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High-temperature-resistant transparent conductive shielding structure and preparation method thereof

A technology of transparent conduction and shielding structure, applied in the fields of magnetic/electric field shielding, cable/conductor manufacturing, circuit, etc., can solve problems such as smoke, accidents, falling off, etc., to strengthen the force, avoid negative effects, and improve attachment Focus on the effect

Pending Publication Date: 2022-05-10
广东中科半导体微纳制造技术研究院 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the vast majority of current polymer materials will undergo serious deterioration at high temperatures, and may even cause extreme situations such as smoke and fire
[0011] Studies have shown that when the hollow network structure is fused at a certain point, a chain reaction will quickly occur, causing the collapse of the entire transparent conductive network, and accidents will occur
[0012] All in all, the conductive powder in traditional products will be damaged / shedding at high temperature (eg 150-600°C)
And some heat-labile auxiliary materials (such as some resin materials) even have the risk of fire
On the other hand, the damage of the conductive part will further cause the product to heat up, thus forming a vicious circle

Method used

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  • High-temperature-resistant transparent conductive shielding structure and preparation method thereof
  • High-temperature-resistant transparent conductive shielding structure and preparation method thereof
  • High-temperature-resistant transparent conductive shielding structure and preparation method thereof

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preparation example Construction

[0057] For this reason, the invention provides a kind of preparation method of high temperature resistant transparent conductive shielding structure, comprising:

[0058] S101, such as figure 1 As shown, the glass 1 is prepared, and a plurality of thin grooves 11 are formed on the glass, and the plurality of thin grooves 11 are connected to each other to form a hollow network structure;

[0059] Preferably, the width of the fine grooves 11 is 1-100 microns, and the depth is 0.5-20 microns; the maximum distance between adjacent fine grooves 11 is in the range of 100-1000 microns. More preferably, the width of the fine grooves 11 is 10-50 microns, and the depth is 5-15 microns; the maximum distance between adjacent fine grooves 11 is in the range of 260-460 microns.

[0060] The width of the narrow groove 11 is 1-100 microns, which is used to take into account the contradiction between human perception and manufacturing cost. When the width is 1-100 microns, a good naked eye v...

Embodiment 1

[0112] (1) Prepare the glass, form a plurality of thin grooves on the glass by pulsed laser, and connect the plurality of thin grooves to form a hollow network structure. The width of the thin grooves is 40 microns and the depth is 1 micron; adjacent The maximum distance between slots ranges between 260 microns;

[0113] (2) Fill the conductive ink into the fine groove through a soft scraper, the number of times of filling is 5 times, and heat and sinter to form a conductive network;

[0114] (3) On the glass surface that is provided with conductive network body, coating protection liquid, wherein, protection liquid selects polysiloxane for use; Baking is carried out to the glass that coats protection liquid, removes solvent; Ultraviolet light less than 300nm is irradiated to form a transparent protective layer.

Embodiment 2

[0116] (1) Prepare the glass, form a plurality of thin grooves on the glass by pulsed laser, and connect the plurality of thin grooves to form a hollow network structure. The width of the thin grooves is 40 microns and the depth is 5 microns; The maximum distance between slots ranges between 310 microns;

[0117] (2) Fill the conductive ink into the fine groove through a soft scraper, the number of times of filling is 3 times, and heat and sinter to form a conductive network;

[0118] (3) On the glass surface that is provided with conductive network body, coating protection liquid, wherein, protection liquid selects polysiloxane for use; Baking is carried out to the glass that coats protection liquid, removes solvent; Ultraviolet light less than 300nm is irradiated to form a transparent protective layer.

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Abstract

The invention discloses a high-temperature-resistant transparent conductive shielding structure and a preparation method thereof.The preparation method of the high-temperature-resistant transparent conductive shielding structure comprises the steps that (1) glass is prepared, a plurality of thin grooves are formed in the glass, and the thin grooves are connected with one another to form a hollow network structure; and (2) filling conductive ink into the thin groove through the soft scraping strip, and heating and sintering to form a conductive network body. Correspondingly, the invention also provides the high-temperature-resistant transparent conductive shielding structure prepared by the method. The high-temperature-resistant transparent shielding film has good transparency, shielding effect and heat resistance, ensures the performance stability of the product at high temperature, and avoids the risks of failure, fire and the like.

Description

technical field [0001] The invention relates to the technical field of conductive shielding structures, in particular to a high-temperature-resistant transparent conductive shielding structure and a preparation method thereof. Background technique [0002] In the past few decades, light-transmitting conductive materials can be divided into two types: continuous type and aperture type based on the basic working principle. The former is mainly a light-transmitting thin film material, such as indium tin oxide (ITO), ultra-thin metal, graphene, transparent conductive polymer, etc.; the latter uses opaque materials to form small pores to achieve light transmission. Effects, such as metal orifice plates, wire mesh, metal nanowires, carbon nanotubes, metal grids, etc. Among them, the continuous light-transmitting conductive film requires that the material itself has both ideal conductivity and light transmission. When the index requirements are strict, the range of available mate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B13/00H05K9/00
CPCH01B13/0036H05K9/0081
Inventor 龚超马昌期林剑曾超
Owner 广东中科半导体微纳制造技术研究院
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