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Epoxy glue for processing of crystal liable to separate during boiling, and preparation method of epoxy glue

An easy-to-separate, epoxy adhesive technology, used in epoxy resin adhesives, polymer adhesive additives, non-polymer adhesive additives, etc., can solve the problems of weak bonding, difficult separation, easy separation, etc. Achieve fast curing, reliable bonding and good water resistance

Inactive Publication Date: 2017-05-31
云南光电辅料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem of the existing modified epoxy glue for crystal processing that "adhesively but difficult to separate, easy to separate but not firmly bonded", and provide a kind of easy degumming and separation, reliable bonding, especially water Reliable bonding in medium environment, easy to clean residual glue, modified epoxy glue for boiling and easy separation crystal processing

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Embodiment 1 (weight ratio)

[0017] Component A formula:

[0018] E51 epoxy resin 60 Nitrile-40 liquid rubber 25

[0019] Amylose 8 Dibutyl Phthalate 15

[0020] 500 mesh calcium carbonate 15 organic bentonite 8

[0021] Component B formula:

[0022] Capcure 3800 Polythiol Curing Agent 60 2, 4, 6-Tris(dimethylamino)phenol 5

[0023] 651 polyamide epoxy curing agent 30 amylose 10

[0024] R907 titanium dioxide 10 A380 fumed white carbon black 2

[0025] When preparing, put E51 epoxy resin, nitrile-40 liquid rubber, and dibutyl phthalate in the reaction kettle according to the proportion, stir and mix evenly at 40 ° C ~ 60 ° C, then add 500 mesh calcium carbonate, organic bentonite and mix evenly; after cooling down to room temperature, add amylose and mix evenly as component A for later use; mix Capcure 3800 polythiol curing agent, 651 polyamide epoxy curing agent, 2, 4, 6-tri (Dimethylamino)phenol is placed in a reaction kettle, stirred and mixed evenly at 40°C ...

Embodiment 2

[0026] Embodiment 2 (weight ratio)

[0027] Component A formula:

[0028] E51 epoxy resin 60 F46 epoxy resin 30

[0029] JLY121 polysulfide rubber 35 500 mesh silica powder 5

[0030] A200 fumed silica 5

[0031] Component B formula:

[0032] EH-316 polythiol curing agent 60 o-(dimethylaminomethyl)phenol 8

[0033] 650 polyamide epoxy curing agent 30 polyvinyl alcohol 15

[0034] R907 titanium dioxide 10 A380 fumed white carbon black 2

[0035] When preparing, put E51 epoxy resin, F46 epoxy resin, and JLY121 polysulfide rubber in the reaction kettle according to the proportion, stir and mix evenly at 40 ° C ~ 60 ° C, then add 500 mesh silica powder, A200 fumed white carbon black And mix evenly; cool down to room temperature and use as component A for later use. Put EH-316 polythiol curing agent, 650 polyamide epoxy curing agent, and o-(dimethylaminomethyl)phenol into the reaction kettle according to the proportion, stir and mix evenly at 40℃~60℃, then add A380 Fumed wh...

Embodiment 3

[0036] Embodiment 3 (weight ratio)

[0037] Component A formula:

[0038] E51 epoxy resin 80 CHX100 end epoxy nitrile rubber 25

[0039] Amylose 5 n-Butyl Citrate 15

[0040] Component B formula:

[0041] Capcure 3800 Polythiol Curing Agent 100 2, 4, 6-Tris(dimethylamino)phenol 3

[0042] o-(dimethylaminomethyl)phenol 2 polyvinyl alcohol 10

[0043]During preparation, put E51 epoxy resin, CHX100-terminated epoxy nitrile rubber, and n-butyl citrate in the reaction kettle according to the proportion, and stir and mix evenly at 40°C to 60°C; after cooling down to room temperature, add linear Starch and mix evenly, and use it as component A for later use. Put Capcure 3800 polythiol curing agent and 2,4,6-tris(dimethylamino)phenol into the reaction kettle according to the proportion, stir and mix evenly at 40℃~60℃; after cooling down to room temperature, add polyethylene Alcohol and mix well, use as component B for later use. When in use, mix evenly according to A:B=1.1:1 (w...

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Abstract

The invention discloses epoxy glue for processing of a crystal liable to separate during boiling, and a preparation method of the epoxy glue. The modified epoxy glue consists of a component A and a component B, wherein the component A contains epoxy resin, an elastomer, a degumming separating agent, a plasticizer, fillers and a thixotropic agent; the component B contains a polymercaptan curing agent, a tertiary amine accelerant, a silane coupling agent, a degumming separating agent, fillers and a thixotropic agent. The glue has high adhesive strength and high medium resistance when being used for positioning and adhering processing of the crystal material; when the crystal material is completed and heated to be subjected to degumming separation, the temperature is not high, and the residual glue is easy to clean.

Description

technical field [0001] The invention relates to the field of auxiliary materials for processing crystal materials, in particular to a modified epoxy glue for processing boiled and easily separated crystals and a preparation method thereof. Background technique [0002] Materials are the foundation of human material civilization. Since the beginning of the 21st century, crystal materials have been valued by countries all over the world as key materials in high-tech fields such as microelectronics, optoelectronics, communications, aerospace and modern military technology. Taking optoelectronic functional crystals as the core material of high-tech development has an irreplaceable important position. [0003] Crystal materials represented by crystalline silicon for microelectronics industry and solar cells, sapphire crystals for LED (semiconductor) lighting, Nd-doped yttrium aluminum garnet crystals for lasers, and gallium arsenide crystals for night vision devices are the same ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J109/02C09J181/04C09J115/00C09J103/12C09J129/04C09J11/04C09J11/06C09J11/08
CPCC08K2201/014C08L2205/025C08L2205/035C09J11/04C09J11/06C09J11/08C09J163/00C08L9/02C08L3/12C08K13/06C08K9/04C08K3/346C08K5/12C08K2003/265C08K3/36C08L63/00C08L81/04C08L29/04C08K2003/2241C08L15/00C08K5/11
Inventor 句红兵谭立杨小祥
Owner 云南光电辅料有限公司
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