plating is mostly cyanide salt, which is mainly because the cyanide salt bath has good stability and the production process is easy to control. In the process, highly toxic cyanide will be produced, and the passivation solution contains chromium, which is difficult to handle and is easy to cause harm to the environment and production personnel; in addition, the silver layer obtained by the wet silver plating method is relatively thin, and there are The defect of poor abrasive performance, the silver-plated surface is prone to peeling, which will affect the appearance of the entire metal part and further reduce the service life of the metal part
In the prior art, in order to improve its service life, multiple electroplating is usually used to increase the thickness of the silver plating layer, but the existing electroplating thick silver has the defect of poor bonding force of each plating layer

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Method for manufacturing a thick silver plated copper strap, the method comprising the steps of:

[0045] Pretreatment Step S1: copper workpiece to electrolytic degreasing process, the electrolyte comprising: NaOH2g / L, NaHCO 3 20g / L, the electrolysis temperature is 40 ℃, current density 8A / dm 2 , 2.5min electrolytic degreasing, then washed with water copper workpiece;

[0046] Step S2 bottom plating layer of gold: after the pre-treatment copper gold plating workpiece disposed in the bottom, the bottom gold plating solution comprising: potassium citrate gold 3g / L, potassium citrate 30g / L, citric acid 35g / L, indium sulfate 1g / L. Plating a layer of gold at the end temperature is room temperature, wherein a current density of 2A / dm 2 Plating time was 0.5min;

[0047] Acid copper plating step S3, the optical layer: The bottom gold layer after plating copper plating workpiece is subjected to a temperature treatment of the acid copper plating bath 20 ℃ light in whi...

Embodiment 2

[0055] Method for manufacturing a thick silver plated copper strap, the method comprising the steps of:

[0056] Pretreatment Step S1: copper workpiece to electrolytic degreasing process, the electrolyte comprising: NaOH2.5g / L, NaHCO 3 22g / L, the electrolysis temperature is 45 ℃, current density 9A / dm 2 , Electrolytic degreasing 2.7 min, then washed with water copper workpiece;

[0057] Step S2 bottom plating layer of gold: after the pre-treatment copper gold plating workpiece disposed in the bottom, the bottom gold plating solution comprising: potassium citrate gold 4g / L, potassium citrate 40g / L, citric acid 45g / L, indium sulfate 1.5g / L. Plating a layer of gold at the end temperature is room temperature, wherein the current density of 3A / dm 2 Plating time was 0.8 min;

[0058] Acid copper plating step S3, the optical layer: The bottom gold layer after plating copper plating workpiece is subjected to a temperature treatment of the acid copper plating bath 20 ℃ ligh...

Embodiment 3

[0066] Method for manufacturing a thick silver plated copper strap, the method comprising the steps of:

[0067] Pretreatment Step S1: copper workpiece to electrolytic degreasing process, the electrolyte comprising: NaOH3g / L, NaHCO 3 25g / L, the electrolysis temperature is 50 ℃, a current density of 10A / dm 2 , Electrolytic degreasing 3min, then washed with water copper workpiece;

[0068] Step S2 bottom plating layer of gold: after the pre-treatment copper gold plating workpiece disposed in the bottom, the bottom gold plating solution comprising: a gold potassium citrate 5g / L, potassium citrate 50g / L, citric acid 55g / L, indium sulfate 2g / L. Plating a layer of gold at the end temperature is room temperature, wherein the current density of 4A / dm 2 , A plating time of 1min;

[0069] Acid copper plating step S3, the optical layer: The bottom gold layer after plating copper plating workpiece is subjected to a temperature treatment of the acid copper plating bath 20 ℃ lig...

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Abstract

The invention discloses a copper-based workpiece electroplated with thick silver and a manufacturing method of the copper-based workpiece. The manufacturing method comprises the steps of pretreatment, electroplating of a bottom gold layer, electroplating of an acid light copper layer, electroplating of a palladium cobalt layer, electroplating of a gold layer, electroplating of a silver layer, stress relief and treatment of an anti-discoloration coating. The surface of the copper-based workpiece electroplated with the thick silver comprises the bottom gold layer, the acid light copper layer, the palladium cobalt layer, the gold layer, the silver layer and the anti-discoloration coating in sequence from inside to outside. According to the manufacturing method, the bottom gold electroplating treatment is carried out before thick silver electroplating is conducted, the annealing treatment is carried out after thick silver electroplating is accomplished, the anti-discoloration coating treatment is carried out on the surface of the thick silver plating layer, and therefore the prepared electroplated thick silver is firmly combined with a copper base and is not prone to peeling, the service life of the silver plating layer is prolonged, the plating layer is uniform and compact, the color is silvery white, and the good oxidation discoloration resistance is achieved.

Description

Technical field [0001] The present invention relates to a plating processing technology, and particularly relates to a method for manufacturing a copper piece and a thick silver plating. Background technique [0002] Silver-plated metal member is a common method of metal surface treatment, by silver-plated metal parts can improve the wear resistance, corrosion resistance, electrical conductivity, and a metal reinforcement member reflective surface appearance and enhancing the like. There is now widely used method for wet silver plating, silver wet but usually mostly silver cyanide salt, mainly cyanide salt bath stability is good, the production process is easy to control, but in the plating process will produce highly toxic cyanide, and the passivation solution containing chromium, are difficult to handle, easy to cause harm to the environment and production personnel; Further, the silver plating layer is thin wet silver obtained by the method, the presence of resistant differenc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/10C25D5/34C25D5/48C25D5/50C25D7/00C25F1/00C22F1/02C22F1/08C23C22/08C23F17/00C25D3/38C25D3/46C25D3/48C25D3/56
CPCC25D5/10C25D7/00C25D5/34C25D5/50C25D5/48C25F1/00C25D3/48C25D3/38C25D3/56C25D3/46C23C22/08C22F1/02C22F1/08C23F17/00
Inventor 朱琼霞杨富国杨澜燕包艳萍
Owner ANHUI NORMAL UNIV
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