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Single-component epoxy resin composition and preparation method thereof

A technology of epoxy resin and composition, applied in the direction of epoxy resin glue, adhesive type, adhesive additive, etc., can solve the problems of affecting production efficiency, peristaltic pump dripping, inconvenient automatic dripping paint, etc.

Inactive Publication Date: 2020-06-30
ELANTAS ZHUHAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although these one-component epoxy encapsulants avoid weighing and stirring problems in use, they cannot be drip-coated with a peristaltic pump due to their high viscosity at room temperature, which is inconvenient for automatic dripping of paint, which affects production efficiency.

Method used

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  • Single-component epoxy resin composition and preparation method thereof
  • Single-component epoxy resin composition and preparation method thereof
  • Single-component epoxy resin composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0096] 30 parts of bisphenol A type epoxy resin (CYD-128) with an epoxy equivalent of 185g / equivalent and a viscosity of 11000cps at 25°C, 2 parts of epoxy diluent hexanediol diglycidyl ether, 40 parts of filler 3000 mesh silica powder Parts, 20 parts of liquid methyl tetrahydrophthalic anhydride, 3 parts of thixotropic additives, unmodified hydrophilic fumed silicon dioxide Aerosil 200 with an average particle size of 12nm and 0.01 part of silicone defoamer were added to the mixing tank In the process, disperse at high speed at 1000rpm for 3 hours, pass cooling water to control the temperature of the mixture below 40°C, stop high-speed dispersion, keep stirring at 20rpm, when the temperature of the mixture drops below 25°C, add latent 1 under stirring at 20rpm part of curing accelerator 2,4-diamine-6-(2'-methylimidazolyl-(1'))-ethyltriazine-isocyanuric acid adduct powder (melting point>260°C), and then at 500rpm Disperse at high temperature for 2 hours, cool down with cold wa...

Embodiment 2

[0098] 30 parts of bisphenol F-type epoxy resin (NPEF-170) with an epoxy equivalent of 170g / equivalent and a viscosity of 3500cps at 25°C, 1 part of epoxy diluent hexanediol diglycidyl ether, and an inorganic filler with a particle size of 30 Add 40 parts of micron aluminum hydroxide, 22 parts of liquid methyl tetrahydrophthalic anhydride, 2 parts of GARAMITE-7305 organic bentonite which does not require pre-activation as a thixotropic additive, and 0.01 part of silicone defoamer into the mixing tank, and disperse at a high speed at 1000rpm For 3 hours, pass cooling water to control the temperature of the mixture below 40°C, stop the high-speed dispersion, and keep stirring at 20rpm. After the temperature of the mixture drops below 25°C, add 1 part of latent curing accelerator microcapsules to seal imidazole at 20rpm, Then disperse at 500rpm for 2 hours, cool down with cold water to ensure that the temperature of the mixture is lower than 30°C, and finally stir and defoam under...

Embodiment 3

[0100] 20 parts of novolac polyglycidyl ether (viscosity 5000cps@66°C) with an epoxy equivalent of 180g / equivalent, bisphenol F type epoxy resin NPEF-170 with an epoxy equivalent of 170g / equivalent and a viscosity of 3500cps at 25°C 10 parts, 2 parts of epoxy diluent butanediol diglycidyl ether, 40 parts of glass powder with filler particle size of 30 microns, 20 parts of liquid methylnadic anhydride, thixotropic additive dimethyl dichlorosilane modification Add 2 parts of hydrophobic fumed silica with an average particle size of 12nm and 0.01 part of silicone defoamer into the mixing tank, disperse at 1000rpm for 3 hours at high speed, pass cooling water to control the temperature of the mixture below 40°C, stop Disperse at high speed, keep stirring at 20rpm, when the temperature of the mixture drops below 25°C, add 3 parts of latent curing accelerator boron trifluoride ethylamine complex under stirring at 20rpm, then disperse at 500rpm for 2 hours, pass Lower the temperature...

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Abstract

The invention provides a low-viscosity single-component epoxy resin composition which comprises at least one epoxy resin, at least one liquid anhydride curing agent, at least one curing accelerator and at least one thixotropic aid. The low-viscosity single-component epoxy resin composition disclosed by the invention is suitable for being used as an encapsulating compound, is convenient to use, andcan be directly used without weighing, proportioning and stirring; the composition has low viscosity and is suitable for various construction processes; leveling is conducted in the gluing and bakingprocess, defoaming is good, and the film forming thickness is moderate; a cured material is high in bonding strength, low in shrinkage rate and not prone to cracking, has excellent electrical performance, is particularly suitable for being used as an encapsulating compound, and is particularly suitable for neck encapsulation of rotors such as electric tools with high rotating speed, large vibration and high working temperature.

Description

technical field [0001] The invention relates to a one-component epoxy resin composition, a preparation method thereof and an application as an encapsulating glue. Background technique [0002] Power tool rotors with high power, high speed and high impact vibration or other high-speed motor rotors have a harsh working environment, and often need to operate under high temperature, high speed and high impact vibration environments. At high speed, carbon brush particles or other impurities can easily damage the paint film on the surface of the enameled wire at the commutator. In order to prevent the rotor from being damaged, it is necessary to coat a layer of encapsulant with a certain thickness (about 0.1-2mm) on the basis of the insulating varnish. In addition to the basic insulation performance, it also plays the role of protection, filling and repairing. The main function of the encapsulation layer is to add a protective layer to the enameled wire of the commutator, which c...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/06
CPCC09J11/06C09J163/00C08K3/36C08L63/00
Inventor 梁振华徐星周美勇苏祖军
Owner ELANTAS ZHUHAI CO LTD
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