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Method for carrying out surface activation treatment on surface of copper alloy

A surface activation treatment, copper alloy technology, applied in the field of activation, can solve the problems that it is difficult to ensure the bonding force between copper/copper alloy materials and the coating, rust or other dirt is not completely removed, and production efficiency is restricted, so as to achieve rapid oxidation removal layer, improve the effect of insufficient activation or excessive etching, and enhance the bonding force of the coating

Active Publication Date: 2021-01-01
崇辉半导体(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For the above-mentioned related technologies, the inventor believes that there are following defects: with the development of technology and the excavation of cost, the composition of copper and copper alloy materials as electroplating workpieces is also constantly changing, and the previous sulfuric acid was used as electrochemical etching or The activation method can no longer meet the activation requirements of existing materials. In the actual production process, the phenomenon of insufficient activation or excessive corrosion frequently occurs, that is, the oxide layer, microscopic protruding points, rust or other dirt on the surface of copper and copper alloy materials Incomplete removal or corrosion into the copper and copper alloy materials, it is difficult to ensure the bonding force between the copper / copper alloy material and the coating, which seriously affects the quality of the product and restricts the improvement of production efficiency
[0005] At present, there are also some activated acids mainly based on strong oxidants on the market to solve the phenomenon of insufficient activation or excessive corrosion of copper and copper alloy materials, but they are very unstable in the production process, and the actual production process takes 2-3 hours of continuous production. Re-replacing the activated acid is very unfavorable for continuous production, and it is not suitable for some copper and copper alloy materials, and there will still be insufficient activation or excessive corrosion

Method used

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  • Method for carrying out surface activation treatment on surface of copper alloy
  • Method for carrying out surface activation treatment on surface of copper alloy
  • Method for carrying out surface activation treatment on surface of copper alloy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A method for carrying out surface activation treatment on a copper alloy surface, comprising the following steps:

[0036] The first step: first transfer the copper alloy to be electroplated to the degreasing solution and perform electrolytic degreasing at room temperature. The degreasing solution is strongly alkaline. The purpose of degreasing and degreasing. The degreasing solution includes degreasing powder with a concentration of 70g / L, and the Baume degree of the degreasing solution is 8°Bé. After the electrolytic degreasing step is completed, the copper alloy to be electroplated after electrolytic degreasing is subjected to three-stage water washing at room temperature To wash away the residual degreasing liquid. Among them, the degreasing powder was purchased from Wenzhou Zhengbang Chemical Co., Ltd., the model is CF-W318, and the degreasing powder can be obtained from commercial channels, and the source of the degreasing powder is not restricted.

[0037] Step...

Embodiment 2-5

[0043] The difference between Embodiments 2-5 and Embodiment 1 lies in that the parameters of each step are different. See Table 1 for related detailed parameters. The effect of the copper alloy used in embodiment 2-5 after the activation of the electroplated part is also as figure 2 As shown (because the activation effect of the electroplated product obtained in embodiment 2-5 is weak with the difference of embodiment 1, the electroplated product obtained in embodiment 2-5 is placed under the microscope of the same magnification to obtain a picture with high similarity, for simplification read, adopt figure 2 as an activation effect description).

[0044] 1. The parameter summary of each step of table 1 embodiment 1-5

[0045]

[0046] See Table 1, from figure 1 It can be seen that there is a thick oxide layer on the surface of the copper alloy to be electroplated, and the measured surface roughness Ra is 2.5-5 μm, which is obtained under the action of the activation...

Embodiment 6-10

[0052] The difference between embodiments 6-10 and embodiment 1 is that the copper alloy parts to be electroplated come from different manufacturers, the components of the copper alloy parts to be electroplated from different manufacturers, and the proportioning between the components are different, as shown in embodiments 6-10. The copper alloy parts to be electroplated are from manufacturers A, B, C, D, and E, and they are only illustrative, just to illustrate that this application can adapt to different copper materials and copper alloy materials. The copper alloy parts to be electroplated used in Examples 6-10 were activated. The effect of the copper alloy used in embodiment 6-10 after the activation of the electroplated part is also as figure 2 shown. See Table 2 for related detailed parameters.

[0053] Table 2 Example 6-10 Main components and proportions of copper alloy parts to be electroplated from different manufacturers

[0054]

[0055] See Table 2, from f...

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Abstract

The invention discloses a method for carrying out surface activation treatment on the surface of a copper alloy. The method comprises the following steps that (1) electrolytic degreasing and water washing are carried out on a copper alloy to-be-electroplated part; 2) the copper alloy to-be-electroplated part subjected to electrolytic degreasing and water washing is conveyed into an activating solution, and is activated at room temperature, and the activating solution is prepared from the following components of an agent A, an agent B and sulfuric acid, wherein the agent A is prepared from thefollowing components of, in percentage by volume, 70%-90% of sodium persulfate, 0.5%-5% of sodium chloride, 5%-15% of citric acid and 4%-10% of urea; and the agent B is prepared from the following components of a nonionic surfactant, ferric oxide and deionized water; and 3) the activated copper alloy to-be-electroplated part is washed with water and dried to obtain an electroplated product. The method has the advantages that insufficient activation or excessive etching of copper and copper alloy materials is improved, the production process is stable, and the method can adapt to the copper andcopper alloy materials with different components.

Description

technical field [0001] This application relates to the technical field of activation in the LED electroplating industry, in particular to a method for surface activation treatment on the surface of a copper alloy. Background technique [0002] Electroplating is a process in which the piece to be electroplated is used as a cathode in an electrolyte solution containing a certain metal ion, and a low-voltage current of a certain waveform is passed through to make the metal ion obtain electrons on the surface of the cathode and reduce it to a simple metal substance, which is continuously deposited as a metal coating. . During the process of processing, transportation, storage, etc., the surface of the parts to be electroplated often has an oxide layer, microscopic protruding points, rust or other dirt. Dirt makes the surface of different copper or copper alloy materials rough and uneven, resulting in different surface roughness on the surface of different copper or copper alloy...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/34C23G1/10C23G1/06C23F3/06C25F1/04
CPCC23F3/06C23G1/061C23G1/103C25D5/34C25F1/04
Inventor 郑建国罗小平
Owner 崇辉半导体(深圳)有限公司
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