Copper-based workpiece electroplated with thick silver and manufacturing method thereof
A production method, copper-based technology, applied in the direction of metal material coating process, etc., can solve the problems of reducing the service life of metal parts, environmental production personnel hazards, affecting the appearance of metal parts, etc., to prolong the service life, eliminate internal stress, avoid The effect of coating cracking
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Embodiment 1
[0044] Method for manufacturing a thick silver plated copper strap, the method comprising the steps of:
[0045] Pretreatment Step S1: copper workpiece to electrolytic degreasing process, the electrolyte comprising: NaOH2g / L, NaHCO 3 20g / L, the electrolysis temperature is 40 ℃, current density 8A / dm 2 , 2.5min electrolytic degreasing, then washed with water copper workpiece;
[0046] Step S2 bottom plating layer of gold: after the pre-treatment copper gold plating workpiece disposed in the bottom, the bottom gold plating solution comprising: potassium citrate gold 3g / L, potassium citrate 30g / L, citric acid 35g / L, indium sulfate 1g / L. Plating a layer of gold at the end temperature is room temperature, wherein a current density of 2A / dm 2 Plating time was 0.5min;
[0047] Acid copper plating step S3, the optical layer: The bottom gold layer after plating copper plating workpiece is subjected to a temperature treatment of the acid copper plating bath 20 ℃ light in whi...
Embodiment 2
[0055] Method for manufacturing a thick silver plated copper strap, the method comprising the steps of:
[0056] Pretreatment Step S1: copper workpiece to electrolytic degreasing process, the electrolyte comprising: NaOH2.5g / L, NaHCO 3 22g / L, the electrolysis temperature is 45 ℃, current density 9A / dm 2 , Electrolytic degreasing 2.7 min, then washed with water copper workpiece;
[0057] Step S2 bottom plating layer of gold: after the pre-treatment copper gold plating workpiece disposed in the bottom, the bottom gold plating solution comprising: potassium citrate gold 4g / L, potassium citrate 40g / L, citric acid 45g / L, indium sulfate 1.5g / L. Plating a layer of gold at the end temperature is room temperature, wherein the current density of 3A / dm 2 Plating time was 0.8 min;
[0058] Acid copper plating step S3, the optical layer: The bottom gold layer after plating copper plating workpiece is subjected to a temperature treatment of the acid copper plating bath 20 ℃ ligh...
Embodiment 3
[0066] Method for manufacturing a thick silver plated copper strap, the method comprising the steps of:
[0067] Pretreatment Step S1: copper workpiece to electrolytic degreasing process, the electrolyte comprising: NaOH3g / L, NaHCO 3 25g / L, the electrolysis temperature is 50 ℃, a current density of 10A / dm 2 , Electrolytic degreasing 3min, then washed with water copper workpiece;
[0068] Step S2 bottom plating layer of gold: after the pre-treatment copper gold plating workpiece disposed in the bottom, the bottom gold plating solution comprising: a gold potassium citrate 5g / L, potassium citrate 50g / L, citric acid 55g / L, indium sulfate 2g / L. Plating a layer of gold at the end temperature is room temperature, wherein the current density of 4A / dm 2 , A plating time of 1min;
[0069] Acid copper plating step S3, the optical layer: The bottom gold layer after plating copper plating workpiece is subjected to a temperature treatment of the acid copper plating bath 20 ℃ lig...
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