Special adhesive for hollow composite insulator and preparation method thereof
A technology of composite insulators and adhesives, applied in the direction of adhesives, adhesive types, adhesive additives, etc., can solve the problem of no suitable adhesive
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Embodiment 1
[0052] The invention discloses a special adhesive for hollow composite insulators, which includes component A and component B, in terms of parts by mass, as shown in Table 1, specifically:
[0053]A component: epoxy resin E51 100 parts, nano AL 2 o 3 1.5 parts, 1 part of 3-glycidyloxypropyltrimethoxysilane, 10 parts of acetone, SiO 2 150 servings.
[0054] nano-AL 2 o 3 With an average particle size of 20 nm, SiO 2 The mesh number is mineral pure 200 mesh.
[0055] Component B: 65 parts of methyl tetrahydrophthalic anhydride, 70 parts of alumina powder, 1 part of DMP-30, 25 parts of PSPA, 0.5 part of BYK-410. The mesh number of alumina powder is 270 mesh.
[0056] Preparation process:
[0057] Prepare component A:
[0058] (1) Mix 1 part of 3-glycidyl etheroxypropyl trimethoxysilane and 10 parts of acetone, adjust the pH value to 4 and add nano-AL 2 o 3 , mechanically stirred for 0.5 hours under the assistance of ultrasonic waves to obtain a dispersion liquid, whi...
Embodiment 2
[0069] The invention discloses a special adhesive for hollow composite insulators, which includes component A and component B, in terms of parts by mass, as shown in Table 1, specifically:
[0070] A component: epoxy resin E51 110 parts, nano AL 2 o 3 2 parts, 3~0.5 parts of glycidyl etheroxypropyl trimethoxysilane, 12 parts of acetone, SiO 2 160 copies.
[0071] nano-AL 2 o 3 With an average particle size of 30 nm, SiO 2 The mesh number is mineral pure 200 mesh.
[0072] Component B: 70 parts of methyl tetrahydrophthalic anhydride, 80 parts of alumina powder, 1 part of DMP-30, 30 parts of PSPA, and 1 part of BYK-410. The mesh number of alumina powder is 270 mesh.
[0073] Preparation process:
[0074] Prepare component A:
[0075] (1) Mix 0.5 parts of 3-glycidyl etheroxypropyl trimethoxysilane and 12 parts of acetone, adjust the pH value to 7, add nano-AL 2 o 3 , and mechanically stirred for 1 hour under the assistance of ultrasonic waves to obtain a dispersion, ...
Embodiment 3
[0085] The invention discloses a special adhesive for hollow composite insulators, which includes component A and component B, in terms of parts by mass, as shown in Table 1, specifically:
[0086] A component: epoxy resin E44 90 parts, nano AL 2 o 3 1 part, 0.5 parts of γ-aminopropyltriethoxysilane, 8 parts of butyl acetate, SiO 2 120 servings. nano-AL 2 o 3 With an average particle size of 20 nm, SiO 2 The mesh number is 200 mesh.
[0087] Component B: 60 parts of methyl hexahydrophthalic anhydride, 60 parts of alumina powder, 1 part of DMP-30, 20 parts of PSPA, 0.5 part of BYK-410. The mesh number of alumina powder is 270 mesh.
[0088] Preparation process:
[0089] Prepare component A:
[0090] (1) Mix 0.5 parts of γ-aminopropyltriethoxysilane and 8 parts of butyl acetate, adjust the pH value to 6 and add nano-AL 2 o 3 , and mechanically stirred for 1 hour under the assistance of ultrasonic waves to obtain a dispersion, which was set aside;
[0091] (2) Add e...
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