High-corrosion-resistance flexible copper-clad plate and preparation method thereof

A flexible copper clad laminate, high corrosion resistance technology, used in flexible printed circuit boards, printed circuit manufacturing, manufacturing printed circuit precursors, etc., can solve the problem that the alloy layer is not crystallized, uniform, and corrosion resistance is not ideal. , the problem of low service life of flexible copper clad laminates, etc., to achieve the effect of improving service life, meticulous and close crystallization, and strong bonding force

Active Publication Date: 2021-11-23
江苏耀鸿电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The corrosion resistance of copper foil is achieved by forming galvanized or galvanized alloy on the surface of copper foil. General galvanized, galvanized nickel, zinc-tin and other alloy processes have the effect of corrosion resistance, but because the crystallization of the alloy layer is not fine and uniform , the corrosion resistance does not reach the ideal effect, resulting in edge corrosion when the copper foil circuit board etches high-precision lines, resulting in a lower service life of the flexible copper clad laminate

Method used

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  • High-corrosion-resistance flexible copper-clad plate and preparation method thereof
  • High-corrosion-resistance flexible copper-clad plate and preparation method thereof

Examples

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Embodiment 1

[0025] The invention provides a flexible copper-clad laminate with high corrosion resistance, which comprises an insulating substrate and a copper foil layer, a transition layer is provided between the insulating substrate and the copper foil layer, and a corrosion-resistant coating is provided on the outside of the copper foil layer. layer, the transition layer is an active electrode material layer, and the corrosion-resistant layer includes a galvanized layer and a nanometer coating.

[0026] In a preferred embodiment, the insulating substrate is an organic polymer film, and the organic polymer film is PI.

[0027] In a preferred embodiment, the active electrode material layer is Ni, and the thickness of the transition layer is 500 nm.

[0028] In a preferred embodiment, the thickness of the copper foil layer is 25um, the thickness of the galvanized layer is 400nm, and the thickness of the nano-coating layer is 250nm.

[0029] In a preferred embodiment, the nano-coating inc...

Embodiment 2

[0040] The invention provides a highly corrosion-resistant flexible copper-clad laminate. The nano-coating includes the following raw materials in weight percentage: 60% of nano-silicon dioxide, 20% of nano-titanium dioxide, 10% of polyaniline and 10% of polypyrrole.

Embodiment 3

[0042] Different from Examples 1 and 2, the present invention provides a flexible copper-clad laminate with high corrosion resistance, and the nano-coating includes the following raw materials in weight percentage: 45% of nano-silicon dioxide, 25% of nano-titanium dioxide, poly Aniline 15% and polypyrrole 15%.

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Abstract

The invention discloses a high-corrosion-resistance flexible copper-clad plate, and particularly relates to the technical field of flexible copper-clad plates. The high-corrosion-resistance flexible copper-clad plate comprises an insulating base material and a copper foil layer, a transition layer is arranged between the insulating base material and the copper foil layer, a corrosion-resistant layer is arranged on the outer side of the copper foil layer, the transition layer is an active electrode material layer, and the corrosion-resistant layer comprises a zinc coating and a nano coating. The zinc coating and the nano coating are arranged on the outer side of the copper foil layer, the auxiliaries are added during zinc plating on the outer side of the copper foil layer, and the auxiliaries comprise sodium dodecyl benzene sulfonate, polyethylene glycol, rare earth salt and arsenic trioxide, so that the corrosion resistance of the zinc coating can be improved while the zinc coating is formed, the crystal form of the zinc coating can be changed, the surface of the zinc coating is flat and uniform, crystals are fine and compact, the corrosion resistance of the zinc coating is improved, the corrosion resistance of the flexible copper-clad plate is improved, meanwhile, the wear resistance of the flexible copper-clad plate can be improved through the nano coating, and therefore the service life of the flexible copper-clad plate is prolonged.

Description

technical field [0001] The invention relates to the technical field of flexible copper-clad laminates, and more specifically, the invention relates to a flexible copper-clad laminate with high corrosion resistance and a preparation method thereof. Background technique [0002] Flexible copper clad laminate (FCCL) is the processing raw material for flexible circuit board (FPC). It contains at least two materials, one is an insulating substrate, such as polyimide (PI) film, liquid crystal polymer (LCP) film, etc.; the other is a metal conductor foil, mainly copper foil. The main preparation methods of flexible copper clad laminates are: pressing method, coating method, sputtering plating method, ion implantation plating method. Flexible copper clad laminates are widely used in aerospace equipment, navigation equipment, aircraft instruments, military guidance systems and mobile phones, digital cameras, digital video cameras, automotive satellite direction positioning devices, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/02
CPCH05K1/02H05K3/022H05K2201/05H05K2201/2009H05K2203/06H05K2203/0723H05K2203/07Y02E60/10
Inventor 吴海兵陈应峰
Owner 江苏耀鸿电子有限公司
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