Diamond wire saw device

Abstract

A diamond wire saw device including a diamond sawing wire. At least two diamond sawing wires are arranged in the front and back of a cutting working surface along a cutting feed direction, or at least two groups of the diamond sawing wires are arranged in the front and back of more than one parallel cutting working surface. The diamond sawing wires in the same group are parallel to one another to form a layer of cutting mesh surface. The diameter of a latter diamond sawing wire or a latter group of diamond sawing wires is equal to or greater than that of a former diamond sawing wire or a former group of diamond sawing wires.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a continuation-in-part of International Patent Application No. PCT / CN2012 / 071788 with an international filing date of Feb. 29, 2012, designating the United States, now pending, and further claims priority benefits to Chinese Patent Application No. 201110112869.1 filed Apr. 29, 2011. The contents of all of the aforementioned applications, including any intervening amendments thereto, are incorporated herein by reference.CORRESPONDENCE ADDRESS[0002]Inquiries from the public to applicants or assignees concerning this document should be directed to: MATTHIAS SCHOLL P.C., ATTN.: DR. MATTHIAS SCHOLL ESQ., 14781 MEMORIAL DRIVE, SUITE 1319, HOUSTON, Tex. 77079.BACKGROUND OF THE INVENTION[0003]1. Field of the Invention[0004]The invention relates to a processing device for hard and brittle non-metallic materials and more particularly to a diamond wire saw device for cutting silicon ingots.[0005]2. Description of the Related Art[...

AI Technical Summary

Benefits of technology

[0028]By adopting the method of cutting the silicon wafers in sequence via the cutting mesh surfaces of a plurality of groups of diamond sawing wires, the cutting, fine grinding, and polishing procedures of the silicon wafer are finished via the diamond sawing wires with different characteristics according to different working parameters; the machining allowance of cutting, fine grinding, and polishing is greatly lowered in sequence, and the shearing force to the silicon wafer durin

Problems solved by technology

The cutting method of a wire saw machine has been greatly improved technically compared with a traditional band saw cutting method and ID blades slicing method, but there are still a lot problems such as surface cracks of surface cutting by abrasive slurry, uncontrollable depth of the affected layer, difficulty in separation between abrasive particles and silicon crumbs, harsh working environment, and lower efficiency.

Each diamond wire saw with abrasive concretion has different characteristics, but also has obvious defects.(1) As to the resin bond diamond wire saw with abrasive concretion, the finishing surface quality is good, but the efficiency is low, the resin heat resistance is poor, the bonding strength is low, the diameter of the wire saw is easily worn, the change in kerf is great, and the subsequent processing cost may be increased due to the out-of-tolerance in thickness of the silicon wafer.(2) As to the diamond wire saw with abrasive concretion by mechanical extrusion, the working efficiency is high, but the core wire is damaged under extrusion, the life is affected after the strength degradation, and the finishing qua

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