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Composition for preventing ionic migration and preparation method, non-gel substrate and preparation method

A technology of ion migration and composition, which is applied in the direction of circuit substrate materials, coatings, printed circuit components, etc., can solve problems such as small volume resistivity, sudden drop in bonding force of contact area, short circuit, etc., to meet performance requirements and prevent The effect of migration

Inactive Publication Date: 2015-06-10
GUANGDONG DANBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Under the conditions of high humidity and applied voltage, the copper ions in the flexible circuit are under the action of current, and the electrons at the negative end of the polarity move to the positive end of the polarity, and the insulating layer (or surface) between the two poles has The phenomenon of precipitation occurs continuously, which reduces the insulation resistance, and thus easily causes a short circuit between ultra-fine-pitch wires (line spacing less than 25 μm)
In addition, due to the poor hydrophilicity of the surface of the polyimide film, it has poor adhesion to adhesives and metals, which brings another problem in the production of micro-circuits: as the lines become thinner, the wires and polyimide The shrinkage of the contact area of ​​the imide insulating layer will lead to a sudden decrease in the bonding force, and it is easy to cause the wire to fall off, making it difficult to guarantee the reliability of the flexible circuit board
In JP5299801 and JP5152755 public patents, polyimide adhesive layer lamination method is used to make double-sided or multi-layer substrate materials. The disadvantage is that it cannot prevent the diffusion of copper ions, the volume resistivity is small, and it cannot reach high resistance. value, there is a short circuit between the ultra-micro circuits, and the circuit is easy to peel off from the polyimide surface under the action of external force or environment, the reliability is poor, and it is difficult to meet the requirements of the flexible circuit board in extreme environments such as high humidity, high voltage, shock and impact. performance under

Method used

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  • Composition for preventing ionic migration and preparation method, non-gel substrate and preparation method
  • Composition for preventing ionic migration and preparation method, non-gel substrate and preparation method
  • Composition for preventing ionic migration and preparation method, non-gel substrate and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] The formula that the composition that present embodiment prepares anti-ion migration adopts is as follows:

[0041]

[0042] According to the above formula, add 40g of E-44 epoxy resin and 13g of GMA-EA-BA terpolymer into 65g of ethanol. After stirring evenly, add 8g of KH-550 and 15g of SATA in turn, stir and dissolve Finally, add 20g of triethanolamine at last, stir to obtain a liquid mixture product with moderate viscosity, and seal it for future use.

[0043] The prepared anti-ion migration composition is coated on the roughened surface of the copper foil, and the thickness of the coating is about , baked at 60°C for 1 hour, the solvent evaporates and forms a film, and then coats polyimide precursor resin polyamic acid on it, the coating thickness is 20-30μm, and the polyimide is obtained after thermal imidization Imine copper clad laminate, that is, no adhesive substrate. Test the surface resistance, volume resistivity and peel strength of the polyimide film ...

Embodiment 2

[0049] The difference between this example and Example 1 is that 5-methylbenzotriazole (TTA) is used as the trapping cation exchanger, and the others remain unchanged.

[0050] The test result of embodiment two is as follows:

[0051] Surface resistance: 5.3×10 14 Ω;

[0052] Volume resistivity: 6.9×10 14 Ω.cm;

[0053] Peel strength: 1.71N / mm.

Embodiment 3

[0055] The formula that the composition that present embodiment prepares anti-ion migration adopts is as follows:

[0056]

[0057] According to the above formula, add 30g of E-51 epoxy resin and 10g of GMA-MA binary copolymer into 60g of acetone. After stirring evenly, add 5g of KH-570 and 10g of BTA in turn, and stir to dissolve. Finally, add 15g of 2-ethyl-4-methylimidazole, stir evenly to obtain a liquid mixture product with moderate viscosity, and seal it for future use.

[0058] The prepared anti-ion migration composition is coated on the roughened surface of the copper foil, and the thickness of the coating is about , baked at 60°C for 1 hour, the solvent evaporates and forms a film, and then coats polyimide precursor resin polyamic acid on it, the coating thickness is 20-30μm, and the polyimide is obtained after thermal imidization Imine copper clad laminate, that is, no adhesive substrate. Test the surface resistance, volume resistivity and peel strength of the ...

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Abstract

The invention discloses a composition for preventing ionic migration and a preparation method, a non-gel substrate and a preparation method. The composition for preventing ionic migration comprises a capturing cation-exchanger, a coupling agent, an adhesive and a curing agent; the capturing cation-exchanger comprises a matter containing a triazole ring in a molecular structure. The preparation method comprises the following steps: adding the components into an organic solvent and uniformly stirring and mixing to obtain the composition; coating the substrate with the composition and roasting to form a film; and then forming a polyimide insulating layer on the film to form the non-gel substrate. The composition disclosed by the invention as a molecular interlayer material can effectively prevent ions from being diffused to the polyimide insulating layer and moreover, the composition can improve the two phase interface performances so as to improve the insulating performance of a polyimide film and the peeling strength of a metal layer, thereby satisfying the requirement of a high density flexible circuit board on the performance of the non-gel substrate.

Description

technical field [0001] The invention relates to the field of preparation of flexible circuit board packaging base materials, in particular to an ion-migration-resistant bottom layer composition as a molecular interface layer substance and a preparation method thereof, as well as an adhesive-free base material and a preparation method thereof. Background technique [0002] When the existing flexible circuit boards are rapidly developing toward denser circuits and narrower spacing between holes and lines, ion migration resistance has become a very important issue. Under the conditions of high humidity and applied voltage, the copper ions in the flexible circuit are under the action of current, and the electrons at the negative end of the polarity move to the positive end of the polarity, and the insulating layer (or surface) between the two poles has The phenomenon of precipitation occurs continuously, which reduces the insulation resistance, and thus easily causes a short cir...

Claims

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Application Information

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IPC IPC(8): C09D163/00C09D7/12H05K1/03
CPCC09D163/00C09D7/63H05K1/03C08L33/14C08K5/3472C08K5/544C08K5/17C08K5/05C08K5/3475C08K5/5425C08K5/3445C08K5/07C08K5/315C08K5/101
Inventor 张双庆
Owner GUANGDONG DANBOND TECH
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