Preparation method of polishing disc for polishing superhard substrate slice and precise polishing method
A technology for polishing discs and negatives, applied in grinding/polishing equipment, manufacturing tools, metal processing equipment, etc., can solve the problems of time-consuming and labor-intensive, difficult to control and guarantee the processing quality of substrate sheets, increase costs, etc., and achieve an average thickness Small difference, reduced mechanical polishing time, cost saving effect
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[0033] Aiming at the above-mentioned difficulties existing in the prior art, the present invention provides a method for preparing a polishing disc for superhard substrate polishing, such as figure 1 As shown, by using a multi-layer composite polishing disc to precisely polish the substrate, compared with the traditional substrate polishing process, the process flow is greatly simplified, and a substrate polishing sheet with a better surface shape is obtained. The polished substrate The average thickness difference is small, and the bending warpage is low.
[0034] The three-inch superhard silicon carbide substrate sheet adopts the three-layer composite polishing disc of the present invention to carry out precision mechanical polishing, and the abrasive material of the three-layer polishing disc is 1 micron, 3 micron and 6 micron diamond and percent of 60 volume percent Alumina with the same particle size of 10% by volume is sintered by ball milling and sintering polyester mat...
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