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Preparation method of toughened epoxy resin and underfill adhesive

A technology of underfill glue and epoxy resin, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of insufficient balance, delamination, cracking, etc., to reduce the Tg point, improve the matching relationship, The effect of improving mobility

Active Publication Date: 2020-05-19
深圳市勇泰运科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The chip-level underfill glue disclosed in the prior art is used in large-size chips, such as 50mm 2 *50mm 2 When above, it is easy to have problems such as cracking, delamination, and air bubbles.
After theoretical and technical analysis of the problem of underfill glue in the packaging process of large-size chips, the R&D team found that the main reason is the coefficient of thermal expansion (CTE), glass transition temperature Tg and Young's modulus of the glue. not well balanced

Method used

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  • Preparation method of toughened epoxy resin and underfill adhesive
  • Preparation method of toughened epoxy resin and underfill adhesive
  • Preparation method of toughened epoxy resin and underfill adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] An underfill adhesive, which is prepared by the following steps:

[0048] (1) Preparation of high toughness epoxy resin:

[0049] Step 1: Synthesis of polydimethylsiloxane macroinitiator: add tetrahydrofuran solution to the reaction flask, and then add polydimethylsilane / PDMS-OH, triethylamine and dimethylaminopyridine / DMAP containing monohydroxyl groups , Then vacuumize, remove the oxygen in the reactor, fill it with nitrogen or argon, and add bromoisobutyryl bromide / BiBB at a stirring speed of 20rpm, a temperature of -10°C, and a reaction time of 2 hours to obtain Macroinitiator-bromo-based polydimethylsiloxane PDMS-Br; wherein the mass ratio of THF solvent, PDMS-OH, triethylamine, DMAP, and BiBB is 100:20:5:5:1.

[0050] Step 2: Synthesis of highly toughened epoxy copolymer: PDMS-Br prepared in (Step 1) is used as a macroinitiator, and a block / random copolymer PDMS-bP (GMA-r-PEG-OH) is prepared by atom transfer method , That is, the macroinitiator PDMS-Br, monomer glycidy...

Embodiment 2

[0056] An underfill adhesive, which is prepared by the following steps:

[0057] (1) Preparation of high toughness epoxy resin:

[0058] The high-toughness epoxy resin has a structural formula of polydimethylsiloxane-block-poly(glycidyl methacrylate-random-hydroxy-terminated polyethylene glycol methyl methacrylate) PDMS-bP(GMA -r-PEG-OH) copolymer, the polydimethylsiloxane-block-poly(glycidyl methacrylate-random-hydroxy-terminated polyethylene glycol acrylate) copolymer adopts the following steps Prepared:

[0059] Step 1: Synthesis of polydimethylsiloxane macroinitiator: Add tetrahydrofuran solution to the reaction flask, then add polydimethylsilane containing monohydroxyl group / PDMS-OH, triethylamine and dimethylaminopyridine / DMAP, vacuum, remove oxygen in the reactor, fill with nitrogen or argon, add bromoisobutyryl bromide / BiBB, stirring speed 200rpm, temperature 10℃, reaction time 5 hours, you can get Macroinitiator-bromopolydimethylsiloxane / PDMS-Br; wherein the mass ratio o...

Embodiment 3

[0066] An underfill adhesive, which is prepared by the following steps:

[0067] (1) Preparation of high toughness epoxy resin:

[0068] The high-toughness epoxy resin has the structural formula: polydimethylsiloxane-block-poly(glycidyl methacrylate-random-hydroxy-terminated polyethylene glycol methyl methacrylate) PDMS-bP (GMA-r-PEG-OH) copolymer, which is prepared by the following steps:

[0069] Step 1: Synthesis of polydimethylsiloxane macroinitiator: Add tetrahydrofuran solution to the reaction flask, then add polydimethylsilane containing monohydroxyl group / PDMS-OH, triethylamine and dimethylaminopyridine / DMAP, then vacuum, remove oxygen in the reactor, fill with nitrogen or argon, then add bromoisobutyryl bromide / BiBB, stirring speed 100rpm, temperature 5℃, reaction time 4 hours, you can get The macromolecular initiator-bromopolydimethylsiloxane / PDMS-Br; wherein the mass ratio of THF solvent, PDMS-OH, triethylamine, DMAP, and BiBB is 100:30:8:8:2.

[0070] Step 2: Synthesis ...

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Abstract

The invention provides a preparation method of toughened epoxy resin and an underfill adhesive. The structural formula of the toughened epoxy resin is a polydimethylsiloxane-block-poly(glycidyl methacrylate-random-hydroxyl-terminated polyethylene glycol methyl methacrylate) copolymer. The toughened epoxy resin is synthesized by adopting a block / random controllable active polymerization method; coordination among four characteristics of modulus, thermal expansion coefficient, glass-transition temperature and fluidity of the underfill adhesive can be realized; the toughened epoxy resin is mixedand reacted with bisphenol epoxy resin, a curing agent and the like to prepare the high-performance underfill adhesive. According to the invention, the compatibility between the glue and the chip, thesubstrate and the soldering flux can be improved, and the filling performance of the glue at the bottom of the chip is improved, so that a good bottom filling effect is finally realized, and the reliability problem existing in bottom filling of a large-size chip is solved.

Description

Technical field [0001] The invention belongs to the technical field of polymer materials, and particularly relates to a preparation method of a toughened epoxy resin and an underfill glue. Background technique [0002] With the development of chip technology, more and more functions are carried on silicon chips, and more and more heat is generated during operation. On the other hand, as the size of the chip becomes larger and larger, the thermal expansion coefficient / CTE between the chip and the substrate varies greatly. Therefore, it is necessary to add underfill between the chip and the substrate to reduce the chip and the substrate when the chip heats up. The thermal expansion coefficient / CTE difference between the two leads to deformation, and even cracks between the chip and the substrate. [0003] Patent 201680077238.1 uses a composition containing epoxy resin, maleimide, nadiimide or itaconimide, toughening agent and filler to prepare a wafer-level underfill for three-dimen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F293/00C09J153/00C09J163/02C09J11/04
CPCC08F293/005C08F2438/01C08L2203/206C09J11/04C09J153/00C08L63/00C08K13/04C08K7/18
Inventor 刘少雄魏圳
Owner 深圳市勇泰运科技有限公司
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