Two-color infrared detector and method of making the same
An infrared detector, blue technology, applied in electrical radiation detectors, semiconductor devices, final product manufacturing, etc., can solve the problems of easy diffusion of minority carriers, high dark current, large crosstalk, etc., to ensure quantum efficiency and simple device structure. , the effect of suppressing dark current
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Embodiment 1
[0032] like figure 2 As shown, in this embodiment, the n-type blue channel layer 3 includes an n-type blue channel absorption layer 31 and an n-type blue channel barrier layer that are sequentially stacked on the first n-type contact layer 2 32. The n-type red channel layer 5 includes an n-type red channel barrier layer 51 and an n-type red channel absorption layer 52 that are sequentially stacked on the p-type connection layer 4 . In this embodiment, the n-type blue channel absorption layer 31 and the n-type red channel absorption layer 52 are placed on both sides of the overall detector;
[0033] and as figure 2As shown, between the n-type blue channel absorption layer 31 and the p-type connection layer 4, and between the n-type red channel absorption layer 52 and the p-type connection layer 4, there are respectively n-type blue The color channel barrier layer 32 and the n-type red channel barrier layer 51, so that the n-type absorption layer, the n-type barrier layer a...
Embodiment 2
[0050] This embodiment specifically describes the manufacturing method of the dual-color infrared detector of the first embodiment.
[0051] like Figure 3 to Figure 6 As shown, the production method includes:
[0052] Step S1, providing an n-type substrate 1, the material of the n-type substrate 1 is n-type InAs, the thickness is 500 μm, and the doping concentration is 5×10 16 cm -3 .
[0053] Step S2, using a metal organic chemical vapor deposition (MOCVD) process as a growth process, and the growth sources are TMGa, TMIn, TMSb and AsH 3 , the n-type doping source is SiH 4 , the p-type doping source is DEZn, the growth temperature is about 600 °C, and the reaction chamber pressure is 200 Torr. After the impurities on the surface of the n-type substrate 1 are removed by high temperature treatment, a first n-type contact layer 2 , an n-type blue channel absorption layer 31 , and an n-type blue color are formed in sequence on the n-type substrate 1 . channel barrier layer...
Embodiment 3
[0066] This embodiment specifically describes another manufacturing method of the dual-color infrared detector of the first embodiment.
[0067] like Figure 3 to Figure 6 As shown, the production method includes:
[0068] Step S1, providing an n-type substrate 1, the material of the n-type substrate 1 is n-type GaSb, the thickness is 500 μm, and the doping concentration is 2×10 18 cm -3 .
[0069]Step S2, using molecular beam epitaxy (MBE) as the growth process, the growth sources are solid elemental sources In, As and Sb, the n-type doping source is Si, the p-type doping source is Be, and the growth temperature is about 400°C. After the impurities on the surface of the n-type substrate 1 are removed by high temperature treatment, a first n-type contact layer 2 , an n-type blue channel absorption layer 31 , and an n-type blue color are formed in sequence on the n-type substrate 1 . channel barrier layer 32, p-type connection layer 4, n-type red channel barrier layer 51, n...
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