Preparation method of chromium-aluminum-nitrogen film by closed field unbalanced magnetron sputtering

Abstract

The invention relates to a preparation method of a chromium-aluminum-nitrogen film by closed field unbalanced magnetron sputtering, which comprises the following steps: a chromium-tungsten-manganese steel plate is taken as a basal body, chromium and aluminum as a target source of metal ion, nitrogen gas as reactant gas, and argon gas as ion bombardment gas and protection gas; in a vacuum sputtering furnace, in a closed magnetic field state, in the argon gas and at the temperature of 300 DEG C, the surface of the chromium-tungsten-manganese steel plate is sputtered with chromium ion, aluminum ion and nitrogen ion and the chromium-aluminum-nitrogen hard film is formed on the surface of the steel plate, and then the low temperature tempering and alloying solid solution are conducted, thus greatly improving mechanical property, hardness, intensity, abrasive resistance and erosion resistance of the surface of the chromium-tungsten-manganese steel plate. The mechanical property of the chromium-tungsten-manganese steel plate can be improved by 466% compared with that of hardened steel plates. The preparation method has short process flow, precise technique, accurate and detailed measurement values, the film with thickness of 4,600nm, and the alloy layer with good solid solution effect and being not easy to peel off, thus being the ideal treatment method for strengthening and hardeningthe surface of alloy tool steel.

Description

technical field [0001] The invention relates to a method for preparing a chromium-aluminum-nitrogen thin film by closed-field unbalanced magnetron sputtering, which belongs to the technical field of surface coating and application of high-strength and high-hardness materials. Background technique [0002] In the field of machinery manufacturing industry, a large number of metal materials are used. Due to different uses and requirements, the processing of materials is also different. For example, tools with high strength and high hardness and mechanical parts that are wear-resistant and corrosion-resistant require Strengthen and harden it. [0003] There are also many ways to strengthen and harden tools, molds and mechanical parts, such as surface alloying, infiltrating nickel, chromium, molybdenum, silicon and other elements on the surface of metal materials to enhance their strength and hardness; such as heat treatment, Change the internal metallographic structure of the m...

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Problems solved by technology

[0004] Hard film is one of the effective ways to improve the wear resistance and high temperature oxidation resistance of the workpiece surface. The film deposition technology mainly includes chemical vapor deposition and physical vapor deposition. Due to the high deposition temperature of chemical vapor deposition, its application on the substrate is limited. , Physical vapor deposition has been widely used due to its low deposition temperature, wide range of applicable substrates, and easy control of film quality; physical vapor deposition mainly includes vacuum evaporation and sputtering deposition, and the thin film produced by sputtering method is dense, film-based Good binding force and wide application. Sputtering coating methods include radio frequency sputtering, tripolar sputtering and magnetron sputtering. Compared with other sputtering, magnetron sputtering has a higher coating rate. Magnetron sputtering has been developed from the original conventional Magnetron and balanced magnetron have developed to unbalanced magnetron. At present, the combination of unbalanced magnetron and multi-source closed magnetic field can increase the plasma density in the vacuum chamber, enhance the effect of ion bombardment, and obtain better coating quality; adopt Closed-field unbalanced magnetron sputtering coating, due to different sputtering conditions, target source materials, and carrier metals, there are many differences and deficiencies in sputtering coating effects, and there are still many disadvantages, such as unbalanced film thickness and unstable technical parameters.

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