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Method for forming metal film and method for forming metal pattern

A metal pattern and metal film technology, used in metal material coating process, transportation and packaging, liquid chemical plating, etc., can solve the problems of high frequency transmission adaptability loss, fine wiring obstruction, etc., and achieve sufficient electrical conductivity , excellent adhesion, excellent high frequency characteristics

Inactive Publication Date: 2008-11-05
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In current assembled printed circuit boards, roughening is performed to ensure peel strength, but the current situation is that unevenness of several microns will hinder further finer wiring.
[0010] In particular, there is a problem of loss of high-frequency transmission adaptability when a wiring board obtained by using a roughened substrate is used for a semiconductor device

Method used

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  • Method for forming metal film and method for forming metal pattern
  • Method for forming metal film and method for forming metal pattern
  • Method for forming metal film and method for forming metal pattern

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0398] (Preparation of Substrate)

[0399] A polyimide film (product name: Kapton, manufactured by Toray Dubon Co., Ltd.) was used as a base material, and the following photopolymerizable composition was coated on the surface using a No. 18 rod coater (rodbar ロツドバ 1). It was dried at °C for 2 minutes to form an intermediate layer with a film thickness of 6 μm.

[0400] Then, a 400W high-pressure mercury lamp (model: UVL-400P, manufactured by Rigaku Sangyo Co., Ltd.) was used to irradiate the substrate with the intermediate layer with light for 10 minutes to prepare a substrate A.

[0401]

[0402] ·Allyl methacrylate / methacrylic acid copolymer 2g

[0403] (copolymerization molar ratio 80 / 20, average molecular weight 100,000)

[0404] ·Ethylene oxide modified bisphenol A diacrylate 4g

[0405] (IR125 Wako Pure Pharmaceutical)

[0406] ·1-Hydroxycyclohexyl phenyl ketone 1.6g

[0407] ·1-methoxy-2-propanol 16g

[0408] (formation of graft layer)

[0409] On the surface o...

Embodiment 2

[0423] (Manufacture of graft layer)

[0424] On the substrate A produced in the same manner as in Example 1, a polymer P1 coating liquid having the following composition was applied using a spinner. And, the film thickness of the obtained film was 0.8 μm.

[0425]

[0426] ·Hydrophilic polymer P1 (the synthesis method is shown below) 0.25g

[0427] ·Water 5g

[0428] ·Acetonitrile 3g

[0429]

[0430] Dissolve 18g of polyacrylic acid (average molecular weight: 25,000) in 300g of DMAc, add 0.41g of hydroquinone, 19.4g of 2-methacryloxyethyl isocyanate, 0.25g of dibutyltin dilaurate, and react at 65°C 4 hours. The acid value of the obtained polymer was 7.02 meq / g. Neutralize the carboxyl group with 1mol / L sodium hydroxide aqueous solution, add it to ethyl acetate, and precipitate the polymer, which can better clean the hydrophilic polymer.

[0431] The obtained film was exposed for 1 minute using a 400W low-pressure mercury lamp. Then, the obtained film was washed wit...

Embodiment 3

[0438] (Manufacture of graft forming material)

[0439] Substrate A produced in the same manner as in Example 1 was immersed in a tert-butyl acrylate solution (30% by weight, solvent: propylene glycol monomethyl ether (MFG)), and exposed for 30 minutes under an argon atmosphere using a 400W high-pressure mercury lamp.

[0440] The film obtained after light irradiation was well washed with propylene glycol monomethyl ether (MFG) to obtain a graft-forming material E grafted with poly(t-butylacrylate).

[0441] (formation of graft layer)

[0442] On the obtained graft-forming material E, a solution having the following composition was applied. In addition, the film thickness of the poly(tert-butyl acrylate) film was 0.5 μm.

[0443] ・Triphenylsulfonium trifluoride (triflate triflate) 0.05g

[0444] ·Methyl ethyl ketone (MEK) 1g

[0445] Next, the obtained film was exposed for 1 minute using a 400 W high-pressure mercury lamp, and then heated at 90° C. for 2 minutes. Then, the ...

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Abstract

The invention provides a method for forming a metal film which is characterized by comprising: a step (a1) for forming, on a substrate, a polymer layer composed of a polymer which has a functional group interacting with a metal ion or a metal salt and is chemically bonded to the substrate directly; a step (a2) for providing the polymer layer with a metal ion or a metal salt; a step (a3) for forming a conductive layer having a surface resistivity of 10-100 FORMULA by reducing the metal ion or the metal salt; and a step (a4) for forming a conductive layer having a surface resistivity of 1*10 <-1> FORMULA or less by electroplating.

Description

technical field [0001] The present invention relates to a method for forming a metal film and a method for forming a metal pattern, in particular to a method for forming a metal film and a method for forming a metal pattern useful as a metal circuit board or a printed circuit board. Background technique [0002] Metal films formed on substrates are used in various electrical appliances that are etched in a pattern. The metal film (metal substrate) formed on the substrate exhibits adhesiveness through the anchoring effect of roughening the surface of the substrate in order to provide adhesion between the substrate and the metal layer. As a result, the substrate interface portion of the completed metal film becomes uneven, and when used as circuit wiring, there is a problem of poor high-frequency characteristics. Furthermore, when forming a metal substrate, there is a problem that the substrate must be treated with a strong acid such as chromic acid in a cumbersome process in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/56C23C18/16C25D21/12H05K1/03H05K3/18C08F292/00C08J7/04
CPCC25D5/56H05K3/387C23C18/1834H05K2203/1157C23C18/1653H05K3/108C23C18/31C25D5/022C23C18/2066C25D5/18H05K3/181H05K2203/125C23C18/1658Y10T428/12063H05K3/188C25D5/611C25D5/627
Inventor 松本和彦
Owner FUJIFILM CORP
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