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Styryl siloxy polyphenyl ether resin and preparation method and application thereof

A polyphenylene ether resin, styrene-based technology, applied in the field of styrene-based siloxy polyphenylene ether resin and its preparation, can solve the problems of undisclosed polyphenylene ether performance improvement and the like

Active Publication Date: 2018-06-12
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current method for preparing vinylbenzyl-polyphenylene ether compounds, as known, is to combine polyphenylene ether compounds with halogenated methylstyrene (vinylbenzyl halides) in toluene solution in the presence of alkali metal hydroxides reaction, then neutralize the reaction solution with acid, after washing, use a large amount of methanol to carry out the method of reprecipitation (Japanese Patent Application No. 2009-96953); or as CN104072751A discloses in the presence of an aqueous alkali metal hydroxide , in a solvent including aromatic hydrocarbons and aliphatic alcohols, the polyphenylene ether having a phenolic hydroxyl group at the end reacts with vinyl benzyl halides in the presence of a phase transfer catalyst, and the reactants are successively passed through an aqueous alkali metal hydroxide solution and After washing with hydrochloric acid, a vinylbenzyl-polyphenylene ether compound is obtained, but it does not disclose the performance improvement of the polyphenylene ether when used in high-frequency circuit substrates

Method used

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  • Styryl siloxy polyphenyl ether resin and preparation method and application thereof
  • Styryl siloxy polyphenyl ether resin and preparation method and application thereof
  • Styryl siloxy polyphenyl ether resin and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0094] Stir 73 parts by weight of polyphenylene ether resin MX90 and 1000 mL of anhydrous tetrahydrofuran in a reactor equipped with a stirrer, dropping funnel, thermometer, and gas pipe (nitrogen) until completely dissolved into a uniform solution, and continue to pass nitrogen 0.5- The water vapor in the reaction kettle was removed for 1 hour, and nitrogen gas was maintained throughout the reaction process. Keep the temperature in the reactor below 20°C, and then slowly add 19.5 parts by weight of diphenyldichlorosilane dropwise. After the addition is completed, the reaction kettle is kept below 20°C for 8 hours, and then the temperature is raised to 55°C for 3 hours. Subsequently, 7.5 parts by weight of p-hydroxystyrene was added dropwise to the reaction kettle, and reacted at 55° C. for 5 hours. After the reaction, the tetrahydrofuran was removed by distillation under reduced pressure to obtain a polyphenylene ether resin modified with a styryl siloxy group, which was desi...

Embodiment 2

[0096] Stir 80 parts by weight of polyphenylene ether resin MX90 and 1000 mL of anhydrous tetrahydrofuran in a reactor equipped with a stirrer, dropping funnel, thermometer and air duct (nitrogen) until completely dissolved into a uniform solution, and continue to pass nitrogen 0.5- The water vapor in the reaction kettle was removed for 1 hour, and nitrogen gas was maintained throughout the reaction process. At the same time, the temperature in the reactor is kept below 20°C, and then 12 parts by weight of methyl vinyl dichlorosilane are slowly added dropwise. After the addition is completed, the reaction kettle is kept below 20°C for 8 hours, and then the temperature is raised to 55°C for 3 hours. Subsequently, 8 parts by weight of p-hydroxystyrene was added dropwise to the reaction kettle, and reacted at 55° C. for 5 hours. After the completion of the reaction, tetrahydrofuran was removed by distillation under reduced pressure to obtain a polyphenylene ether resin modified w...

Embodiment 3

[0098] Stir 80 parts by weight of polyphenylene ether resin MX90 and 1000 mL of anhydrous tetrahydrofuran in a reactor equipped with a stirrer, dropping funnel, thermometer and air duct (nitrogen) until completely dissolved into a uniform solution, and continue to pass nitrogen 0.5- The water vapor in the reaction kettle was removed for 1 hour, and nitrogen gas was maintained throughout the reaction process. At the same time, the temperature in the reactor was kept below 20°C, and 11 parts by weight of dimethyldichlorosilane were slowly added dropwise. After the addition is completed, the reaction kettle is kept below 20°C for 9 hours, and then the temperature is raised to 50°C for 4 hours. Subsequently, 9 parts by weight of p-hydroxystyrene were added dropwise to the reaction kettle and reacted at 52°C for 6 hours. After the completion of the reaction, tetrahydrofuran was removed by distillation under reduced pressure to obtain a polyphenylene ether resin modified with a styr...

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Abstract

The invention provides a styryl siloxy polyphenyl ether resin and a preparation method and application thereof. The styryl siloxy polyphenyl ether resin has a structure shown in the formula I. According to the invention, the styryl siloxy polyphenyl ether resin is obtained by introducing styryl groups and siloxy groups into polyphenyl ether end groups by using a relatively simple synthesis method.The resin combines the low dielectricity of cured styryl groups and the heat resistance, weather resistance, flame retardancy, dielectrical property and low water absorption rate of the siloxy groups, exerts the application advantages of polyphenyl ether resin in a copper clad plate, and can provide excellent dielectric property, moisture resistance, heat resistance and the like required by a high-frequency high-speed copper clad plate.

Description

Technical field [0001] The invention belongs to the technical field of copper clad laminates, and relates to a styrene-based siloxy polyphenylene ether resin and a preparation method and application thereof. Background technique [0002] With the increase in the amount of information communication in recent years, the demand for high-frequency printed circuit boards is increasing. In order to reduce high-frequency transmission loss, electrical insulating materials with excellent electrical characteristics have become the research focus in the field of copper clad laminates. At the same time, printed circuit boards or electronic parts using these electrical insulating materials need to have high heat resistance and high glass transition temperature in order to be able to cope with high temperature reflow soldering and high multilayer assembly during installation. For these requirements, many patents propose resins using vinyl benzyl ether compounds with various chemical structure...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G65/48C08L71/12C08L83/05C08L9/06C08K5/14B32B15/08B32B27/06B32B27/28H05K1/03
CPCH05K1/0326C08G65/485C08K5/14C08L71/12B32B15/08B32B27/06B32B27/285B32B2307/306B32B2307/204B32B2457/08H05K2201/0162C08L2203/20C08L2201/02C08L2201/08C08J5/244C08J5/249C08L83/04C08L9/06B32B15/20B32B27/04B32B27/28C08G65/48H05K1/03C08L71/00C08J2371/12C08J2409/06C08K3/013C08J2483/04C08J5/042C08J5/043C08J5/046C08G65/336C08L71/126C09D171/12C08K3/016C08K5/0066
Inventor 袁婵娥罗鸿运范华勇林伟
Owner GUANGDONG SHENGYI SCI TECH
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