Conductive adhesive film for FPC electroplating and production process thereof

Abstract

The invention discloses a conductive adhesive film for FPC electroplating. The conductive adhesive film is characterized in that the conductive adhesive film comprises a base film and a conductive adhesive layer compounded on the base film, wherein the conductive adhesive layer is prepared from the following raw materials in parts by weight: 40-60 parts of 2, 3-difluorofumaric acid / hydroxyl-terminated polyurethane polycondensate, 2-4 parts of diethyl aminovinylmalonate modified epoxy cyclodextrin, 1-3 parts of methacryloyloxypropyltriethoxysilane, 5-10 parts of aminoferrocene modified 4, 4',4'' [ benzene-1, 3, 5-triyl tri (acetylene-2, 1-diyl) ] triphenylformaldehyde, 10-15 parts of superconducting carbon black, 5-10 parts of conductive micro powder and 0.8-1.3 parts of a photoinitiator. The invention also discloses a production process of the conductive adhesive film for FPC electroplating. The conductive adhesive film for FPC electroplating disclosed by the invention has the advantages of good electrical conductivity, aging resistance, high peeling strength, good impact resistance, good damp-heat resistance, excellent electromagnetic wave shielding performance, high bending resistance and difficulty in moisture absorption.

Description

technical field [0001] The invention relates to the technical field of conductive adhesive film, in particular to a conductive adhesive film used for FPC electroplating and a production process thereof. Background technique [0002] In recent years, with the advancement of science and technology and the rapid development of electronic technology, circuit board design tends to be more and more high-precision and high-density. As one of many circuit boards with more functional added value, flexible circuit board (FPC) has high reliability, excellent flexibility, high wiring density, light weight, thin thickness, Good foldability, more and more widely used in the field of electronic products, occupying an important position in electronic products. [0003] In the preparation process of flexible circuit board (FPC), an indispensable link is electroplating, which occupies a dominant position in the assembly of electronic components. However, the traditional electroplating proces...

AI Technical Summary

Problems solved by technology

However, there are some problems with the existing conductive adhesives on the market, such as high viscosity of epoxy resin conductive adhesives, low heat resistance, chemical resistance, poor toughness, and expensive fillers, especially the traditional single metal powder or It is difficult to evenly coat the graphite conductive filler, which hinders the coating operation. The production efficiency of the product is low and cannot be further improved, and the production cost remains high.

Generally speaking, the existing conductive adhesive films generally have technical problems such as low bonding strength and poor heat resistance after hot-press curing.

[0005] The Chinese patent No. 201510129222.8 discloses a flake / dendritic silver-plated copper powder and a green halogen-free low-silver economical conductive adhesive that can replace the traditional high-silver content. The patent uses a large amount of active dilution to reduce reactivity As a result, the heat-resistant temperature of the obtained conductive adhesive is only 230°C, which is not suitable for lead-free soldering above 260°C