33results about How to "Reducing fabrication" patented technology

A wide-angle zoom lens with as few as two plastic elements codes the wavefront produced by the imaging system such that the imaging system is substantially invariant to aberrations related to misfocus. Signal processing is used to decode the wavefront to form the final image. A first type of zoom lens configuration uses as few as two lens elements. In this type, image processing may be modified to take into account the positioning of the lenses.

A micro-electronic package structure and a method for fabricating the same are proposed. A carrier is prepared and provided with a cavity for receiving at least one semiconductor chip having a plurality of electrical connection contacts. A dielectric layer is formed on the carrier, with the electrical connection contacts being exposed from the dielectric layer. A first circuit layer is formed on the dielectric layer and electrically connected to a portion of the electrical connection contacts of the chip. Another dielectric layer is formed on the first circuit layer and said dielectric layer, and a second circuit layer is formed on this dielectric layer and electrically connected to the rest of the electrical connection contacts of the chip and the first circuit layer by conductive vias, such that the chip is integrated into the carrier.

The invention provides a system and a method for improving the delivery of volatiles from a burning candle by providing a stabilized laminar gas flow adjacent a volatile-containing molten pool, ensuring an enlarged molten pool by close regulation of thermal transfer between a monolithic candle mass and the surrounding atmosphere, and minimizing volatile loss through unregulated thermal gradients.

A lighting panel capable of producing a “Starry Sky” lighting effect and which is easily retrofitted into existing aircraft includes a first substrate, a plurality of microminiature light sources, such as LEDs, mounted on an upper surface of the first substrate, a plurality of electrically conductive traces written on the upper surface of the first substrate so as to make electrical interconnections with respective leads of the light sources, a clear filler material surrounding each light source and tapering down to the upper surface of the first substrate so as to planarize it, and a flexible decorative film laminated over the upper surface of the first substrate and light sources, the decorative film containing a plurality of apertures therethrough, each corresponding in location to a respective light source.

A semiconductor device and manufacturing method are provided in which chippings are reduced even if they occur during dicing. At least edge portions of a chip and another surface are chamfered to have a slant surface having a chamfering slant angle θ, respectively, where 90°<θ<180°. Preferably, the chamfering slant angle θ is 100° to 135° or, alternatively, all of the chamfering slant angles of four sides of the chip are about 135°.

A lighting panel capable of producing a “Starry Sky” lighting effect and which is easily retrofitted into existing aircraft includes a structural panel, a plurality of inserts containing microminiature light sources, such as LEDs, mounted in openings in the panel, a plurality of electrically conductive traces written on the upper surface of the panel so as to make electrical interconnections with respective leads of the light sources, and a decorative film applied over a bottom surface of the panel and the light sources, the decorative film being translucent or transparent or containing a plurality of apertures therethrough, each corresponding in location to a respective one of the light sources.

A vacuum preventing device of a scroll compressor includes: a chamber formed at one side of a fixed scroll and having a suction pressure hole, a middle pressure hole and a discharge pressure hole communicating with a suction pressure zone, a middle pressure zone and a discharge pressure zone, each formed at a certain portion of an inner circumferential surface; an open and shut member installed inside the chamber and selectively communicating the discharge pressure hole and the suction pressure hole by virtue of a gas pressure of the middle pressure zone and an elastic force of a spring; and a gas leakage preventing unit for preventing a gas leakage in a normal operation by reducing a clearance between an inner wall of the chamber positioned at the side of the discharge pressure hole and the open and shut member.

The present invention relates to a side illumination lens and a luminescent device using the same, and provides a body, a total reflection surface with a total reflection slope with respect to a central axis of the body, and a linear and / or curved refractive surface(s) formed to extend from a periphery of the total reflection surface; and a luminescent device including the lens. According to the present invention, a lens with total internal reflection surfaces with different slopes, and a linear and / or curved refractive surface(s) allows light emitted forward from a luminescent chip to be guided to a side of the lens. Further, a linear surface(s) formed in a direction perpendicular or parallel to a central axis of a lens and a curved surface are formed on an edge of the lens so that a process of fabricating the lens is facilitated, thereby reducing a defective rate and fabrication costs of the lens.

A process for treating nitrogenous wastewater contains an autotrophic denitrification reaction, a heterotrophic denitrification reaction and a COD removal reaction simultaneously and mixedly taking place in a single reactor. The nitrification reaction is caused by nitrifying bacteria, in which ammonium is oxidized into nitrite. The autotrophic denitrification reaction is caused by autotrophic denitrifying bacteria, in which ammonium used as electron donor and nitrite used as electron acceptor are converted into nitrogen gas and nitrate. The heterotrophic denitrification reaction is caused by heterotrophic denitrifying bacteria, in which nitrate and COD are consumed. It is not necessary to build two separate reactors for aerobic nitrification and anaerobic denitrification, thereby effectively reducing the fabrication and operation cost.

A microstrip antenna having a slot structure is disclosed for providing a sufficient bandwidth so as to meet the antenna requirements. The microstrip antenna is composed of a base board (such as a printed circuit board) and a microstrip patch radiator having the slot structure, wherein the microstrip patch radiator is formed on the base board. The slot structure is composed of a T-shaped slot, an L-shaped slot and a reversed-L-shaped slot, wherein the L-shaped slot and the reversed-L-shaped slot are mirror-reflected to each other.

A method for fabricating a carrier structure integrated with a semiconductor element is proposed. First, a carrier having at least one opening therein is provided, and at least one semiconductor element is embedded in the opening. Then, a photosensitive insulating layer is formed on the carrier and filled into a gap between the opening of the carrier and the semiconductor element, such that the semiconductor element is fixed in the opening. Subsequently, the photosensitive insulating layer is patterned, and build-up circuits are formed on the semiconductor element. By such arrangement, the overall fabrication processes are simplified and the fabrication cost can be reduced.

