1477results about "Mechanical control devices" patented technology

A wafer-processing apparatus includes: eight or ten reactors with identical capacity for processing wafers on the same plane, constituting four or five discrete units, each unit having two reactors arranged side by side with their fronts aligned in a line; a wafer-handling chamber including two wafer-handling robot arms each having at least two end-effectors; a load lock chamber; and a sequencer for performing, using the two wafer-handling robot arms, steps of unloading / loading processed / unprocessed wafers from / to any one of the units, and steps of unloading / loading processed / unprocessed wafers from / to all the other respective units in sequence while the wafers are in the one of the units.

A device for fabricating a composite article having a plurality of material dispensers to increase productivity. The device includes a structure defining a work surface datum, the plurality of material dispensers which are movable relative to the structure, where each of the material dispensers applies a strip material to the work surface datum along a predetermined axis, and wherein each of said predetermined axes are parallel to one another and where the strip material as applied to the work surface datum forms a layer. A method for fabricating a composite in accordance with the present invention is also provided.

An apparatus and method for separating a semiconductor die (303) from an adhesive tape (32) are disclosed. The apparatus includes a blade (34) mechanically coupled to a blade holder (36), wherein the blade (34) is inclined relative to the primary surface of the semiconductor die (303). The method further comprises lifting the semiconductor die (303) while it is attached to the adhesive tape (32) to assist disengagement. The blade (34) facilitates peeling of the semiconductor die (303) from the adhesive tape (32) while distributing stress exerted on the semiconductor die (303) over a larger surface area resulting in reduced die fractures (20).

A replaceable tow alignment path kit for a tow placement device may include a tow alignment tray to guide a predetermined width of tow along a tow path of a tow placement head. The tow alignment tray may include a channel having a width corresponding to the predetermined width of tow and a connector to releasably engage the tow placement head.

Systems and methods for applying a web material to substrates are disclosed. In one example, there is provided a single first drive that may be coupled to a feed mechanism, a vacuum roll, and a rotary knife such that the respective peripheral speed of the feed mechanism, the vacuum roll, and the rotary knife is adjustable to provide a cut web material length that is in registry with a predetermined location on the substrate. In another example, there is disclosed a method that involves detecting a substrate to which a length of web material can be applied, and initiating introduction of a web material into a feed mechanism only if the substrate is detected. Another example includes introducing a web material traveling at a predetermined speed onto a vacuum roll that is positioned near a rotary knife, and rotating the rotary knife at a peripheral speed that is substantially the same as the predetermined speed of the web material traveling on the vacuum roll.

An apparatus for applying a cutting edge tape or a reinforcing tape to a substrate by feeding and cutting lengths of tape and advancing the lengths to a vacuum wheel applicator, the feed section of the apparatus comprising a feed roll, an anvil vacuum roll, and a rotary knife adjacent to the anvil vacuum roll, and means for adjusting the speed of the feed roll and the speed of the anvil vacuum roll to vary the length of the tape advanced to the applicator.