Chemical nickel plating solution with high corrosion resistance and stability on surface of aluminum alloy and preparation method and application thereof
A technology of aluminum alloy surface and electroless nickel plating solution, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of complex pretreatment process, poor stability of plating solution, high porosity of plating layer, etc., and achieve Increase the stability of the plating solution, high corrosion resistance of the coating, and good stability of the plating solution
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Embodiment 1
[0031] The electroless nickel plating solution of the present invention is composed of deionized water, main salt, reducing agent, complexing agent, buffering agent, stabilizer and brightener. The main salt is nickel sulfate (NiSO 4 ·6H 2 O) content 25g / L; reducing agent is sodium hypophosphite (NaH 2 PO 2 ·H 2 O) content 27g / L; Complexing agent is made up of glycine and lactic acid, and wherein glycine 10g / L, lactic acid 5ml / L; Buffering agent is made of sodium tetraborate (Na 2 B 4 o 7 10H 2 O) and succinic acid, wherein sodium tetraborate 1.0g / L, succinic acid 18g / L; stabilizer consists of cobalt nitrate (Co(NO 3 ) 2 ·6H 2 O) and potassium iodide, wherein potassium iodide 5mg / L, cobalt nitrate 10mg / L; brightener is polyethylene glycol, content 0.1g / L. The pH value of the electroless nickel plating solution is 4.8, the plating temperature is 80°C, and the plating time is 3h.
[0032]The steps of preparing the electroless nickel plating solution are as follows: add...
Embodiment 2
[0035] The electroless nickel plating solution of the present invention is composed of deionized water, main salt, reducing agent, complexing agent, buffering agent, stabilizer and brightener. The main salt is nickel sulfate (NiSO 4 ·6H 2 O) content 30g / L; reducing agent is sodium hypophosphite (NaH 2 PO 2 ·H 2 O) content 32g / L; Complexing agent is made up of glycine and lactic acid, and wherein glycine 6g / L, lactic acid 10ml / L; Buffering agent is made of sodium tetraborate (Na 2 B 4 o 7 10H 2 O) and succinic acid, wherein sodium tetraborate 2.0g / L, succinic acid 15g / L; stabilizer consists of cobalt nitrate (Co(NO 3 ) 2 ·6H 2 O) and potassium iodide, wherein potassium iodide 15mg / L, cobalt nitrate 5mg / L; brightener is polyethylene glycol, content 0.2g / L. The pH value of the electroless nickel plating solution is 5.2, the plating temperature is 85°C, and the plating time is 1h.
[0036] The steps of preparing the electroless nickel plating solution are as follows: ad...
Embodiment 3
[0039] The electroless nickel plating solution of the present invention is composed of deionized water, main salt, reducing agent, complexing agent, buffering agent, stabilizer and brightener. The main salt is nickel sulfate (NiSO 4 ·6H 2 O) content 28g / L; reducing agent is sodium hypophosphite (NaH 2 PO 2 ·H 2 O) content 30g / L; Complexing agent is made up of glycine and lactic acid, wherein glycine 8g / L, lactic acid 7.5ml / L; Buffering agent is made of sodium tetraborate (Na 2 B 4 o 7 10H 2 O) and succinic acid, wherein sodium tetraborate 1.5g / L, succinic acid 12g / L; stabilizer is made of cobalt nitrate (Co(NO 3 ) 2 ·6H 2 O) and potassium iodide, wherein potassium iodide 10mg / L, cobalt nitrate 7.5mg / L; brightener is polyethylene glycol, content 0.15g / L. The pH value of the electroless nickel plating solution is 5, the plating temperature is 83°C, and the plating time is 2h.
[0040] The steps of preparing the electroless nickel plating solution are as follows: addin...
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