A package structure is provided, which includes: a wafer having a surface with a groove, a thin film closing an open end of the groove and electrical contacts; a chip having a surface with a conductive layer and an opposite surface with a concave portion and a seal ring located at a periphery of the concave portion, the chip being disposed on the wafer with the seal ring surrounding the thin film and the electrical contacts located outside the seal ring; an encapsulant formed on the wafer for encapsulating the chip and the electrical contacts; a plurality of sub-conductive wires embedded in the encapsulant with one ends exposed from a top surface of the encapsulant and the other ends in electrical connection with the electrical contacts; and a through hole penetrating the wafer and communicating with the concave portion, thereby reducing the fabrication cost and size of the package structure.

A method for fabricating a coreless packaging substrate is provided, which includes: forming a dielectric layer on a conductive plate having a plurality of conductive pads; forming a circuit layer on the dielectric layer and forming in the dielectric layer a plurality of conductive vias that electrically connect the circuit layer and the conductive pads; and removing a portion of the conductive plate so as to cause the remaining portion of the conductive plate to form a plurality of conductive elements, thereby dispensing with a core layer and reducing the material and fabrication cost.

A microstrip antenna having a slot structure is disclosed for providing a sufficient bandwidth so as to meet the antenna requirements. The microstrip antenna is composed of a base board (such as a printed circuit board) and a microstrip patch radiator having the slot structure, wherein the microstrip patch radiator is formed on the base board. The slot structure is composed of an L-shaped slot and an inverted reversed-L-shaped slot, wherein the L-shaped slot and the inverted reversed-L-shaped slot are mirror-reflected to each other symmetrically to a point. One end of each of the L-shaped and inverted reversed-L-shaped slots is connected to an extension slot.

A modified mounting structure for a heat-dissipating device. The heat-dissipating device has a motor and a seat with a slot mounted on a base or the cover portion of a stator thereof. The seat secures a motor controller of the heat-dissipating device detecting phase changes of the magnetic poles of the motor. The structure of a heat-dissipating device reduces required components, manufacturing cost and assembly time, and the control circuit is greatly simplified.

The present invention relates to a side illumination lens and a luminescent device using the same, and provides a body, a total reflection surface with a total reflection slope with respect to a central axis of the body, and a linear and / or curved refractive surface(s) formed to extend from a periphery of the total reflection surface; and a luminescent device including the lens. According to the present invention, a lens with total internal reflection surfaces with different slopes, and a linear and / or curved refractive surface(s) allows light emitted forward from a luminescent chip to be guided to a side of the lens. Further, a linear surface(s) formed in a direction perpendicular or parallel to a central axis of a lens and a curved surface are formed on an edge of the lens so that a process of fabricating the lens is facilitated, thereby reducing a defective rate and fabrication costs of the lens.

An integrated circuit (IC) multilevel inductor structure is provided. The IC multilayer inductor structure is made from an IC including a plurality of circuit layers, where the inductor is a three-dimensional (3D) loop formed over a plurality of the circuit layers. In a simple example, if the IC includes a first circuit layer and a second circuit layer, then the inductor 3D loop includes a first partial loop portion formed on the first circuit layer, a second partial loop portion formed on the second circuit layer, and a via connecting the first and second partial loop portions. More generally, the inductor typically includes a plurality of 3D loops. A first plurality of 3D loops is formed between the input and an nth circuit layer, and a second plurality of 3D loops is formed between the nth circuit layer and the output.

A microstrip antenna having a slot structure is disclosed for providing a sufficient bandwidth so as to meet the antenna requirements. The microstrip antenna is composed of a base board (such as a printed circuit board) and a microstrip patch radiator having the slot structure, wherein the microstrip patch radiator is formed on the base board. The slot structure is composed of an L-shaped slot and an inverted reversed-L-shaped slot, wherein the L-shaped slot and the inverted reversed-L-shaped slot are mirror-reflected to each other symmetrically to a point. One end of each of the L-shaped and inverted reversed-L-shaped slots is connected to an extension slot.

A modified mounting structure for a heat-dissipating device. The heat-dissipating device has a motor and a seat with a slot mounted on a base or the cover portion of a stator thereof. The seat secures a motor controller of the heat-dissipating device detecting phase changes of the magnetic poles of the motor. The structure of a heat-dissipating device reduces required components, manufacturing cost and assembly time, and the control circuit is greatly simplified.

A lens fabrication apparatus includes: a lens mold having a connection portion formed on one side thereof and disposed on a light emission surface of a light emitting unit; and a vacuum forming unit discharging air from within the lens mold to the outside through the connection portion or injecting a material into the lens mold through the connection portion.

A semiconductor package and a fabrication method thereof are provided. The fabrication method includes the steps of preparing a chip having a plurality of conductive bumps formed on an active surface thereof; preparing a tape having a first surface and an opposed second surface, wherein the tape has a plurality of through holes at positions corresponding to the conductive bumps; forming an adhesive layer on the first surface of the tape, and disposing a plurality of leads on the second surface of the tape, so as to make an end of each of the leads covers a corresponding through hole; mounting the active surface of the chip to the adhesive layer on the first surface of the tape and allowing each of the conductive bumps to be received in a corresponding through hole; and performing a heat pressing process to bond the ends of the leads to the conductive bumps in the corresponding through holes. Thereby, an over-temperature problem that occurs during a heat pressing process in the conventional packaging technology can be solved.