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31 results about "Tone burst" patented technology

H-Bridge pulse generator

Electronic circuitry for high-power, high-frequency excitation of electromagnetic acoustic transducers (EMAT) without the use of a matching transformer is described. This circuit contains a least 4 switching devices such as power Mosfet transistors, arranged in an H-Bridge configuration that are designed to drive various EMATs over a wide range of frequencies. The switching devices can be connected in parallel with respect to the H-Bridge and switched in sequence for greater power output and variety of wave forms. This circuit configuration can provide a many excitation waveforms including, Churp, Hemming window tone burst, rectangular tone burst and Barker Code wave forms.
An improved electronic pulser circuit based on the H-bridge topology is designed for driving the sensor coils of an electromagnetic acoustic transducer (EMAT) to correct the disadvantages of conventional H-bridge pulsers and pulsers that require the use of an output transformer. A plurality of switching devices, primarily power Mosfets, are connected in parallel and augmented with support circuitry to provide improved performance in terms of increased power output, stability, reduced noise and complex output wave forms. This improved design provides for the application of modulated pulses such as multi-pulse, multi-frequency tone bursts of peak power outputs in excess of 20 thousand watts and frequencies in excess of 10 thousand Hertz.
Owner:SMITH STEPHEN

Double-interface ultrasonic detection imaging method for cased well

InactiveCN102128029AIncrease echoEffective detection and evaluation of bonding qualitySurveySonificationElectrical impulse
The invention relates to a double-interface ultrasonic detection imaging method for a cased well. In the method, a frequency-adjustable tone burst / electric pulse-excited broadband transducer is used; the control excitation frequency is the case thickness resonant frequency; under the excitation action of electric pulses, the transducer radiates narrowband ultrasonic pulses; the narrowband ultrasonic pulses perpendicularly enter the wall of the well and radially pass through each medium layer; simultaneously, each interface layer produces a reflection echo; the received echo is processed; the double-interface echo is separated to obtain double-interface bonding information; and when carrying out multi-point measurement and scanning on the wall of the case, the transducer can obtain double-interface bonding characteristic images. Compared with the prior art, the invention overcomes the disadvantage that the present ultrasonic pulse echo logging instrument and other logging instruments can not detect the double-interface bonding defects; and by separating the double-interface echo in the received signal, the invention can obtain the double-interface cement bonding quality images, andcan simultaneously obtain the detection result in the traditional pulse echo logging process.
Owner:TONGJI UNIV

Electromagnetic ultrasonic metal material thickness measurement method

The invention provides an electromagnetic ultrasonic metal material thickness measurement method, which belongs to the field of metal material thickness measurement. The electromagnetic ultrasonic metal material thickness measurement method aims to avoid problems of low efficiency of electromagnetic ultrasonic energy conversion, unfixed occurrence moments of peak points of electromagnetic ultrasonic echoes and low thickness measurement accuracy. The specific electromagnetic ultrasonic metal material thickness measurement method comprises the steps that: an electromagnetic ultrasonic emitting tone burst pulse string and an electromagnetic ultrasonic receiving echo pulse string each comprises pulse signals of two or more kinds of frequencies, each pulse string comprises N1 consecutive pulse signals of frequency f1, N2 consecutive pulse signals of frequency f2, ...and Ni consecutive pulse signals of frequency fi, and N1 is greater than or equal to 1, N2 is greater than or equal to 1, and Ni is greater than or equal to 0; the time of a first cyclic wave cyclic wave initial zero-crossing point A or an initial peak point B of the pulse string of frequency f1 is obtained according to sequences of emission time and reception time, the time interval between the time of the first cyclic wave cyclic wave initial zero-crossing point A or the initial peak point B and the time of an initial emission point is the ultrasonic transmission time, and the thickness of metal materials is obtained through calculation. The electromagnetic ultrasonic metal material thickness measurement method is used for detecting thickness of metal materials.
Owner:HARBIN INST OF TECH

Apparatus to produce acoustic cavitation in a liquid insonification medium

An apparatus to produce acoustic cavitation by controlling cavitation events in a liquid insonification medium utilizing a waveform to excite a transducer with a series of bipolar inharmonic tone bursts having medium recovery intervals between respective bursts so that the medium repeatedly recovers from cavitation events between bursts. The apparatus may be used to clean a semiconductor wafer, to de-coat a painted surface having, to induce a chemical reaction, and / or to provide recycled paper made from inked paper de-inked by cavitation. Cavitation events are generated using a transducer and a waveform generator, e.g., square wave tone bursts, to excite the transducer with a signal controlled in frequency, burst repetition rate, duty-cycle and / or amplitude, e.g., utilizing bursts having a frequency between 500 KHz and 10 MHz, and a duty cycle between 0.1% and 70%.
Owner:OVIVO SWITZERLAND AG

