Preparation method of ceramic-based electronic circuit

An electronic circuit, ceramic-based technology, applied in the directions of printed circuits, printed circuit parts, electrical components, etc., can solve the problems of reducing the preparation accuracy of electronic circuits, increasing the processing defects of electronic circuits, and not having high heat resistance, etc. Achieve excellent interface bonding, avoid over-plating problems, and ensure the effect of process stability

Active Publication Date: 2018-09-21
SHANGHAI AMPHENOL AIRWAVE COMM ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Problem 1. The interface between the ceramic substrate and the metal-based electronic circuit is poorly bonded
The reason is that ceramics have a weaker ability to adsorb palladium ions than metals, injection-molded plastics or other materials. In addition, unless additional metal impurity elements with catalytic activity are added, ceramic substrates generally do not have the ability to reduce palladium ions. Therefore, even if laser engraving is used to roughen the surface of the ceramic substrate first, and then the effect of palladium activation treatment on the roughened ceramic substrate surface is also very poor, and then in the subsequent conventional electroless plating or electroplating to thicken the metal electronic circuit When used, the interface bonding force between the ceramic substrate and the electronic circuit is poor, and in severe cases, the circuit may even fall off, which cannot meet the actual needs.
[0007] Question 2. At present, there is no comparative document specifically mentioning how to solve the problem that the debris generated during laser engraving will contaminate the ceramic substrate itself
The resin ink layer mentioned in CN104470235A and the insulating layer mentioned in CN104377438A objectively can partially play the same effect as the surface protection layer mentioned in the present invention, but the problem that should also be noted is that the resin ink layer in CN104470235A , the insulating layer in CN104377438A, between them and the ceramic substrate only play the effect of temporary bonding, and needs to be removed easily at the same time or after preparing the electronic circuit, based on this feature, it is determined that they are generally preferably organic Composed of polymer materials, so it will not have high heat resistance
The debris generated during laser engraving tends to reach an ultra-high temperature at the moment of initial generation. This instantaneous ultra-high temperature debris can easily damage the resin ink layer (or insulating layer, surface protection layer), and firmly adhere to it. The surface of the ceramic substrate is also difficult to completely remove in the subsequent process, which increases the possibility of processing defects in electronic circuits, and also increases the risk of overflow plating in the subsequent electroless plating or electroplating process, reducing the preparation accuracy of electronic circuits

Method used

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  • Preparation method of ceramic-based electronic circuit
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  • Preparation method of ceramic-based electronic circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] A method for preparing a ceramic-based electronic circuit, comprising the following steps:

[0039] S1) Preparation of ceramic substrate: select 95 alumina powder (conventional commercially available powder is enough) as raw material, use tape casting-lamination-sintering process to prepare the required ceramic substrate, and use mechanical cutting to cut the ceramic substrate into the required size, using grinding and polishing, the surface of the ceramic substrate is processed to a roughness of 0.2u±0.05u(Ra), and the arithmetic mean deviation of the contour is Ra;

[0040] S2) Prepare the surface protective layer: select magenta: CMC=50wt%: 50wt% as mixed solute, use deionized water as diluent, configure a protective layer solution with a concentration of 5g / L, and use a spraying process to evenly coat the protective layer solution Cover the surface of the ceramic substrate described in step S1, and dry at 75°C for 1 hour; here the magenta is basic fuchsin C 20 h 2...

Embodiment 2

[0046] S10) According to the method similar to that described in Example 1, according to the ratio of alumina: zirconia: magnesia: lanthanum manganate = 12wt%: 80wt: 5wt%: 3wt% as raw material, prepare a ceramic substrate; and use grinding and polishing process, the surface roughness of the ceramic substrate is controlled in several different specifications, and the specific statistics are shown in Table 1:

[0047] Table 1 Several ceramic substrates with different surface roughness

[0048] Specification

Surface Processing Process

Surface roughness range Ra / um

A

coarse grinding

0.55～0.79

B

coarse grinding + fine grinding

0.05～0.09

C

Coarse Grinding + Rough Polishing

0.03～0.05

D

Coarse grinding + rough polishing + fine polishing

0.02～0.03

[0049] S20) Prepare the surface protection layer: configure two different surface protection layer solutions according to the statistics in Table 2;

[0050] Table 2...

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PUM

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Abstract

The invention discloses a preparation method of a ceramic-based electronic circuit, comprising the following steps: firstly, a ceramic matrix is prepared by using a conventional ceramic powder; then,a surface protective layer is deposited on the surface of the ceramic matrix; and a three-dimensional shape of the electronic circuit is engraved on the surface of the ceramic matrix by using a laserdevice; the ceramic matrix is immersed in a surface modifier liquid colloid to completely remove the residual surface protective layer; and finally, the electronic circuit itself is prepared by a conventional chemical plating and/or electroplating process. By optimizing combinational design of laser output power, laser engraving line spacing, engraving times and the engraving pattern, the surfaceof the ceramic matrix in the laser engraving area is roughened, thus being beneficial to interface bonding of the electronic circuit and the ceramic matrix and simultaneously reducing chippings generated during the engraving process to the maximum.

Description

technical field [0001] The invention belongs to the technical field of electronic circuits, in particular to a method for preparing ceramic-based electronic circuits. Background technique [0002] For those skilled in the art, it is already a very common solution to choose ceramics as the substrate of electronic circuits. However, how to continuously improve the precision of ceramic-based electronic circuits, broaden the scope of application of ceramic-based materials, and reduce manufacturing costs will always be a problem that people in the field will always pay attention to. [0003] Regarding the preparation accuracy of ceramic-based electronic circuits, many schemes have been proposed, such as the DPC process. The DPC process uses vacuum sputtering to pre-deposit a thin layer on the outer surface of the ceramic substrate, and then uses - Development-etching-removing" a complete set of processes to prepare electronic circuits, and then use electroless plating and / or ele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/622C04B35/10C04B35/48C04B41/91C04B41/90B23K26/362H05K1/03
CPCB23K26/361C04B35/10C04B35/48C04B35/622C04B41/52C04B41/5346C04B41/90C04B41/91C04B2235/3206C04B2235/3217C04B2235/3227C04B2235/3268H05K1/0306C04B41/5127C04B41/5116C04B41/5144
Inventor 吴昊姜来新蒋海英
Owner SHANGHAI AMPHENOL AIRWAVE COMM ELECTRONICS CO LTD
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