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Preparation method of composite resin-based solder resist ink

A technology of solder resist ink and composite resin, which is applied in the direction of ink, application, household appliances, etc., can solve the problems of not meeting market requirements, poor scratch resistance, poor high temperature resistance, etc., to improve brittleness, increase crosslinking density, and hardness and the effect of improving the wear resistance

Inactive Publication Date: 2018-11-06
邹峰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a preparation method of composite resin-based solder resist ink in view of the defects of poor high temperature resistance and poor scratch resistance in current common solder resist inks, which cannot meet market requirements

Method used

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  • Preparation method of composite resin-based solder resist ink

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example 1

[0023] Mix phenol, formaldehyde solution with a mass fraction of 10%, and hydrogen peroxide with a mass fraction of 12% in a mass ratio of 6:3:1 and place them in a four-necked flask equipped with a stirrer, a thermometer, and a condenser. At a temperature of 75 Reflux reaction at ℃ for 32 minutes, after cooling to room temperature, distill under reduced pressure to remove water to obtain self-made phenolic resin; mix self-made phenolic resin and 8% ammonia water at a mass ratio of 9:1 and pour into the reactor , stirred and reacted for 21 minutes at a temperature of 95°C to obtain an alkalized phenolic resin, and then mixed the alkalized phenolic resin, sesame oil, absolute ethanol, and hexamethylenetetramine in a mass ratio of 5:2:3:1 Mixed, stirred and reacted for 27 minutes at a temperature of 112°C, cooled and discharged to obtain a gel product, which is a modified phenolic resin; bisphenol A epoxy resin, methyl methacrylate, butyl acrylate and Acrylic acid was mixed in a...

example 2

[0025] Mix phenol, formaldehyde solution with a mass fraction of 10%, and hydrogen peroxide with a mass fraction of 12% in a mass ratio of 6:3:1 and place them in a four-necked flask equipped with a stirrer, a thermometer, and a condenser. At a temperature of 77 Reflux reaction at ℃ for 34 minutes, after cooling to room temperature, distill under reduced pressure to remove water to obtain self-made phenolic resin; mix self-made phenolic resin and 8% ammonia water at a mass ratio of 9:1 and pour into the reactor , stirred and reacted for 23 minutes at a temperature of 97°C to obtain an alkalized phenolic resin, and then mixed the alkalized phenolic resin, sesame oil, absolute ethanol and hexamethylenetetramine in a mass ratio of 5:2:3:1 Mixed, stirred and reacted for 28 minutes at a temperature of 114°C, cooled and discharged to obtain a gel product, which is a modified phenolic resin; bisphenol A epoxy resin, methyl methacrylate, butyl acrylate and Acrylic acid was mixed in a be...

example 3

[0027] Mix phenol, formaldehyde solution with a mass fraction of 10%, and hydrogen peroxide with a mass fraction of 12% in a mass ratio of 6:3:1 and place them in a four-necked flask equipped with a stirrer, a thermometer, and a condenser tube. At a temperature of 80 Reflux reaction at ℃ for 36 minutes, after cooling to room temperature, distill under reduced pressure to remove water to obtain self-made phenolic resin; mix self-made phenolic resin and 8% ammonia water at a mass ratio of 9:1 and pour into the reactor , stirred and reacted for 24 minutes at a temperature of 100°C to obtain an alkalized phenolic resin, and then mixed the alkalized phenolic resin, sesame oil, absolute ethanol, and hexamethylenetetramine in a mass ratio of 5:2:3:1 Mixed, stirred and reacted for 30 minutes at a temperature of 115°C, cooled and discharged to obtain a gel product, which is a modified phenolic resin; bisphenol A epoxy resin, methyl methacrylate, butyl acrylate and Acrylic acid was mixe...

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Abstract

The invention discloses a preparation method of a composite resin-based solder resist ink and belongs to the technical field of printing ink preparation. Firstly, phenyl hydroxide, a formaldehyde solution and hydrogen peroxide are mixed and stirred for reaction to obtain self-made phenolic resin, blending the self-made phenolic resin with gingelly oil, anhydrous ethanol and hexamethylenetetramine,and then adding a bisphenol A type epoxy resin in the reaction process of acrylic resin synthesis, wherein the bisphenol A type epoxy resin has strong cohesion, two blend resin molecules, namely a modified phenolic resin and a modified acrylic emulsion, contain hydroxys and double bonds, so that a system obtains extremely high functionality and reactivity and has a light-heat dual-curing function. Therefore, the crosslinking density of a solder resist ink coating is effectively improved; and since a large amount of hydroxys are contained on an aerosil surface, and can be in chemical reactionwith hydroxys in blend resin molecules to form a cross-linked network structure, scratch resistance of solder resist ink is further improved, and the preparation method provided by the invention has awide application scope.

Description

technical field [0001] The invention discloses a preparation method of composite resin-based solder resist ink, which belongs to the technical field of ink preparation. Background technique [0002] Solder resist ink is the protective ink covering the outer layer of printed circuit boards, also known as solder resist, and is one of the important materials required in the manufacture of printed circuit boards. Solder resist ink is coated on the surface of PCB to form a polymer protective film, which is used to prevent circuit corrosion and disconnection, prevent short circuit between lines caused by too many solder points, adjust solder adhesion, reduce copper dissolution pollution in solder joints, save solder, reduce Increase the weight of the instrument, increase the insulation, adapt to the high density of wiring, avoid virtual welding and improve the inspection speed. With the rise and development of printed electronics, the inkjet printing technology based on the flexi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/103C09D11/107C09D11/03C08G8/10C08G8/32C08F283/10C08F220/14C08F220/18C08F220/06C08F2/26
CPCC08F2/26C08F283/10C08G8/10C08G8/32C09D11/03C09D11/103C09D11/107C08F220/1804
Inventor 邹峰赵必花朱彩娣
Owner 邹峰
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