Preparation method of multilayer-polymer surface functional modified electronic fiber cloth flexible high-frequency CCL (copper-clad laminate)

Abstract

The invention provides a multilayer-polymer surface functional modified electronic fiber cloth flexible high-frequency CCL (copper-clad laminate) and a preparation method thereof. The high-frequency CCL comprises a graphene oxide metallized reinforced nanofiber layer located in the middle layer and conductive high-molecular polymer-insulating high-molecular polymer copolymer coated electronic fiber cloth layers located on two sides. The multilayer-polymer surface functional modified electronic fiber cloth flexible high-frequency CCL has three layers of thin films including the graphene oxide metallized reinforced nanofiber layer which is located in the middle layer and switched between a crystalline metal oxide form and an amorphous metal microform and the polymer copolymer coated electronic fiber cloth layers which are located on the two sides of the graphene oxide metallized reinforced nanofiber layer and have amorphous-state and crystal-state microstructures, the three layers of thin films are subjected to press fit with first copper foil and second copper foil located on the outer layer finally, and the high-frequency CCL which has good tensile property, elasticity modulus andbending strength, is capable of effectively resisting ultraviolet light and increasing light transmittance and has good bonding strength with the copper foil and lower stripping strength is prepared.

Description

technical field [0001] The invention belongs to the technical field of high-frequency copper-clad laminates, and in particular relates to a method for preparing a flexible high-frequency copper-clad laminate with multi-layer polymerized surface functionally modified electronic fiber cloth. Background technique [0002] With the rapid development of information science and technology, the market demand for various electronic consumer products with high-speed information processing functions is strong, and higher technical requirements are constantly put forward, such as high-speed information transmission, integrity, multi-functionality and miniaturization of products, etc. , thus promoting the continuous development of high-frequency high-speed application technology. Modern electronic products tend to be miniaturized and multi-functional, which requires high-frequency copper clad laminates (PCB boards) to achieve high density and high performance. Special structural boards...

AI Technical Summary

Problems solved by technology

As a polyimide film (PI film) that mainly enhances flexibility, such as Chinese patent 201010621313.0, the flexible copper clad laminate made by using it has a high glass transition temperature, which is not suitable for rigid-flexible transition at room temperature. And the light transmittance and ultraviolet light blocking effect are not good, it is easy to cause a high scrap rate of the produced copper clad laminate, and the degree of adhesion to the outer copper foil is not good, the high temperature impact resistance and mechanical properties are poor, and the bending strength is low

Images