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Light-emitting diode (LED) light source encapsulating structure special for automobile headlamp

A technology of LED light sources and automobile headlights, which is applied in the field of packaging structure of LED light sources for automobile headlights, can solve the problems of harsh headlight standards, harsh use environments, and not commonly used in automobile headlights, etc., and achieve clear Brightness cut-off line, low package thermal resistance, the effect of meeting the requirements of use

Inactive Publication Date: 2013-01-02
刘胜
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, high-brightness LEDs are mainly used in automobile taillights, signal lights and interior lighting, and are not commonly used in automobile headlights.
One of the main reasons is that the standard of automotive headlights is harsh and the use environment is harsh. At present, the packaging form of high-power LEDs cannot meet the special requirements of automotive headlights in terms of optical performance and thermal performance.

Method used

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  • Light-emitting diode (LED) light source encapsulating structure special for automobile headlamp
  • Light-emitting diode (LED) light source encapsulating structure special for automobile headlamp
  • Light-emitting diode (LED) light source encapsulating structure special for automobile headlamp

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Embodiment 1

[0025] Embodiments of the present invention are further described below in conjunction with the accompanying drawings:

[0026] The special LED light source package for automobile headlights of the present invention comprises a metallized thin film ceramic substrate 101, and the metallized thin film ceramic substrate 101 is composed of a bottom aluminum nitride substrate 1011 and an upper layer of metallized copper layer 1012; the LED chip 102 is installed On the packaging substrate, the packaging substrate of this embodiment is a metallized thin film ceramic substrate 101, and the LED chips 102 are arranged in a rectangular shape with a plurality of high-power blue light chips. The ×5 array is arranged on the metallized thin film ceramic substrate 101, the length of the rectangular area ranges from 1.5mm to 8mm, and the width ranges from 1mm to 4mm; the gold wire 103 connects 10 LED chips in two columns in series; the phosphor layer 104 covers On the LED chip 102, the phospho...

Embodiment 2

[0028] Embodiment 2 is the same as Embodiment 1, except that the packaging substrate of this embodiment is a double-sided copper-clad ceramic substrate DBC substrate 201 with high thermal conductivity. The bottom copper clad layer 2013 is composed; the LED chip 102 is arranged on the substrate 201 by 10 square high-power blue chips in a 2×5 array; the gold wire 103 connects the 10 LED chips in two columns in series; the phosphor layer 104 covers the chip 102; the packaging cover 105 has a rectangular hole 106 in the middle, so that the chip 102 and the fluorescent layer 104 are placed in it; and the DBC substrate 201 is provided with two fixing holes 207. see Figure 4 , Figure 5 , Figure 6 , Figure 7 .

Embodiment 3

[0030] The third embodiment is the same as the second embodiment, except that the copper layer on the bottom surface of the substrate in this embodiment is a steam chamber, and the substrate 201 with the steam chamber is composed of an alumina ceramic substrate 2011, an upper copper clad layer 2012 and a steam chamber. 3013, the steam chamber 3013 contains distilled water 30131, and a temperature sensor 3014 is integrated on the substrate 201 with the steam chamber; the LED chip 102 is arranged on the substrate 301 by 10 square high-power blue light chips in a 2×5 array; gold The wire 103 connects 10 LED chips in two columns in series; the phosphor layer 104 covers the chip 102; the packaging cover sheet 105 has a rectangular hole 106 in the middle, so that the chip 102 and the phosphor layer 104 are placed in it. see Figure 8 , Figure 9 , Figure 10 .

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Abstract

The invention discloses a light-emitting diode (LED) light source encapsulating structure special for an automobile headlamp. The structure comprises an encapsulating substrate, an LED chip, a fluorescent powder layer and an encapsulating cover sheet. The structure is characterized in that the LED chip is installed on the encapsulating substrate, the encapsulating cover sheet is posted on the encapsulating substrate, a rectangular hole is arranged on the encapsulating cover sheet, the LED chip is completely located in the rectangular hole, and the fluorescent powder layer is restricted in the rectangular hole which is located above the LED chip. The structure has the advantages that functions of work temperature detection, high temperature resistance and static electricity breakdown prevention are achieved, the structure is suitable for dipped headlights, headlights on full beam and fog lights, the luminance is high, the luminance cut-off line is clear, the encapsulating thermal resistance is low, and the structure can meet usage requirements of the automobile headlamp for the light source.

Description

technical field [0001] The invention relates to a medium and high-power LED packaging technology, in particular to a special LED light source packaging structure for automobile headlights. Background technique [0002] LED has many advantages such as energy saving, environmental protection, and long life, and has broad application prospects. Therefore, countries all over the world have invested a lot of manpower and material resources in related research and industrialization. In recent years, with the continuous breakthrough of high-power LED technology, the application field has been continuously expanded, and it has entered a large number of special lighting fields. Automotive lighting is one of the main application areas. In 2003, 15% of high-brightness LEDs were used in automobiles. However, at present, high-brightness LEDs are mainly used in automobile taillights, signal lights and interior lighting, and are not commonly used in automobile headlights. One of the main...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L33/64F21S8/10F21W101/10F21Y101/02
Inventor 刘胜陈飞王恺
Owner 刘胜
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