Additive for electrolytic copper foil, ultra-low peak HVLP copper foil and preparation method of ultra-low peak HVLP copper foil
A technology of electrolytic copper foil and additives, applied in electrolytic process, electroforming and other directions, can solve the problems of reducing transmission loss and so on
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0117] An additive for electrolytic copper foil, comprising the following components: fatty amine ethoxy sulfonate 0.005g / L, PN polyethyleneimine alkyl salt 0.01g / L, SP sodium polydithiodipropane sulfonate 0.01g / L L, small molecular weight collagen (3000 Daltons) 0.05g / L, chloride ion 10ppm.
[0118] Preparation of 12 micron ultra-low peak HVLP copper foil:
[0119] (1) Preparation of electrolytic solution: copper is added in the solution containing sulfuric acid to obtain electrolytic solution in copper-dissolving tank; the copper content of described electrolytic solution is 60g / L, and sulfuric acid content is 80g / L, and chloride ion content is 15ppm, The temperature is 40°C.
[0120] (2) Surface grinding of the cathode roller: the cathode roller is mechanically polished, and the surface finish of the cathode roller is 0.2 μm;
[0121] (3) Raw foil electroplating: the electrolyte is sent to the electrolytic tank, the additive is added to the electrolyte, and the flow of th...
Embodiment 2
[0126] An additive for electrolytic copper foil, comprising the following components: PN polyethyleneimine alkyl salt 0.02g / L, SP sodium polydithiodipropanesulfonate 0.5g / L, H1 thiazolethione 0.001g / L , Cowhide polypeptide 1.0g / L, chloride ion 20ppm.
[0127] Preparation of 18 micron ultra-low peak HVLP copper foil:
[0128] (1) Preparation of electrolytic solution: copper is added in the solution containing sulfuric acid to obtain electrolytic solution in the copper-dissolving tank; the copper content of described electrolytic solution is 100g / L, and sulfuric acid content is 150g / L, and chloride ion content is 30ppm, The temperature is 70°C.
[0129] (2) Surface grinding of the cathode roller: the cathode roller is mechanically polished, and the surface finish of the cathode roller is 0.1 μm;
[0130] (3) Raw foil electroplating: send the electrolyte to the electrolytic cell, add the additive to the electrolyte, and the flow of the electrolyte is 80m 3 / h, current density ...
Embodiment 3
[0135] An additive for electrolytic copper foil, comprising the following components: fatty amine ethoxy sulfonate 0.015g / L, PN polyethyleneimine alkyl salt 0.015g / L, SP sodium polydithiodipropane sulfonate 0.25g / L L, cowhide polypeptide 0.5g / L, chloride ion 12ppm.
[0136] Preparation of 12 micron ultra-low peak HVLP copper foil:
[0137] (1) Preparation of electrolytic solution: copper is added in the solution containing sulfuric acid to obtain electrolytic solution in copper-dissolving tank; the copper content of described electrolytic solution is 80g / L, and sulfuric acid content is 120g / L, and chloride ion content is 22ppm, The temperature is 55°C;
[0138] (2) Surface grinding of the cathode roller: the cathode roller is mechanically polished, and the surface finish of the cathode roller is 0.15 μm;
[0139] (3) Raw foil electroplating: the electrolyte is sent to the electrolytic cell, the additive is added to the electrolyte, and the flow of the electrolyte is 65m 3 / ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com