Superfine nanocrystalline diamond precision tool and manufacturing method thereof

A diamond tool, ultra-fine nano technology, applied in the direction of manufacturing tools, tools for lathes, accessories of tool holders, etc., can solve the problems of poor polycrystalline diamond hardness and wear resistance, tool failure, grain fall off, etc. Achieve the effect of overcoming grinding and polishing, reducing processing difficulty and high hardness

Inactive Publication Date: 2019-10-11
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the hardness and wear resistance of polycrystalline diamond are not as good as those of single crystal diamond, and the grains of polycrystalline diamond are larger, so it is difficult to sharpen the ultra-smooth knife surface and sharp cutting edge
During the cutting process of polycrystalline diamond tools, if the cutting force is too large, the crystal grains will fall off and the tool will fail
Therefore, polycrystalline diamond also has many defects in the manufacture of diamond precision tools

Method used

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  • Superfine nanocrystalline diamond precision tool and manufacturing method thereof
  • Superfine nanocrystalline diamond precision tool and manufacturing method thereof
  • Superfine nanocrystalline diamond precision tool and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0068] A silicon (100) surface with a diameter of 50-100 millimeters and a thickness of 500-3000 micrometers is used for chemical vapor deposition of an ultrafine nanocrystalline diamond thick film. Before deposition, in order to increase the nucleation density of diamond to grow ultrafine nanocrystalline diamond, it is necessary to grind the silicon wafer with ultrafine nanocrystalline diamond powder to form many nanogrooves on the surface of the silicon wafer to promote the nucleation of diamond. The particle size of ultra-fine nanocrystalline diamond powder is 5-15 nanometers, and the silicon wafer is ground by manual grinding. After the ground silicon wafer is ultrasonically cleaned with deionized water, it is ultrasonicated in an alcohol suspension containing ultrafine nanocrystalline diamond powder, and seeds are placed on the surface of the silicon wafer, and the ultrasonic time is 5-30 minutes. High-density ultrafine nanocrystalline diamond powder will remain on the su...

Embodiment 2

[0088] Adopt the method of embodiment 1 to prepare self-supporting ultrafine nanocrystalline diamond thick film, difference is: the height of hot wire distance sample is 14 millimeters, growth pressure 1.5kPa, methane concentration 2%, inert gas concentration 10%, ultrafine The growth time of nanocrystalline diamond thick film is 30-1000 hours. After testing, the thickness of the thick film is 500 microns, and the average size of diamond grains is 10 nanometers.

[0089] After cutting, welding and grinding, the manufacture of ultra-fine nanocrystalline diamond precision tools is completed.

[0090] Figure 11 It is the plane scanning electron micrograph of the ultrafine nanocrystalline diamond thick film obtained in embodiment 2. from Figure 11 It can be seen from the figure that the crystal grains of the diamond thick film are still ultrafine nanocrystals, and compared with Example 1, the needle-like clusters are more obvious.

[0091] Figure 12 It is the Raman spectru...

Embodiment 3

[0093] Adopt the method for embodiment 1 to prepare self-supporting ultrafine nanocrystalline diamond thick film, difference is: the height of hot wire distance sample is 15 millimeters, growth pressure 1.5kPa, methane concentration 2%, inert gas concentration 10%, ultrafine The growth time of nanocrystalline diamond thick film is 30-1000 hours. After testing, the thickness of the thick film is 450 microns, and the average size of diamond grains is 12 nanometers.

[0094] After cutting, welding and grinding, the manufacture of ultra-fine nanocrystalline diamond precision tools is completed.

[0095] Figure 13 It is the plane scanning electron micrograph of the ultrafine nanocrystalline diamond thick film obtained in embodiment 3. from Figure 13 It can be seen from the figure that the crystal grains of the diamond thick film are still ultrafine nanocrystals. Compared with Example 1, the distribution of diamond grains is no longer needle-like clusters.

[0096] Figure 14...

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Abstract

The invention discloses a superfine nanocrystalline diamond precision tool and a manufacturing method thereof. The tool comprises a tool handle and a diamond knife, wherein the diamond knife is prepared from a self-supporting superfine nanocrystalline diamond thick film, and the thickness of the thick film is 100-3,000 micrometers, wherein the sizes of diamond grains are larger than or equal to 1nanometer or smaller than or equal to 20 nanometers. By the adoption of a chemical vapor deposition method, superfine nanocrystalline diamond grows on a silicon substrate, then the silicon substrate is separated from the diamond, the self-supporting superfine nanocrystalline diamond thick film is obtained, the self-supporting superfine nanocrystalline diamond thick film is welded to a tool body through laser cutting, and after edge forming, coarse grinding and fine grinding are completed, the superfine nanocrystalline diamond precision tool is obtained.

Description

technical field [0001] The invention relates to an ultrafine nanocrystalline diamond precision tool and a manufacturing method thereof, belonging to the field of diamond precision tool manufacturing. Background technique [0002] Due to the special crystal structure and bonding form, diamond has many excellent properties such as high hardness, wear resistance and corrosion resistance, high melting point, and excellent physical and chemical stability. Diamond precision tools are widely used in the fields of non-ferrous metals, high-hardness non-metals and other difficult-to-machine materials, and can directly process ultra-smooth machined surfaces. [0003] At present, there are two common diamond precision tools, namely single crystal diamond tools and polycrystalline diamond tools. Single crystal diamond tool is an ideal tool for precision machining. It has high hardness and strength, high thermal conductivity, wear resistance, low friction coefficient with non-ferrous met...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/27C23C16/01C23C16/503B23B27/14
CPCC23C16/271C23C16/272C23C16/01B23B27/14C23C16/0254B23B27/20C23C16/02C23C16/50C23C16/56Y10T428/30
Inventor 江南李赫王博易剑曹阳
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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