Aluminum alloy surface carbon-based composite coating and preparation method thereof
A technology of aluminum alloy surface and composite coating, applied in metal material coating process, coating, ion implantation plating, etc., can solve the problem of poor bearing capacity, large difference in modulus and thermal expansion coefficient, and poor adhesion of DLC layer and other problems, to achieve the effect of improving bearing capacity, improving plastic deformation resistance, and improving high stress
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Embodiment 1
[0040] The carbon-based coating structure is:
[0041] (1) Deposit a bonding layer Ti with a thickness of 800nm and a grain size of 5-10nm;
[0042] (2) Depositing a support layer Si with a thickness of 1500nm;
[0043] (3) Depositing a catalytic layer Ti with a thickness of 100nm and a grain size of 100-120nm;
[0044] (4) Deposit the functional layer DLC with a thickness of 1000 nm.
[0045] The preparation process is as follows: (1) put the cleaned aluminum alloy substrate into a vacuum chamber for plasma etching, the plasma etching conditions are: under an argon environment, power 300W, air pressure 3mTorr; deposit a bonding layer on its surface, the The bonding layer is a Ti layer, and the deposition conditions of the bonding layer are: adopt high-power pulse magnetron sputtering technology, pulse voltage 400V, argon gas pressure 3mTorr; (2) deposit a supporting layer on the bonding layer obtained in the previous step, the supporting layer Si layer, the deposition co...
Embodiment 2
[0048] The carbon-based coating structure is:
[0049] (1) Deposit a bonding layer Ti with a thickness of 950nm and a grain size of 10-15nm;
[0050] (2) Depositing a support layer Si with a thickness of 1800nm;
[0051] (3) Depositing a catalytic layer Ti with a thickness of 120nm and a grain size of 120-150nm;
[0052] (4) Deposit the functional layer DLC with a thickness of 1200nm.
[0053] The preparation process is as follows: (1) put the cleaned aluminum alloy substrate into a vacuum chamber for plasma etching, the plasma etching conditions are: under an argon environment, power 400W, air pressure 8mTorr; deposit a bonding layer on its surface, the The bonding layer is a Ti layer, and the deposition conditions of the bonding layer are: adopt high-power pulse magnetron sputtering technology, pulse voltage 700V, argon gas pressure 6mTorr; (2) deposit a support layer on the bonding layer obtained in the previous step, the support layer Si layer, the deposition condition ...
Embodiment 3
[0056] The carbon-based coating structure is:
[0057] (1) Deposit a bonding layer Ti with a thickness of 1000nm and a grain size of 15-20nm;
[0058] (2) Depositing a support layer Si with a thickness of 2000nm;
[0059] (3) Depositing a catalytic layer Ti with a thickness of 200nm and a grain size of 120-200nm;
[0060] (4) Deposit the functional layer DLC with a thickness of 1500 nm.
[0061] The preparation process is as follows: (1) put the cleaned aluminum alloy substrate into a vacuum chamber for plasma etching, the plasma etching conditions are: under an argon environment, power 500W, air pressure 10mTorr; deposit a bonding layer on its surface, the The bonding layer is a Ti layer, and the deposition conditions of the bonding layer are: adopt high-power pulse magnetron sputtering technology, pulse voltage 1000V, argon gas pressure 10mTorr; (2) deposit a support layer on the bonding layer obtained in the previous step, the support layer Si layer, the deposition condi...
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