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Non-halogen active agent for scaling powder

A technology of activator and flux, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problem of not being able to use varieties with high performance requirements, achieve a wide range of applications, and overcome the effect of low activity

Inactive Publication Date: 2010-06-30
HUNAN ASTAR BIO CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This scheme can only be applied to varieties with lower performance requirements, and cannot be used for varieties with high performance requirements

Method used

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  • Non-halogen active agent for scaling powder
  • Non-halogen active agent for scaling powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Embodiment 1: Application in no-cleaning liquid flux

[0024] The proportions by weight of the formula are as follows: 95% of isopropanol, 3% of diethylene glycol monomethyl ether, 1.5% of succinic acid, and 0.5% of diphenylguanidine methanedisulfonate. After stirring and dissolving completely, a colorless transparent liquid flux is obtained. At 250°C, it can quickly diffuse on the metal liquid surface of an alloy of 99.3% tin and 0.7% copper, react quickly with tin-copper oxide on the liquid surface, and has a good fluxing effect. At room temperature, the flux will not chemically corrode copper and tin substrates. In the wave soldering production line, after the soldering of electronic products, the insulation resistance of the PCB board surface reaches 1×10 13 More than Ω, it has good electrical properties.

Embodiment 2

[0025] Embodiment 2: Application in tin wire containing solid flux

[0026] The proportion by weight of the formula is as follows: 95% of rosin, 3% of ethylene glycol monophenyl ether, and 2% of imidazolium methanedisulfonate. After heating, roasting and dispersing completely, a transparent light yellow solid soldering flux is obtained. In the production of tin wires, the content of the flux extruded in the tin wires is controlled between 2.8% and 3.0%, and the tin wires are made of an alloy of Sn99.3% and Cu0.7%. The finished tin wire has good wettability on copper foil, bright solder joints and transparent residue. In the process of use, there is no odor, no rosin splash, good soldering effect, and the insulation resistance of tin wire residue reaches 1×10 13 Ω or more.

Embodiment 3

[0027] Embodiment 3: Application in flux paste

[0028] The proportions by weight of the formula are as follows: 50% of rosin, 40% of diethylene glycol monobutyl ether, 5% of stearic acid amide, and 5% of guanidine methanedisulfonate. After heating, melting and dispersing completely, a translucent light yellow paste soldering flux is obtained. Tin powder with metal components of Sn96.5%, Ag3.0%, and Cu0.5% is selected, and the diameter of the tin powder is between 25 microns and 45 microns. Solder paste is obtained by mixing 90% tin powder and 10% solder flux and stirring and miscible with each other. The solder paste has a good printing effect, and can be heated to obtain full and bright solder joints on the pads of copper, tin and nickel substrates. The insulation resistance of solder joint residue reaches 1×10 13 Ω, the solder joints will not be corroded and blackened after 6 months at room temperature.

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Abstract

The invention relates to a non-halogen active agent for scaling powder, which is sulfonate generated by reacting sulfoacid and organic base. The sulfoacid can be alkyl sulfonic acid, alkyl disulfonic acid, isethionicacid, halogenation sulfoacid, such as methanesulfonic acid, ethanesulfonic acid, propanesulfonic acid, methionic acid, ethionic acid, malonic disulfonic acid ethylenehydrinsulfonic acid and the like. The sulfonate can be triethylamine methionic sulfonate, diphenyl guanidine methionic sulfonate and the like. The organic base can be organic amines, guanidines, imidazoles, phosphorus and the like. The invention has the advantages that firstly, the non-halogen active agent has high activity, belongs to a strong acid substance under active state and has the acidity strength similar to haloid acid; secondly, the non-halogen active agent has low corrosion, has no corrosion to a pad and a solder metal under the non-welding condition and has the advantage of low corrosion of organic acid active agent; and thirdly, the non-halogen active agent has wide application range and can be used as active components in multiple kinds of scaling powders.

Description

technical field [0001] The invention relates to a flux used for soldering in the electronic industry, in particular to an active ingredient in the flux, that is, a non-halogen active agent for the flux. technical background [0002] In the brazing process, flux is an indispensable material, and its role is extremely important. The active ingredient in the flux is the most critical part. The role of the activator in the flux is mainly to remove the oxide film on the surface of the substrate, reduce the surface tension during soldering, increase the wettability of the solder and the pad metal, and improve solderability. [0003] The requirements for ideal active agents are: under normal circumstances, they are stable and do not have any effect on the substrate even if they come into contact with it. During use, when the active material is heated to a certain temperature, it begins to melt and wet the solder and the pad; as the temperature further increases, the active materi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/36
CPCC07C309/08B23K35/362B23K35/36B23K35/22C07C309/06C07C309/05C07C309/04B23K35/24
Inventor 易宗明刘艺
Owner HUNAN ASTAR BIO CHEM TECH
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