Preparation method of composite diamond fretsaw

Abstract

The invention relates to a preparation method of a composite diamond fretsaw, which comprises the following steps: 1, taking protogenetic diamond micro powder with the granularity of 5-45 Mu m and crushed diamond micro powder, mixing uniformly according to the proportion to obtain mixed diamond micro powder; taking the mixed powder of tungstic oxide powder and molybdenum powder as well as the mixed diamond micro powder, and mixing uniformly according to the proportion; 2, heating the product generated in step 1 and leading in rinsed hydrogen to form a diamond micro powder matrix / tungsten-molybdenum carbide interface / surface-metallized mixed diamond micro powder of tungsten-molybdenum alloy; and 3, taking electronickelling watt solution added with the surface-metallized mixed diamond micro powder as the electroplate liquid and taking a steel wire rope as a cathode to carry out the composite plating of metallized diamond and matrix nickel on the surface of the steel wire rope so as to obtain the composite diamond fretsaw of the invention. The invention has the advantages of simple process and easy operation, the prepared product has good edging performance, excellent wear-resisting compressive property, high processing speed and long service life, the utilization rate of the diamond fretsaw is high, the section flatness and the glossiness are high, the method is suitable for industrial production, and the prepared product is particularly suitable for the cutting processing with high efficiency, high quality and high cost performance on gems and other high-value materials.

Description

technical field [0001] The invention relates to a method for preparing a diamond wire saw, in particular to a method for preparing a composite diamond wire saw by using mixed electroplating of raw diamond and broken diamond after surface metallization treatment. The invention belongs to the technical field of surface deposition metal and surface electrochemical plating. Background technique [0002] Sapphire is a typical hard and brittle material with high hardness (Mohs hardness up to 9.2), high brittleness, high wear resistance, high corrosion resistance, high oxidation resistance, high resistivity, high temperature resistance, non-magnetic conductivity, etc. performance. LED (Light Emitting Diode) has been used in display screens, street lighting, etc. due to its excellent properties such as high brightness, low operating voltage, low power consumption, miniaturization, long life, impact resistance and stable performance, and is considered to have a wide range of applica...

AI Technical Summary

Problems solved by technology

[0004] At present, the main problem of diamond wire saw is that diamond particles are used in the preparation. Since diamond is a non-conductor, the process of sanding the electroplated nickel substrate is completed by the adsorption of diamond particles by steel wire, and the distribution of diamond is not uniform. At the same time, the diamond is electroplated. Severe agglomeration occurs, resulting in uneven wire size; diamond agglomeration will cause diamonds to be difficult to sharpen during the cutting process, resulting in low cutting efficiency; agglomeration is accompanied by the decline in the holding force of the coating on the agglomerated diamond during electroplating, making the use of diamond wire The service life is reduced; the diamond particles and the electroplated nickel layer are only mechanically combined, and the binding force is weak

At present, a single type of diamond micropowder is used in the preparation of electroplated diamond wire saws, which is difficult to meet the comprehensive performance requirements of sharpening, wear resistance, and damage resistance.

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