The invention belongs to the technical field of printed circuit boards (PCBs), in particular discloses a
machining process of a half-pore plate, which mainly adopts a wet film pore plugging method and specifically comprises the steps of: manufacturing a pore plugging template, carrying out wet film pore plugging, baking the board, routing, retreating a film,
etching and the like. Through pore plugging, ink and the half-pore plate can form an integer, pore
copper on the pore wall is placed between the ink and a board pore plate body, thus the pore
copper can be better protected in a routing process so that the pore
copper is not easy to generate pore wall copper
skin tilting and flash residual, even if less quantity of copper
skin tilting and flash residual is generated, the copper tilting and the flash residual can be removed through
etching. Therefore, by adopting the invention, the pore wall copper
skin tilting and the flash residual of a semi-metallization groove or pore can be effectively improved.