The invention discloses an electromechanical integrated intelligent backboard
satellite framework. The electromechanical integrated intelligent backboard
satellite framework comprises an intelligent backboard, wherein the intelligent backboard adopts a sandwich structure form and comprises an upper
honeycomb board, a middle
honeycomb board and a lower
honeycomb board and the upper honeycomb board,the middle honeycomb board and the lower honeycomb board are connected together through backboard connecting pieces in different forms through bolts;
electronic equipment in the board is arranged inmounting grooves arranged in the middle honeycomb board, wiring grooves are formed among the mounting grooves, and cables among the
electronic equipment in the board are wired through the wiring grooves; the upper honeycomb board and the lower honeycomb board are connected with the middle honeycomb board in a glue joint mode; the
electronic equipment in the board is made into an MCM multifunctional structure form or a single board PCB form, and all parts of the electronic equipment in the board are connected through power lines, cables and optical fibers. The electromechanical integrated intelligent backboard
satellite framework eliminates a large-volume component, integrates subsystems such as
data transmission and power
distribution networks and the like, and embeds electronic equipmentinto a
composite material to form the electromechanical integrated intelligent backboard. According to the invention, the
satellite system is light in weight, simple to assemble and convenient and quick to test and debug.