A kind of high out-of-plane thermal conductivity polyimide film and preparation method thereof
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A polyimide film and thermal conductivity technology, applied in the field of polyimide materials, can solve the problem of difficult to achieve the patent orientation effect, achieve good electrical properties and mechanical properties, improve thermal conductivity, and improve the effect of interface bonding force
Active Publication Date: 2021-07-27
GUILIN ELECTRICAL EQUIP SCI RES INST
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However, the thickness of the mainstream heat conduction film products in the market is 25μm and 38μm, which means that the maximum particle size of the filler must be less than 25μm, while the position of the smallest channel size of the conventional die is the lip of the die lip, and the opening of the lip is 0.2-0.6mm Between, much larger than the particle size of the filler, therefore, it is difficult to achieve the orientation effect described in the patent when the flake filler in the above invention is extruded using the existing conventional die
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Embodiment 1
[0032] 1) Mix 43.33kg of thermally conductive filler (boron nitride (particle size: 0.1-20μm), 390kg of N,N-dimethylacetamide and 0.65kg of amino functional group-containing silane coupling agent (HD-M8372), and ultrasonicate for 2 hours. Get the mixed solution, set aside;
[0033] 2) At room temperature, add 31.11kg of 4,4',-diaminodiphenyl ether (ODA) and 45kg of dimethylacetamide (DMAC) into the reactor according to the conventional process, stir and dissolve and add the mixture obtained in step 1) After stirring evenly, it is mixed with pyromellitic dianhydride (PMDA) with a diamine molar ratio of 1:1 (adding in batches) to synthesize a polyamic acid resin with a viscosity of 35,000 centipoise (thermally conductive filler doped Amount is 40wt%), defoaming, obtains defoaming polyamic acid resin;
[0034] 3) adjust the die head of the film casting extrusion equipment, so that the vertical distance between the lip of the die lip on the die head and the steel strip is 10cm; ...
Embodiment 2
[0039] Repeat Example 1, the difference from Example 1 is:
[0040] The amino functional group-containing silane coupling agent is KH-540, the thermally conductive filler is aluminum nitride, the doping amount is 32wt%, the AC electric field strength is 7.5kV / mm, and the polyamic acid resin obtained by synthesis has a viscosity of 50,000 centipoise. The vertical distance between the lip of the lip and the steel strip is 5cm.
Embodiment 3
[0042] Repeat Example 1, the difference from Example 1 is:
[0043] The amino functional group-containing silane coupling agent is KH-550, the doping amount of thermally conductive filler is 25wt%, the AC electric field strength is 5kV / mm, and the viscosity of the synthesized polyamic acid resin is 20,000 centipoise. The vertical distance of the strips is 15 cm.
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Abstract
The invention discloses a polyimide film with high out-of-plane thermal conductivity and a preparation method thereof, belonging to the technical field of polyimide materials. The difference between the preparation method of the high out-of-plane thermal conductivity polyimide film of the present invention and the prior art is that the defoaming polyamic acid resin is extruded from the die lip of the die head of the film casting extrusion equipment to whereabouts In the process to the support body, the effect of the electric field is applied, and the direction of the electric field is perpendicular to the falling direction of the defoaming polyamic acid resin; when passing through the casting furnace, the orientation is upward and positive between the front roller and the rear roller. For the hot air on the back of the support, the temperature of the hot air is 150-170°C. The polyimide film prepared by the method of the present invention also has good electrical properties and mechanical properties while having high out-of-plane thermal conductivity and in-plane thermal conductivity, and simultaneously prepares a self-supporting film without adding a release agent. It can be easily and completely peeled off from the support under the premise.
Description
technical field [0001] The invention relates to polyimide materials, in particular to a polyimide film with high out-of-plane thermal conductivity and a preparation method thereof. Background technique [0002] Polyimide (PI) film is the film insulation material with the best comprehensive performance, and is widely used in the fields of microelectronics and electronic packaging. In recent years, electronic components are developing towards high density, high power, high integration and light weight, which will inevitably generate a lot of heat during operation and work. If the heat dissipation problem cannot be solved in a timely and effective manner, It will directly affect the working efficiency, reliability and service life of electronic components. In order to ensure the normal operation of electronic components for a long time and with high reliability, it is necessary to improve the thermal conductivity of the polyimide film on the basis of ensuring insulation. [0...
Claims
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