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Preparation process of a molybdenum-niobium alloy sputtering target

A molybdenum-niobium alloy and sputtering target technology, which is applied in metal material coating process, sputtering plating, metal processing equipment, etc., can solve the problems of low yield of target material, low density of sintered compact, and influence on thermal processing, etc. , to achieve the effect of simple preparation process, less dosage and lower surface energy

Active Publication Date: 2018-06-29
洛阳丰联科绑定技术有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there have been relevant reports on the research of molybdenum-niobium sputtering targets. There are three main preparation methods: 1. Hot isostatic pressing sintering method, the mixed raw material powder is sintered into the required molybdenum by hot isostatic pressing sintering equipment Niobium target, the process equipment investment is large, and the production efficiency is low
2. Intermediate frequency hydrogen sintering method, which is based on the preparation method of pure molybdenum target material. However, metal niobium will absorb a large amount of hydrogen, resulting in low density of sintered compact and easy cracking, which will affect subsequent thermal processing.
The sintering process adopts intermediate frequency hydrogen sintering, and metal niobium will embrittle due to a large amount of hydrogen absorption, resulting in slab cracking during forging and rolling, and the target material yield is extremely low

Method used

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  • Preparation process of a molybdenum-niobium alloy sputtering target
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  • Preparation process of a molybdenum-niobium alloy sputtering target

Examples

Experimental program
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Effect test

Embodiment 1

[0030] A preparation process of a molybdenum-niobium alloy sputtering target, comprising the following steps:

[0031] (1) Put molybdenum powder and niobium powder (purity ≥99.95%, particle size 20μm and 35μm respectively) into the ball mill at a weight ratio of 6:1, and then add palmitic acid and zirconia grinding balls (grain diameter 2mm), ball milling was carried out under the protection of argon, the ball milling time was 80min, the ball milling speed was 1000r / min, sieved, and separated to obtain a molybdenum-niobium alloy composite powder with a particle size of 9 μm;

[0032] The weights of the palmitic acid and zirconia grinding balls are respectively 0.02 times and 8 times of the total weight of molybdenum powder and niobium powder;

[0033] (2) Perform cold isostatic pressing of the molybdenum-niobium alloy composite powder in step (1), the pressure of cold isostatic pressing is 200 MPa, and the holding time is 5 minutes to obtain a pressed blank;

[0034] (3) The ...

Embodiment 2

[0037] A preparation process of a molybdenum-niobium alloy sputtering target, comprising the following steps:

[0038] (1) Put molybdenum powder and niobium powder (purity ≥99.95%, particle size 15μm and 30μm respectively) into the ball mill at a weight ratio of 7:1, and then add zinc stearate and zirconia grinding balls (particle size 3mm), ball milling is carried out under the protection of argon, the ball milling time is 60min, the ball milling speed is 1200r / min, sieved, separated to obtain molybdenum-niobium alloy composite powder with a particle size of 10μm;

[0039] The weights of the zinc stearate and zirconia grinding balls are respectively 0.01 times and 5 times the total weight of molybdenum powder and niobium powder;

[0040] (2) Perform cold isostatic pressing of the molybdenum-niobium alloy composite powder in step (1), the pressure of cold isostatic pressing is 150 MPa, and the holding time is 10 minutes to obtain a pressed blank;

[0041] (3) The pressed blan...

Embodiment 3

[0044] A preparation process of a molybdenum-niobium alloy sputtering target, comprising the following steps:

[0045] (1) Put molybdenum powder and niobium powder (purity ≥ 99.95%, particle size 25 μm and 40 μm respectively) into the ball mill at a weight ratio of 8:1, and then add stearic acid and zirconia grinding balls ( Particle size 1mm), ball milling is carried out under the protection of argon, the ball milling time is 100min, the ball milling speed is 1000r / min, sieved, and separated to obtain molybdenum-niobium alloy composite powder with a particle size of 6 μm;

[0046] The weight of described stearic acid, zirconia grinding ball is respectively 0.03 times, 10 times of molybdenum powder and niobium powder gross weight;

[0047] (2) Vacuumize the molybdenum-niobium alloy composite powder in step (1), and then perform cold isostatic pressing. The pressure of cold isostatic pressing is 180 MPa, and the holding time is 7 minutes to obtain a pressed blank;

[0048] (3)...

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Abstract

The invention belongs to the technical field of metallurgical materials, and specifically relates to a preparation process of a molybdenum-niobium alloy sputtering target, which includes the steps of powder making, molding, vacuum sintering and mechanical processing. The powder making includes the following steps: molybdenum powder and niobium powder Load it into a ball mill according to a weight ratio of 6-10:1, then add a process control agent and zirconia grinding balls, perform ball milling under argon protection, sieve, and separate to obtain a molybdenum-niobium alloy composite powder; the process control The weight of agent and zirconia grinding ball is respectively 0.01-0.05 times and 5-20 times of the total weight of molybdenum powder and niobium powder; described process control agent is zinc stearate, palmitic acid, ethyl stearate, polyester One or more of vinyl alcohol and stearic acid. The molybdenum-niobium alloy sputtering target obtained in the present invention has a single phase structure, uniform structure without holes, average grain size of 40-65 μm, density ≥ 9.85g / cm3, excellent performance, and can be widely used in fields such as flat-panel displays .

Description

technical field [0001] The invention belongs to the technical field of metallurgical materials, and in particular relates to a preparation process of a molybdenum-niobium alloy sputtering target. Background technique [0002] Molybdenum has high melting point, high electrical conductivity, low specific impedance, good corrosion resistance and good environmental performance. Therefore, molybdenum sputtering target is a characteristic electronic material with high added value. In the electronics industry Molybdenum sputtering targets are mainly used for flat panel displays, electrode and wiring materials for thin-film solar cells, and barrier layer materials for semiconductors. [0003] With the improvement of the comprehensive performance and the use environment requirements of the electronics industry, the requirements for sputtering targets used in the electronics industry will become higher and higher in the future. At present, the dominant target for FPD is still high-pu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/34B22F9/04B22F1/00
CPCC23C14/3414B22F9/04B22F2009/043B22F2999/00B22F1/14B22F2201/11B22F2201/20
Inventor 孙虎民赵文普陈亚光高建杰
Owner 洛阳丰联科绑定技术有限公司
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