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Silver/graphene low-temperature curing conductive rubber, conductive film, conductor and preparation method thereof

A technology of graphene and conductive adhesive, which is applied in the direction of conductive adhesive connections, adhesives, epoxy resin glue, etc., can solve the problems of low electrical conductivity and poor mechanical properties of conductive adhesives, and achieve reduced process costs, lower curing temperatures, lower The effect of usage

Active Publication Date: 2017-12-22
JINLING INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the problems of low electrical conductivity and poor mechanical properties of current conductive adhesives, the present invention provides a low-temperature curing conductive adhesive compounded with silver powder and graphene, that is, through the quantitative mixing of graphene and silver powder, and then applied to the ring Oxygen resin conductive adhesive, so as to generate a more effective conductive path, and optimize the resin system to improve the conductivity and shear strength

Method used

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  • Silver/graphene low-temperature curing conductive rubber, conductive film, conductor and preparation method thereof
  • Silver/graphene low-temperature curing conductive rubber, conductive film, conductor and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] Embodiment 1 (preparation of nanoscale silver powder):

[0069]Weigh quantitative AgNO 3 Dissolve in a beaker with 50mL deionized water, adjust the pH value to a certain value with concentrated ammonia water or concentrated nitric acid, and make solution A. In addition, weigh a certain amount of hydrazine hydrate and dissolve it in a beaker with 50 mL of deionized water to form solution B. Next, weigh a certain amount of dispersant and dissolve it in a beaker with 100 mL of deionized water, adjust the pH value to a certain value with concentrated ammonia water or concentrated nitric acid, and prepare solution C. Put solution C in a magnetic stirrer. Pour the solutions A and B into the dropping funnel, and add them dropwise at a rate of 2 drops / second to the solution C which is being magnetically stirred, keep the temperature constant at a certain value in a water bath, and continue stirring for 5 minutes after the drops are completed to prepare Silver sol was obtaine...

Embodiment 2

[0071] A preparation of silver / graphene low-temperature curing conductive adhesive: 141 parts of nano-scale silver powder (the same below) prepared in Example 1, 100 parts of epoxy resin, 20 parts of methyl tetrahydrophthalic anhydride, dicyandiamide 5 parts, 0.5 parts of dibutyl phthalate, 0.5 parts of triethanolamine, 10 parts of acetone, 5 parts of 1,4-butanediol diglycidyl ether. Mix nano-scale silver powder and graphene into alcohol solvent and ultrasonically disperse; then mix reactive diluent, non-reactive diluent, curing agent, accelerator, leveling agent or defoamer with nano-scale silver powder and graphene and ultrasonically After 5 minutes, use a high-speed grinding and dispersing machine to stir the slurry at high speed. After mixing, evenly coat the conductive adhesive on the PET film, and heat it at low temperature to quickly solidify. After the conductive adhesive is made, it is coated, and the resistivity measured after curing is 5.43×10 -3 Ω·cm, the shear s...

Embodiment 3

[0073] A preparation of silver / graphene low-temperature curing conductive adhesive: 141 parts of nanoscale silver powder prepared in Example 1, 0.5 part of graphene, 100 parts of epoxy resin, 20 parts of methyltetrahydrophthalic anhydride, dicyandiamide 5 parts of amine, 0.5 part of dibutyl phthalate, 0.5 part of triethanolamine, 10 parts of acetone, 5 parts of 1,4-butanediol diglycidyl ether. Mix nano-scale silver powder and graphene into alcohol solvent and ultrasonically disperse; then mix reactive diluent, non-reactive diluent, curing agent, accelerator, leveling agent or defoamer with nano-scale silver powder and graphene and ultrasonically After 5 minutes, use a high-speed grinding and dispersing machine to stir the slurry at high speed. After mixing, evenly coat the conductive adhesive on the PET film, and heat it at low temperature to quickly solidify. After the conductive adhesive is made, it is coated, and the resistivity measured after curing is 1.2×10 -3 Ω·cm, th...

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Abstract

The invention discloses a preparation method of low-temperature curing high-conductivity slurry and a conductive film. The low-temperature curing high-conductivity slurry is prepared by blending organic carriers with purpose-made nanometer stage silver powder mixed with a small amount of graphene as conductive filling materials. The conductive filling materials use nanometer stage silver powder compounding graphene, has the characteristic of high compactness, and enables the conducive rubber to form a better conductive path when being applied to the conductive rubber. The conductive slurry comprises double ingredients, and has the advantage of long storage period. Compared with the prior art, the preparation method has the advantages of low-temperature curing, high conductivity, high anti-shearing intensity, long storage period and the like and can be widely applied to printing circuit and LED (light emitting diode) chip bonding in electronic devices.

Description

technical field [0001] The invention relates to a preparation method of conductive adhesive, in particular to a silver / graphene low-temperature curing conductive adhesive, a conductive film, a conductor and a preparation method thereof. Background technique [0002] In the electronic packaging industry, the widespread use of tin-lead solder has caused serious damage to the environment, prompting the design and invention of more environmentally friendly materials, conductive adhesive as a substitute for tin-lead solder, compared with tin-lead Solder has more advantages: there is no toxic metal like lead in the material used in conductive adhesive, so it is harmless to the human body; the processing technology is relatively simple, which reduces a lot of processing costs; at the same time, the processing conditions are not as harsh as tin-lead solder , small resolution and other advantages. Therefore, people are doing more and more research on conductive adhesives, and the te...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06C09J11/04H01R4/04
CPCC08K3/04C08K5/12C08K2003/0806C08K2201/001C08K2201/003C08K2201/011C09J11/04C09J11/06C09J163/00H01R4/04
Inventor 张小敏魏旭萍叶原丰王雪冰钱佳锋
Owner JINLING INST OF TECH
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