LTCC device manufactured based on titanium substrate electroplating pattern transfer method

A technology of pattern transfer and plate electroplating, applied in the field of low temperature co-fired ceramics, to achieve the effect of improving reliability and stability and improving dependence

Pending Publication Date: 2020-07-17
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The present invention proposes the additive manufacturing of LTCC's internal electrode electronic interconnection copper circuit by means of electroplating, which can improve the dependence of existing LTCC manufacturing techno

Method used

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  • LTCC device manufactured based on titanium substrate electroplating pattern transfer method
  • LTCC device manufactured based on titanium substrate electroplating pattern transfer method
  • LTCC device manufactured based on titanium substrate electroplating pattern transfer method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] The preparation process of the LTCC device based on the electroplating pattern transfer method on the titanium substrate is as follows:

[0072] 1) Select a titanium substrate with a surface grain size of ASTM 7 or less and a surface roughness Ra<0.6 μm, clean the surface to keep it clean, and print the photoresist or The solder resist ink is drawn on the surface of the titanium substrate according to the circuit pattern designed on the design drawing, and is made into an anti-plating mask attached to the surface of the titanium substrate through processes such as photocuring or thermal curing, exposure, development, and etching;

[0073]The thickness of the photoresist or solder resist ink is controlled according to the designed parameters; the temperature of the heat curing is controlled and baked in an environment of 100-120 degrees Celsius for 0.5-2 minutes; the light curing is used for irradiation and baking of 0.5-5 minutes with infrared lamp ; Exposure, developme...

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PUM

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Abstract

The invention provides an LTCC device manufactured based on a titanium substrate electroplating pattern transfer method, and the method comprises the steps of manufacturing an anti-electroplating maskon the surface of a titanium substrate according to a designed circuit pattern; electroplating the titanium substrate to manufacture a copper circuit pattern; carrying out tape casting of the ceramicslurry directly after the anti-electroplating mask is removed; baking, drying and stripping to obtain an LTCC raw ceramic chip; and carrying out lamination, isostatic pressing and sintering on the prepared LTCC raw ceramic chips of different layers to prepare the LTCC device. According to the invention, the LTCC inner electrode electronic interconnection copper circuit is manufactured through anelectroplating method, the dependence of the existing LTCC manufacturing technology on the electronic paste can be improved, most technical problems caused by the defects of the electronic paste are solved, and the reliability and stability of an electronic interconnection circuit of a package substrate are effectively improved.

Description

technical field [0001] The invention relates to the technical field of low-temperature co-fired ceramics, in particular to an LTCC device manufactured based on a titanium substrate electroplating pattern transfer method. Background technique [0002] With the higher requirements of the fifth-generation communication technology for data and current density transmission, electronic interconnection circuits are increasingly developing in the direction of miniaturization, high frequency, high integration and high density, which requires electronic components in size, New breakthroughs in design, reliability and integration methods. [0003] Low-temperature co-fired ceramic (LTCC) technology is a multilayer ceramic technology, which can embed passive components inside the multilayer ceramic, realize the integration and packaging of passive components in the substrate to assemble the circuit, and then achieve passive The miniaturization, integration, and three-dimensionalization ...

Claims

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Application Information

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IPC IPC(8): H01L21/48H01L23/498
CPCH01L21/4846H01L21/4857H01L21/4867H01L23/49822
Inventor 王翀苏亚东何为陈苑明周国云洪延王守绪
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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