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A packaging structure and packaging process in which welding, bonding and sealing are completed simultaneously

A packaging technology and bonding technology, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve problems such as unfavorable heat dissipation of devices, many packaging process steps, and complicated packaging structure, so as to reduce packaging costs, facilitate operation, and reduce The effect of production costs

Active Publication Date: 2017-02-15
JIANGSU PROVINCE YIXING ELECTRONICS DEVICE GENERAL FACTORY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There is a gap between the chip and the cover plate, which is not conducive to the heat dissipation of the device; the packaging structure is complex, with many components; the packaging process has many steps, chip welding, wire bonding and sealing, and the packaging efficiency is low

Method used

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  • A packaging structure and packaging process in which welding, bonding and sealing are completed simultaneously
  • A packaging structure and packaging process in which welding, bonding and sealing are completed simultaneously
  • A packaging structure and packaging process in which welding, bonding and sealing are completed simultaneously

Examples

Experimental program
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Effect test

Embodiment 1

[0034] Embodiment 1: A packaging process in which welding, bonding and sealing are completed simultaneously, comprising the following steps:

[0035] Step (1), according to the size and specification requirements of the packaged chip, punch or etch the first terminal cover 1 and the second terminal cover 2, and electroplate the Ni-Au layer on the second terminal cover 2 ;

[0036] Step (2), using metallized co-firing or making porcelain parts to prepare through-cavity ceramics 5 through metallization treatment, and then electroless nickel plating on the upper and lower end faces of the prepared through-cavity ceramics 5; Provide better wettability for brazing;

[0037] In step (3), the first lead-out cover plate 1 and the sealing ring 7 are respectively brazed to the lower end surface and the upper end surface of the through-cavity ceramics with silver-copper solder, and electroplated with Ni-Au or Ni-Ag protective coating.

[0038] Step (4), welding one terminal of the two-...

Embodiment 2

[0042] Embodiment 2: a packaging process in which welding, bonding and sealing are completed simultaneously, comprising the following steps:

[0043] Step (1), according to the size and specification requirements of the packaged chip, punch or etch the first terminal cover 1 and the second terminal cover 2, and electroplate the Ni-Au layer on the second terminal cover 2 ;

[0044] Step (2), using metallized co-firing or making porcelain parts to prepare through-cavity ceramics 5 through metallization treatment, and then electroless nickel plating on the upper and lower end faces of the prepared through-cavity ceramics 5; Provide better wettability for brazing;

[0045] Step (3), brazing the first lead-out cover plate 1 and the sealing ring 7 to the lower end surface and the upper end surface of the through-cavity ceramics respectively by silver-copper solder, and electroplating a Ni-Au or Ni-Ag protective coating;

[0046] Step (4), first place the SAC305 solder 4 on the fir...

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Abstract

The invention discloses a packaging structure and a packaging technology capable of synchronously completing welding, bonding and sealing. The packaging structure comprises a ceramic through cavity, two leading-out terminal cover plate, a seal ring and a chip, wherein the ceramic through cavity is brazed to the first leading-out terminal cover plate through welding flux, the seal connecting ting is brazed to the upper surface of the ceramic through cavity, one end of the chip is welded to the first leading-out terminal cover plate of the inner cavity of the ceramic through cavity while the other end of the chip is welded to the second leading-out terminal cover plate through welding flux, and meanwhile the second leading-out terminal cover plate is welded to the seal ring through welding flux. The first leading-out terminal cover plate, the ceramic through cavity, the seal ring, the welding flux and the second leading-out terminal cover plate jointly form the airtight packaging structure. The packaging technology comprises that the chip is welded and bonded to the first and second leading-out terminal cover plates, and the second leading-out terminal cover plate and the seal ring are fused and welded together through the welding flux at a time, wherein welding, bonding and sealing processes are synchronously completed.

Description

technical field [0001] The invention relates to a packaging structure and a packaging process in which welding, bonding and sealing are simultaneously completed, and belongs to the technical field of microelectronic packaging. Background technique [0002] For a hermetic ceramic package with two terminals, a pin is usually brazed on the lower surface of the through-cavity ceramic, and a two-layer metal ring is brazed on the upper surface for wire bonding and sealing. There is also a pin at the same time; when packaging, the two-terminal chip is first welded to the lower pin of the through-cavity ceramic cavity, and then the other end of the chip is bonded to the metal by ultrasonic wedge welding with aluminum wire or thermosonic ball welding with gold wire. On the ring, and then the cover plate is packaged by parallel seam welding or alloy solder fusion sealing. There is a gap between the chip and the cover plate, which is not conducive to the heat dissipation of the device...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31H01L23/488H01L23/367H01L21/50H01L21/56H01L21/60
Inventor 马国荣邵训达徐睿源
Owner JIANGSU PROVINCE YIXING ELECTRONICS DEVICE GENERAL FACTORY
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