Technical method for alloying surface of pure copper based plates

Abstract

This invention relates to a process for surface-alloying pure Cu plate. The process comprises: adopting a vibrational pellet-roller, placing surface-polished pure Cu plate in the pellet-rolling chamber of the pellet-roller, utilizing bearing alloy rolling pellets (8 mm in diameter), knocking the surface of the pure Cu plate by irregular jumping and rolling of the rolling pellets under Ar protection with 3000 / min vibration frequency, and permeating the bearing alloy molecules into the surface of the pure Cu plate to achieve surface-alloying of the pure Cu plate. The alloy layer has no interface with the Cu matrix, thus such phenomena as cracking, crimping and flaking do not occur. The alloyed surface has Cr content of 8.51% and Fe content of 80.99%, and has improved surface strength and hardness (3.2 GPA). After annealing, the inner structure is compact and stable. The method has such advantages as few devices, simple process and no pollution.

Description

technical field [0001] The invention relates to a process method for surface alloying of a pure copper substrate, belonging to the technical field of crystal grain nanometerization and alloying methods on the surface of a nonferrous metal copper substrate. Background technique [0002] Nanomaterials are composed of crystals, quasicrystals, and non-crystals. The size of the basic unit in the one-dimensional direction is less than 100nm. It exists in metal materials, inorganic materials, and polymer materials. The atoms in nanocrystals are located in the lattice positions and On the grain boundary, nanocrystalline materials have high-density interfaces. In nanocrystalline metals with a grain size of 1-10nm, the grain boundary density can reach 10 25 m -3 , due to the ultra-fine crystal grains, a large number of atoms are on the grain boundary between the crystal grains, showing a series of excellent physical properties, mechanical properties and mechanical properties, such as...

AI Technical Summary

Problems solved by technology

[0003] Metal nanomaterials are the most eye-catching new materials in machinery manufacturing and high-tech fields. There are many kinds of metal nanomaterials used in ferrous metals and nonferrous metals. Among nonferrous metals, pure copper sheet is the most commonly used nonferrous metal. , because of its good electrical conductivity and corrosion resistance, it is often used by the mechanical and electronic industry as the first choice, but because of its soft texture, low strength, low hardness, and poor oxidation resistance, it is often subject to great limitations in industrial applications. Used as a high-strength material, the surface hardness is low and the strength is low, and it is impossible to make high-strength products

[0004] Due to the limitations of the mechanical properties of pure copper sheets, it has attracted great attention from the scientific and technological circles. In order to improve the surface strength, hardness, and oxidation resistance of pure copper sheets, various processes are used to improve their mechanical properties, such as electroless plating, electron beam, and laser. Introduce the beam into the metal surface to modify it, as well as vapor deposition, thermal spraying, sol-gel method, etc., to improve the corrosion resistance, wear resistance and mechanical and physical properties of pure copper sheets, but these methods are not ideal. All have technical deficiencies, some complex equipment, long process cycle, serious pollution, large energy consumption, high processing cost, and none of them can greatly change the surface strength, hardness and surface microstructure of pure copper sheets.

[0005] In the research of pure copper plate alloying, some also use a two-step method. First, surface nanometerization is carried out on the surface of the copper substrate, and then the surface alloying is carried out. surface alloying treatment on the basis of surface nanonization, the process procedure is more complicated, which not only increases the working steps and working time, but also makes the surface alloying program incoherent, and also forms a new interface on the surface, causing Cracking, peeling, peeling and other phenomena increase the process of alloying the copper substrate surface, and the alloying effect is not ideal

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