Immersion cooling heat dissipation structure, radiator, heat dissipation system and manufacturing method of immersion cooling heat dissipation structure

Abstract

The invention discloses an immersion cooling heat dissipation structure, a radiator, a heat dissipation system and a manufacturing method of the immersion cooling heat dissipation structure. The immersion cooling heat dissipation structure comprises a boiling heat exchange unit, and the boiling heat exchange unit comprises a first surface and a second surface which are arranged back to back; a microstructure composed of a plurality of opposite convex parts and/or a plurality of opposite concave parts is distributed on the first surface, and the first surface is at least used for making contactwith an electrically insulating immersion cooling medium; the second surface is a smooth face and used for being attached to a heating element, or the second surface and the heating element are integrally arranged. The immersion cooling heat dissipation structure provided by the invention has the advantages of higher heat exchange area, more nucleation sites, stronger capillary fluid infusion capability, excellent boiling heat exchange performance, high heat transfer coefficient and critical heat flux density, low superheat degree of a nucleation boiling starting point and great advantages ina small-space high-heat-flux heat dissipation application scene; meanwhile, the manufacturing process is relatively flexible and controllable, the cost is low, industrial large-scale application canbe achieved, and the market competitiveness is high.

Description

technical field [0001] The invention relates to a high-efficiency heat transfer structure, in particular to an immersion cooling heat dissipation structure, a radiator, a heat dissipation system and a manufacturing method thereof, belonging to the technical field of micro-nano structure design and processing. Background technique [0002] In recent years, with the development of electronic chips towards integration, miniaturization, and high power, traditional heat dissipation technologies have become more and more difficult to meet the heat dissipation needs of small spaces and high heat flow. To solve this problem, immersion cooling technology came into being. This new technology directly immerses heating elements such as electronic chips into FC-72, Novec7100 and other organic working fluid coolants, and the coolant undergoes violent nucleate boiling on the chip surface to take away heat to achieve efficient electronic cooling. Aiming at the technical problems that the s...

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Problems solved by technology

Compared with directly sintering the porous metal coating on the smooth solid copper surface, this heat sink has relatively high heat dissipation performance, but its heat dissipation capacity is still difficult to meet the heat dissipation requirements of high heat flow heating elements such as higher power GPUs. When matching with 350W For the above GPU electronic chips, it is difficult to guarantee the consistency of product performance

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