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Photo-thermal double-curing conductive adhesive and preparation method thereof

A dual-curing, conductive adhesive technology, applied in the direction of conductive adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of batch production restrictions, long curing time, incomplete curing, etc., and achieve improved Efficiency, short curing time, and the effect of improving the degree of curing

Inactive Publication Date: 2013-07-10
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to solve the problem of high curing temperature and long curing time in the way of thermal curing alone for composite conductive adhesives, and incomplete curing with light curing alone, resulting in limited batch production, the present invention provides an efficient, fast, and technological method Simple and environmentally friendly photothermal dual-curing conductive adhesive and preparation method thereof

Method used

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  • Photo-thermal double-curing conductive adhesive and preparation method thereof

Examples

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Effect test

Embodiment 1

[0030] Use 5 / 8 esterification rate epoxy acrylate to add diluent (propylene oxide) 20%, thermal initiator (BPO) 1.5%, silane coupling agent (KH550) 4%, photoinitiator (TPO) 3.0%, Thermal curing agent (triethanolamine) 10%, accelerator (2-ethyl-4-methylimidazole) 5%, conductive filler (Cu powder) 60%, according to figure 1 In the process shown, the conductive adhesive is prepared and cured, the curing time is 300s, the temperature is 120°C, the hardness after curing is 6H, and the resistivity is 4.6×10 -3 Ω·m, the tensile strength is 23.25MPa.

Embodiment 2

[0032] The difference between this example and Example 1 is that the diluent is propylene oxide, and its addition amount is 30%, and then a conductive adhesive is configured, and a photothermal dual curing method is adopted, and the ultraviolet light is irradiated for 300s, and the hardness after curing is 5H. , resistivity 3.6×10 -3 Ω·m, the tensile strength is 23.56MPa.

Embodiment 3

[0034] The difference between this embodiment and the second embodiment is that the ultraviolet light is irradiated for 600s, the conductive adhesive is configured, and the photothermal dual curing method is adopted. After curing, the hardness is 6H, and the resistivity is 3.5×10 -3 Ω·m, the tensile strength is 23.75MPa.

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Abstract

The invention provides a photo-thermal double-curing conductive adhesive and a preparation method thereof, which relates to conductive adhesives and preparation methods thereof. In order to solve the problems that when a compound type conductive adhesive is only subjected to thermal curing, the curing temperature is high, the curing time is long, and when the compound type conductive adhesive is only subjected to light curing, the curing is incomplete, thus resulting in restriction on volume production. The photo-thermal double-curing conductive adhesive is prepared from an epoxy acrylate prepolymer, a diluent, a thermal initiator, a silane coupling agent, a light initiator, a heat curing agent, a promoter and conductive powder which are different in esterification rate. According to the photo-thermal double-curing conductive adhesive, a photo-thermal double-curing technology is adopted, the light initiator, the thermal initiator and the heat curing agent are simultaneously used, the light initiator in conductive adhesive system is triggered by using the irradiation of ultraviolet lights, the thermal initiator in conductive adhesive system is triggered by simultaneously using heat generated by ultraviolet light irradiation and ultraviolet crosslinking reaction, and the hot polymerization reaction is triggered to achieve an ideal deep curing effect. The preparation method has the characteristics of high efficiency, rapidness, simple process and no pollution to the environment.

Description

technical field [0001] The invention relates to a conductive adhesive and a preparation method thereof, in particular to a photothermal dual-curing conductive adhesive and a preparation method thereof. Background technique [0002] With the development of the electronics industry, electronic devices are required to gradually develop in the direction of miniaturization, miniaturization, and intelligence. Some traditional welding materials are far from meeting this refined technical requirement. Research and development of low energy consumption and environmentally friendly New materials have become an inevitable development trend. Conductive adhesive has become a new type of connecting material to replace tin-lead solder due to its excellent characteristics. Conductive adhesives can be divided into intrinsic type and compound type conductive adhesives. Composite conductive adhesive system, because the conductive filler is usually metal particles, carbon-based or other condu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/10C09J9/02C09J11/06C08G59/17
Inventor 郝素娥商庆燕徐佳琳张航川王芳炜高洋王加涛
Owner HARBIN INST OF TECH
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