The invention discloses a
wafer double-side scrubbing facility which comprises a box body, a material moving
assembly, overturning assemblies and
processing assemblies, wherein the material moving
assembly, the overturning assemblies and the
processing assemblies are located in the box body. Each overturning
assembly comprises an overturning motor, an overturning clamping air cylinder driven by the overturning motor and a clamping block located at the moving end of the overturning clamping air cylinder, wherein a clamping groove is formed in each clamping block. Each
processing assembly comprises a scrubbing part and a spin-
drying part. Each scrubbing part comprises a scrubbing box body, a suction disc located in the scrubbing box body, a scrubbing driving motor located at the bottom of the suction disc and a scrubbing head located in the scrubbing box body. Each spin-
drying part comprises a spin-
drying box body, a positioning disc located in the spin-drying box body and a spin-drying driving motor located at the bottom of the positioning disc. According to the
wafer double-side scrubbing facility, double-side scrubbing of a
wafer is achieved, the manpower consumption is reduced, the scrubbing efficiency is improved, the wafer cannot be damaged, the scrubbing effect is guaranteed, and the subsequent usage of the wafer cannot be affected.