Ultrathin soaking plate and manufacturing method thereof

Abstract

The invention discloses an ultrathin soaking plate and a manufacturing method thereof. The ultrathin soaking plate comprises a cover plate and a bottom plate, wherein the peripheral edge of the cover plate and the peripheral edge of the bottom plate are in sealed connection. A groove is formed in the inner surface of the cover plate so that a cavity in a vacuum state can be formed between the cover plate and the bottom plate. A plurality of protrusions arranged in an array manner are distributed in the cavity and located on the bottom face of the groove. The protrusions are hollow pillars formed in a pressing manner. The protrusions are connected with the cover plate and the bottom plate so that the protrusions can be supported between the cover plate and the bottom plate and used for heat transmission between the cover plate and the bottom plate. The outer walls of the protrusions serve as a medium for working fluid to flow towards the bottom plate from the cover plate when the working fluid is evaporated and condensed when encountering cold. The protrusions on the cover plate are in contact with the bottom plate and can support the cavity formed by the cover plate and the bottom plate and be used for heat transmission between the bottom plate and the cover plate; and the outer walls of the protrusions serve as the medium for the working fluid to flow towards the bottom plate from the cover plate when the working fluid is evaporated and condensed when encountering cold. By means of the ultrathin soaking plate and the manufacturing method of the ultrathin soaking plate, the thickness of the soaking plate can be reduced, the protrusions are formed in the pressing manner through a simple stamping technology, the manufacturing technology is simplified, the cost is low, and the ultrathin soaking plate is suitable for large-scale production.

Description

technical field [0001] The invention relates to a soaking plate, in particular to an ultra-thin soaking plate, and also to a manufacturing method of the ultra-thin soaking plate. Background technique [0002] The calculation speed of today's electronic products is getting faster and faster, but at the same time, the size of the products is required to be as small as possible. Smartphones, in particular, are getting thinner and thinner, constantly challenging the limit of thickness, which requires a lot of heat to be dissipated in the limited space in the phone. [0003] At present, the materials with the best heat transfer efficiency are heat pipes or vapor chambers with liquid phase change heat transfer. The thermal resistance of the liquid phase change heat transfer heat pipe is tens or even hundreds of times lower than that of metal copper or aluminum materials, and it is the best heat dissipation component in today's electronic products. Vapor chambers are more efficie...

AI Technical Summary

Problems solved by technology

[0005] However, both the inner surface of the cover and the bottom of the traditional vapor chamber require sintered copper powder porous structure, and at the same time, the central cavity should be reserved as a channel for vapor diffusion, in order to connect the cover and bottom, and to promote the return of liquid from the condensation surface to the evaporation Special support structures and capillary columns also need to be set up on the surface. In this way, not only the manufacturing process is complicated, but also because of the special support structure and capillary columns, the vapor chamber is thicker and the manufacturing process is complicated.

Therefore, the conventional structure and manufacturing method of the chamber determine that it is difficult to further reduce the thickness of the chamber, and the minimum thickness that the existing chamber can achieve is 0.6mm

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