Piezoelectric wafer eigenfrequency measurement method

The invention relates to a piezoelectric wafer eigenfrequency measurement method. The method comprises the following steps: (1) arranging a measurement device including a function generator, a piezoelectric wafer and a digital oscilloscope; (2) starting the function generator to generate Tone-Burst sine wave signals with a certain period number, conducting electric pulse excitation to the piezoelectric wafer by the function generator at a frequency f, stopping the electric pulse excitation to the piezoelectric wafer when the function generator completes the period number, enabling the piezoelectric wafer to start vibrating freely, and collecting the free vibration signal between two electrodes of the piezoelectric wafer by the digital oscilloscope; (3) adjusting the digital oscilloscope to amplify the free vibration signal between the two electrodes of the piezoelectric wafer in the step (2), and processing the amplified signal by fast Fourier transform; (4) extracting the frequency of the peak on the spectrogram obtained by Fourier transform in the step (3) to obtain the eigenfrequency of the piezoelectric wafer to be tested; and (5) changing the frequency f of the function generator in the step (2), repeating the step (3) and step (4), and measuring each eigenfrequency of the piezoelectric wafer.
Owner:CHINA NAT OFFSHORE OIL CORP +1

Double-interface ultrasonic detection imaging method for cased well

InactiveCN102128029BIncrease echoEffective detection and evaluation of bonding qualitySurveySonificationElectrical impulse
The invention relates to a double-interface ultrasonic detection imaging method for a cased well. In the method, a frequency-adjustable tone burst / electric pulse-excited broadband transducer is used; the control excitation frequency is the case thickness resonant frequency; under the excitation action of electric pulses, the transducer radiates narrowband ultrasonic pulses; the narrowband ultrasonic pulses perpendicularly enter the wall of the well and radially pass through each medium layer; simultaneously, each interface layer produces a reflection echo; the received echo is processed; the double-interface echo is separated to obtain double-interface bonding information; and when carrying out multi-point measurement and scanning on the wall of the case, the transducer can obtain double-interface bonding characteristic images. Compared with the prior art, the invention overcomes the disadvantage that the present ultrasonic pulse echo logging instrument and other logging instruments can not detect the double-interface bonding defects; and by separating the double-interface echo in the received signal, the invention can obtain the double-interface cement bonding quality images, andcan simultaneously obtain the detection result in the traditional pulse echo logging process.
Owner:TONGJI UNIV

Methods and apparatus for detecting defects in an object of interest

A method for detecting defects in an object of interest comprises applying an ultrasonic signal including a tone burst having a predetermined frequency and number of cycles into an object of interest, receiving a return signal reflected from the object of interest, and processing the return signal to detect defects in the at least one inner material. The object may have an outer material and at least one inner material that have different acoustic impedances. An ultrasonic sensor system includes an ultrasonic sensor configured to generate an ultrasonic signal having a tone burst at a predetermined frequency corresponding to a resonant frequency of an outer material of an object of interest.
Owner:NORTHROP GRUMMAN SYST CORP

Method for measuring ultrasonic nonlinearity generated by high-voltage pulser

InactiveCN109196347APurely nonlinear parameters can be determinedEffective Health Maintenance ManagementAnalysing solids using sonic/ultrasonic/infrasonic wavesUltrasonic/sonic/infrasonic wave generationHarmonicFundamental frequency
The present invention relates to a method for measuring ultrasonic nonlinearity generated by a high-voltage pulser. More specifically, the method comprises: a calibration step for transmitting and receiving an ultrasonic signal to / from an object to be inspected having a reception probe attached thereto, the calibration step being performed by a receiving unit; a harmonic measurement step for transmitting a tone burst signal to the object to be inspected having a transmission / reception probe attached thereto, and receiving a tone burst signal that has passed through the object to be inspected,the harmonic measurement step being performed by the receiving unit; a harmonic measurement step for transmitting a tone burst signal to the object to be inspected having a transmission probe attachedthereto, and receiving the transmitted tone burst signal, the harmonic measurement step being performed by a transmitting unit; a calibration step for transmitting and receiving an ultrasonic signalto / from the object to be inspected having the transmission probe attached thereto, the calibration step being performed by the transmitting unit; and a step for measuring the ultrasonic nonlinearity of the object to be inspected by comparing fundamental frequency and harmonic components measured by the receiving unit and fundamental frequency and harmonic components measured by the transmitting unit.
Owner:IUCF HYU (IND UNIV COOP FOUND HANYANG UNIV)

Piezoelectric wafer eigenfrequency measurement method

The invention relates to a piezoelectric wafer eigenfrequency measurement method. The method comprises the following steps: (1) arranging a measurement device including a function generator, a piezoelectric wafer and a digital oscilloscope; (2) starting the function generator to generate Tone-Burst sine wave signals with a certain period number, conducting electric pulse excitation to the piezoelectric wafer by the function generator at a frequency f, stopping the electric pulse excitation to the piezoelectric wafer when the function generator completes the period number, enabling the piezoelectric wafer to start vibrating freely, and collecting the free vibration signal between two electrodes of the piezoelectric wafer by the digital oscilloscope; (3) adjusting the digital oscilloscope to amplify the free vibration signal between the two electrodes of the piezoelectric wafer in the step (2), and processing the amplified signal by fast Fourier transform; (4) extracting the frequency of the peak on the spectrogram obtained by Fourier transform in the step (3) to obtain the eigenfrequency of the piezoelectric wafer to be tested; and (5) changing the frequency f of the function generator in the step (2), repeating the step (3) and step (4), and measuring each eigenfrequency of the piezoelectric wafer.
Owner:CHINA NAT OFFSHORE OIL CORP +1
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