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Fast chemical reduction gold plating solution and application method thereof

A gold plating solution and fast technology, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of limiting the deposition rate and deposition thickness, affecting the solderability of the gold layer, and its stability is questionable. The effect of increasing the deposition rate of gold plating, improving surface properties, and improving various properties

Inactive Publication Date: 2019-01-15
南雄市溢诚化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But the standard electrode potential of gold (Au + / Au: 1.692V) is very positive. If it is to increase the deposition rate and the thickness of the gold plating layer, the stability of the gold plating solution will be affected in the presence of a reducing agent, and it is easy to turn over the tank; and in order to maintain the stability of the gold plating solution, Forced to use a weak reducing agent, the actual production will limit the deposition rate and deposition thickness
[0006] In addition, due to the existence of the "Giavanni" effect, the electronegativity of the surface of the gold layer is high, which causes the uniformity of the gold layer and affects the corrosion resistance of the PCB board during use.
[0007] In the current stage of technology, there is the chemical gold plating solution described in the patent of invention with the publication number CN106399983A. The formulation of the gold plating solution has good stability, but the thickness of the gold plating layer does not meet the current market requirements; The chemical gold plating solution described in the invention patent, the formula of the gold plating solution can obtain a smooth and uniform coating, but the thickness of the gold plating layer cannot meet the current market demand; and the chemical gold plating solution described in the invention patent with the publication number CN105543816A , the coating thickness that can be obtained by this gold plating solution formula meets the market demand, but it uses sulfite as the main complexing agent, the stability of the gold plating solution is questionable, and the added stabilizer thiourea will affect the solderability of the gold layer

Method used

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  • Fast chemical reduction gold plating solution and application method thereof
  • Fast chemical reduction gold plating solution and application method thereof
  • Fast chemical reduction gold plating solution and application method thereof

Examples

Experimental program
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Effect test

preparation example

[0030] Obtain a Ni-Pd-Au layer on the printed circuit substrate at one time, and the specific steps are as follows:

[0031]Alkaline cleaning (50°C, 5min) → water washing (distilled water, room temperature, 2min) → acid etching cleaning agent (50°C, 5min) → hot water washing (distilled water, 45°C, 2min) → water washing (distilled water, room temperature, 2min) → micro Etching (sodium persulfate 50g / L, sulfuric acid 40ml / L, normal temperature, 3min) → pickling (sulfuric acid 100ml / L) → water washing (distilled water, normal temperature, 2min) → activation (activated palladium solution, normal temperature, 2min) → water washing ( Distilled water, normal temperature, 2min)→nickel plating (80~84℃, 20min)→water washing (distilled water, normal temperature, 2min)→palladium plating (50℃, 20min)→water washing (distilled water, normal temperature, 2min)→gold plating (pH=6.3 -6.8, 86°C, 20min) → washing (distilled water, room temperature, 2min) → drying.

Embodiment 1-6

[0034] The components of the gold plating solution of Examples 1-6 are shown in Table 1.

[0035] Table 1 embodiment 1-6 gold plating solution composition

[0036]

Embodiment 7

[0042] Use an XRF thickness gauge to measure the thickness of the plating layer; the brightness of the appearance of the gold layer can be obtained through a magnifying glass and visual inspection, and the bonding force can be measured by tape method. The brightness and bonding force are divided into 5 levels from 1 to 5, and the bonding force and brightness The more excellent the series is, the higher the number is; the period of the plating solution is judged by cyclic plating (the substrate is plated with gold for a cyclic experiment, and in the case of a plating solution with a gold concentration of 0.2g / L, 0.2g / L of gold is separated to The amount of plating on the substrate becomes 1MTO); the uniformity of the coating is evaluated by scanning electron microscopy; the corrosion resistance is measured by electrochemical polarization, and the porosity is calculated. The test results of Examples 1-6 are shown in Table 3, and the test results of Comparative Examples 1-10 are s...

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Abstract

The invention belongs to the technical field of chemical gold plating and particularly relates to a fast chemical reduction gold plating solution and an application method thereof. The fast chemical reduction gold plating solution comprises the following density components: 0.5-1.5 g / L of a water-soluble gold compound ( in Au), 5-20 g / L of sodium hypophosphite, 1-5 g / L of hydroxylamine sulphate, 25-55 g / L of ammonium citrate tribasic, 5-15 g / L of ethylene diamine tetraacetic acid disodium, 0.1-3.0 g / L of amino acid, 0.001-0.02 g / L of thiol-polyethylene glycol, 0.001-0.02 g / L of alkyl pyridinebromide, 0.001-0.005 g / L of ligninsulfonate, 0.01-0.1 g / L of borane dimethylamine and 0.01-0.3 g / L of tartaric germanium. The gold plating solution is excellent in stability and high in deposition rate. An obtained gold plating layer is smooth, uniform, bright and compact in surface and has better corrosion resistance and tin plating backflow and gold line forming performance.

Description

technical field [0001] The invention belongs to the technical field of chemical gold plating, relates to the technical field of chemical gold plating applied to the surface treatment of printed circuit boards, in particular to a chemical rapid reduction gold plating solution and its application. Background technique [0002] As the carrier and link body of electronic components, printed circuit board (PCB) is the main component of current electronic equipment, and it can be said to be the carrier of the information age. The use of copper substrates in PCBs is currently the best choice, with good electrical conductivity and relatively low price, but there are corrosion problems, and copper oxides have low solderability and unstable solder joint reliability. Gold has a bright color, excellent electrical conductivity, oxidation resistance, and ductility, and is very suitable for surface coating (coating) plating. [0003] The development of chemical gold plating is very rapid....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/44
CPCC23C18/44
Inventor 吴道新肖忠良王毅玮姚文娟杨荣华曹忠
Owner 南雄市溢诚化工有限公司
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