Teater

A technology for processing devices and gases, applied in the direction of gaseous chemical plating, cleaning methods and utensils, coatings, etc.

Inactive Publication Date: 2005-05-25
USHIO DENKI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0018] As described above, as a processing device for irradiating vacuum ultraviolet light without using oxygen, there are known techniques for replacing the object to be irradiated and the reactive gas, or laminating on the object to be irradiated, but in the processing device for irradiating vacuum ultraviolet light, For example, cleaning of organic matter is impossible without the use of oxygen

Method used

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Embodiment 1

[0055] The processing device of the present invention such as figure 1 shown. figure 1 It is a schematic cross-sectional view of the processing apparatus of the present invention cut along a plane perpendicular to the electrode axis of the cylindrical electrodes 3a, 3b, and 3c. The treatment device 11 is composed of a discharge vessel 1 and a treatment space 2, and between the discharge vessel 1 and the discharge vessel 2, an MgF 2 The light-taking window 7 that constitutes. For generating Ar from the discharge vessel 1 with a maximum wavelength value of 126nm 2 For excimer light, the electrodes 3a, 3b, and 3c for dielectric barrier discharge arranged in the discharge vessel 1 are electrically connected to the power supply 5 for discharge, and the electrodes 3a, 3b, and 3c are arranged on the inside of the quartz glass tube as a dielectric, for example, And apply high frequency and high voltage between the electrodes. In this embodiment, the light source is composed of t...

Embodiment 2

[0060] figure 2 Example 2 in the present invention is shown. figure 2 It is a schematic sectional view cut on a plane perpendicular to the lamp tube axis of the excimer ultraviolet lamp 21; in this embodiment 2, the figure 1 Ar produced by the wavelength maximum of 126nm in 2 A light source composed of excimer light discharge space 1, etc., replaced with Xe 2 Excimer UV lamp. Specifically, the processing device 20 is composed of a lamp chamber 21 and a processing space 22 , and a light-taking window 27 is arranged between the lamp chamber 21 and the processing space 22 . Xe is disposed inside the lamp house 21 2 excimer UV lamp 23, the Xe 2 The excimer ultraviolet lamp 23 is used as a discharge vessel, coaxially configured with an outer diameter of 26 mm and a wall thickness of 1 mm and an outer diameter of 16 mm and an inner tube of 1 mm. The space between the outer tube and the inner tube , Xe sealed with Xe gas at 53.3Kpa 2 Excimer UV lamp23. The Xe 2 The excime...

Embodiment 3

[0063] image 3 Example 3 of the present invention is shown. image 3 It is a schematic cross-sectional view cut along a plane perpendicular to the electrode axes of the cylindrical electrodes 3a, 3b, and 3c. In the processing device 40 in the third embodiment, the light-trapping window in the first embodiment is removed, the supply direction of the discharge gas is set above the object 9 to be irradiated, and the discharge plasma 4b is pinched between the inlets. The discharge gas for light generation is supplied from the discharge gas inlets 36a and 36b, and the ammonia NH 3 Introduction port 10a, supply ammonia NH 3 . As the ammonia gas supplied here, a gas diluted with nitrogen or argon can also be used. In this treatment device, discharge gas, ammonia NH 3 , and gas generated by decomposition of, for example, organic substances scattered from the surface of the object to be processed, are discharged from the discharge port 10b. In this embodiment, the light source i...

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Abstract

The subject of the invention is to enable a treatment in which a sufficient treatment speed is not obtained by the treatment by activated oxygen, such as the ashing, removal or the like of an ion-implanted resist in treatment equipment, and which differs from the treatment by activated oxygen in conventional devices, inhibits the effect of oxidation to an article to be treated and utilizes vacuum ultraviolet rays. To solve the problem, the treatment equipment is provided with a light source emitting vacuum ultraviolet rays and a discharge vessel and / or a treatment space with the light source, and an introducing port introducing a gas activated by the irradiation of a light is arranged in the treatment equipment. In the treatment equipment, NmHn (N represents a nitrogen atom, H a hydrogen atom and (m) and (n) are arbitrary natural numbers) is used as the activated gas. The treatment equipment is characterized in having an irradiating means of vacuum ultraviolet rays emitted from the light source for being imparted to the NmHn gas.

Description

technical field [0001] The present invention relates to a processing device utilizing vacuum ultraviolet light. Specifically, it relates to a processing device that activates the processing gas by irradiating vacuum ultraviolet light to the processing gas so that the processing gas acts on the object to be processed, and can be used for surface modification, dry cleaning, resist, etc. Processing equipment in the ashing / removal of silicon, etching of silicon surfaces, etc. Background technique [0002] Conventionally, processing apparatuses for processing using vacuum ultraviolet light have been widely used in various fields such as surface modification, dry cleaning, and ashing / removal of resists. Roughly distinguishing these treatment devices, there are cases where the object to be irradiated is treated by directly irradiating the vacuum ultraviolet light to cause a photochemical reaction, etc., and the vacuum ultraviolet light is irradiated to oxygen molecules to generate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/304H01L21/302H01L21/3065C23C16/48C23C8/06B08B7/00H01L21/461
CPCH01L21/67028
Inventor 松野博光菱沼宣是菅原宽
Owner USHIO DENKI KK
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