Hard polyimide foaming structural material and preparation method thereof
A technology of polyimide and foam structure, which is applied in the field of rigid polyimide foam structure material and its preparation, can solve the problems of restricting the application field of structure material, achieve short preparation process route, good storage stability, easy The effect of industrialization
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Embodiment 1
[0030] Put 148.8 grams of 3,3',4,4'-benzophenone tetra-acid dianhydride into 140 grams of N,N-dimethylformamide, heat to 120°C and fully stir to dissolve it. After 3,3' , After all the solids of 4,4'-benzophenonetetraacid dianhydride are dissolved, add 4.6 grams of polyethylene glycol-10000 to react for 20 minutes. After the end, when the temperature of the solution drops below 50°C, add 12 grams of deionized water, 0.32 grams of stannous octoate, 0.12 grams of triethanolamine, 12 grams of silicone oil AK-8803, and 10 grams of silicone oil DC 193, and stir the above solution to room temperature , A pink viscous polyimide foam precursor solution can be obtained.
[0031] Measure 15 grams of polyimide foam precursor solution, stir quickly with equal mass of polyphenyl polymethylene polyisocyanate, and pour it into the pre-prepared mold after the solution starts to turn white, and carry out under 5MPa pressure Pressurize and foam at room temperature for 10 minutes to obtain a po...
Embodiment 2
[0041] The difference between this example and specific example 1 is that 138.6 grams of 1,2,4,5-pyromellitic anhydride is added to the polar solvent, and the others are the same as in specific example 1 to finally obtain a rigid polyimide Foam structural material.
[0042] The basic performance of the rigid polyimide foam structural material prepared by test embodiment 3 is as follows:
[0043] Density 0.069×10 3 kg / m 3
[0044] Thermal conductivity 0.031W / m·K
[0045] Limiting Oxygen Index 32%
[0047] Compressive strength 1.8MPa
[0048] Tensile strength 2.9MPa
[0049] Heat distortion temperature 325°C
Embodiment 3
[0051] The difference between this embodiment and specific embodiment 2 is that 15 grams of polyimide foam precursor solution is measured, and the diphenylmethane diisocyanate of 18 grams is quickly stirred evenly, and others are the same as specific embodiment 3, and finally a hard polyimide foam is obtained. Quality polyimide foam structural material.
[0052] The basic performance of the rigid polyimide foam structural material prepared by test embodiment 4 is as follows:
[0053] Density 0.047×10 3 kg / m 3
[0054] Thermal conductivity 0.039W / m·K
[0055] Limiting Oxygen Index 29%
[0057] Compressive strength 1.1MPa
[0058] Tensile strength 2.3MPa
[0059] Heat distortion temperature 317℃
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