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A kind of self-exothermic pressureless sintering conductive silver paste and preparation method thereof

A conductive silver paste, self-heating technology, applied in cable/conductor manufacturing, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve non-dense diffusion, affect the application of nano conductive silver paste, and nanoparticle agglomeration and dispersion problems, achieve the effect of low post-treatment temperature, overcome the relatively high post-treatment temperature, and reduce the sintering temperature

Active Publication Date: 2019-11-22
SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the current preparation process of nano-conductive silver paste, there are generally problems of nano-particle agglomeration and dispersion, and the problem of non-dense diffusion in the low-temperature sintering process, which affects the application of nano-conductive silver paste.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A preparation method of self-exothermic pressureless sintering conductive silver paste, comprising the steps of:

[0025] S1. Weigh 30g terpineol, 20g ethylene glycol butyl ether acetate, 0.3g dodecyl mercaptan, and 0.2g polyvinylpyrrolidone in turn, and add them to the reaction kettle, and stir for 60min at 1000rpm until the polyvinylpyrrolidone completely dissolved.

[0026] S2, add 45g silver powder (particle size 50nm) and 4.5g Al / MoO in batches 3 The nano thermite (10nm particle size) is continuously mixed at a speed of 300rpm to obtain a self-exothermic pressureless sintered conductive silver paste.

[0027] The self-exothermic pressureless sintering conductive silver paste obtained in this embodiment was sintered at 250°C for 30min, and its volume resistivity was 3.17×10 -6 ohm·cm, the thermal conductivity is 209W / (m·K), and the bonding strength is greater than 43.5MPa.

Embodiment 2

[0029] A preparation method of self-exothermic pressureless sintering conductive silver paste, comprising the steps of:

[0030] S1. Weigh 10g of methyl ethyl ketone, 10g of butyl acetate, 15g of ethylene glycol butyl ether acetate, 0.2g of oleylamine, and 2.0g of polyvinyl formal into the reaction kettle, and stir at 1000rpm for 60min until polyethylene glycol Alcohol formal is completely dissolved and dispersed.

[0031] S2, add 60g silver powder (particle size 30nm) and 2.8g Al / MoO in batches 3 The nano thermite (10nm particle size) is continuously mixed at a speed of 300rpm to obtain a self-exothermic pressureless sintered conductive silver paste.

[0032] The self-exothermic pressureless sintering conductive silver paste obtained in this embodiment was sintered at 250°C for 30min, and its volume resistivity was 1.86×10 -6 ohm·cm, the thermal conductivity is 226W / (m·K), and the bonding strength is greater than 41.3MPa.

Embodiment 3

[0034] A preparation method of self-exothermic pressureless sintering conductive silver paste, comprising the steps of:

[0035] S1. Weigh 10g of methyl ethyl ketone, 15g of ethylene glycol, 15g of diphenyl carbonate, 0.1g of oleylamine, 0.1g of polyvinylpyrrolidone and 1.5g of polyacrylate into the reactor, and stir at 1000rpm for 60min until poly Vinylpyrrolidone and polyacrylate are completely dissolved and dispersed.

[0036] S2, add 55g silver powder (particle diameter 30nm) and 3.3g Al / Fe in batches 2 o 3 The nano thermite (particle size: 15nm) is continuously mixed at a speed of 300rpm to obtain a self-exothermic pressureless sintered conductive silver paste.

[0037] The self-exothermic pressureless sintering conductive silver paste obtained in this embodiment was sintered at 250°C for 30min, and its volume resistivity was 6.19×10 -6 ohm·cm, the thermal conductivity is 192W / (m·K), and the bonding strength is greater than 37.7MPa.

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Abstract

Disclosed are a self-heat-release pressureless sintered conductive silver paste and a preparation method therefor. The self-heat-release pressureless sintered conductive silver paste comprises the following raw materials in weight percentage: 20% to 60% of a nano silver powder, 30% to 70% of a solvent, 2% to 10% of a nano thermite, 0.1% to 2% of a dispersing auxiliary, and 0.1% to 5% of an organic carrier. By introducing the nano thermite having a redox exothermic effect in the nano silver paste, an exothermic reaction can be initiated at 200℃ to 250℃, such that the self-heat-release pressureless sintered conductive silver paste has a low post-treatment temperature, high temperature resistance, high thermal conductivity, and high bonding properties, can significantly improve the reliability of packaged devices, and is suitable for bonding and heat dissipation of the third generation of wide-gap semiconductor chips.

Description

technical field [0001] The invention relates to electronic packaging materials, in particular to a self-heating non-pressure sintered conductive silver paste and a preparation method thereof. Background technique [0002] The third-generation wide-bandgap semiconductor material is an important support for enhancing the core competitiveness of the new generation of information technology. The third-generation semiconductor materials represented by silicon carbide (SiC), gallium nitride (GaN) and zinc oxide (ZnO) have large band gap, high breakdown field strength, high thermal conductivity, and electron saturation drift velocity. High, small dielectric constant, strong radiation resistance, good chemical stability and other characteristics, can realize high voltage, high temperature, high frequency, high power, radiation resistance microwave millimeter wave devices and short wavelength optoelectronic semiconductor devices, is a solid-state light source and power electronics ,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/14H01B1/22H01B13/00
CPCH01B1/14H01B1/22H01B13/00
Inventor 孙蓉张保坦李金泽朱朋莉
Owner SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS
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