30 results about "Distances Between Ports" patented technology

The invention relates to a quantitative interrupted dust adding device. The quantitative interrupted dust adding device comprises a taper hopper, a box, a double-head piston cylinder and a dust blowing pipe; a feed hole in the upper end of the dust blowing pipe is connected with the bottom of the box; the upper end of the double-head piston cylinder is arranged inside the box; the lower end of the double-head piston cylinder penetrates the bottom of the box to be arranged inside the feed hole of the blowing pipe; a discharge hole of the tapper hopper is connected with the upper end opening of the double-head piston cylinder; the double-head piston cylinder comprises a cylinder body, an upper piston head, a lower piston head and a screw rod; the upper end opening of the cylinder body is connected with the discharge hole of the tapper hopper; the lower end opening of the cylinder body penetrates the bottom of the box body to be arranged inside the feed hole of the dust blowing pipe; distance between the upper piston head and the lower piston head is not larger than that between the upper end opening and the lower end opening of the cylinder body. The quantitative interrupted dust adding device has the advantages of being small in average dust adding speed, high in accuracy, simple in structure and high in stability.

The invention discloses a 1*16 optical splitter with a special Y-branched type bending structure. The overall length Z of the 1*16 optical splitter is equal to 35,000mum, the spacing Xtheta of every two adjacent output waveguides is equal to 127mum, and both input waveguides and the output waveguides have a rectangular cross section of 6mum*6mum. A traditional 1*16 optical splitter has the problemthat the distance between an input port and an output port is long, so that the overall length of the optical splitter is long, and the requirement for the high integration of existing optoelectronicdevices is difficult to achieve. The 1*16 optical splitter with the special Y-branched type bending structure provided by the invention solves the problem existing in a traditional 1*16 optical splitter; and the 1*16 optical splitter is small in size and low in loss, and meets the requirements for the high integration of the optoelectronic devices.

The invention belongs to the field of semiconductor manufacturing industry. Specifically disclosed is a new chemical treatment method and device for the surface of a semiconductor substrate. In the chemical treatment method of the present invention, the semiconductor substrate is placed on the top of the chemical solution by using a bracket, and there is a certain distance between the lower surface of the semiconductor substrate and the liquid surface of the chemical solution, and the chemical solution is sprayed onto the lower surface of the semiconductor substrate by a spraying device. , so as to chemically treat the lower surface; wherein, the height of the chemical solution sprayed by the injection device is the distance between the lower surface of the semiconductor substrate and the upper port of the injection device. The device of the present invention includes a chemical tank containing a chemical solution, a support for placing a semiconductor substrate above the chemical solution, and a spraying device for spraying the chemical solution onto the lower surface of the semiconductor substrate. The chemical treatment method and its device of the present invention can only perform chemical treatment on a certain surface of the semiconductor substrate without any protection on the other surface.