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Additive for electrolytic copper foil, ultra-low peak HVLP copper foil and preparation method of ultra-low peak HVLP copper foil

A technology of electrolytic copper foil and additives, applied in electrolytic process, electroforming and other directions, can solve the problems of reducing transmission loss and so on

Inactive Publication Date: 2020-01-24
东强(连州)铜箔有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the mechanical properties of the copper foil need to be improved, and the transmission loss after being applied to PCB needs to be further reduced

Method used

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  • Additive for electrolytic copper foil, ultra-low peak HVLP copper foil and preparation method of ultra-low peak HVLP copper foil
  • Additive for electrolytic copper foil, ultra-low peak HVLP copper foil and preparation method of ultra-low peak HVLP copper foil
  • Additive for electrolytic copper foil, ultra-low peak HVLP copper foil and preparation method of ultra-low peak HVLP copper foil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0117] An additive for electrolytic copper foil, comprising the following components: fatty amine ethoxy sulfonate 0.005g / L, PN polyethyleneimine alkyl salt 0.01g / L, SP sodium polydithiodipropane sulfonate 0.01g / L L, small molecular weight collagen (3000 Daltons) 0.05g / L, chloride ion 10ppm.

[0118] Preparation of 12 micron ultra-low peak HVLP copper foil:

[0119] (1) Preparation of electrolytic solution: copper is added in the solution containing sulfuric acid to obtain electrolytic solution in copper-dissolving tank; the copper content of described electrolytic solution is 60g / L, and sulfuric acid content is 80g / L, and chloride ion content is 15ppm, The temperature is 40°C.

[0120] (2) Surface grinding of the cathode roller: the cathode roller is mechanically polished, and the surface finish of the cathode roller is 0.2 μm;

[0121] (3) Raw foil electroplating: the electrolyte is sent to the electrolytic tank, the additive is added to the electrolyte, and the flow of th...

Embodiment 2

[0126] An additive for electrolytic copper foil, comprising the following components: PN polyethyleneimine alkyl salt 0.02g / L, SP sodium polydithiodipropanesulfonate 0.5g / L, H1 thiazolethione 0.001g / L , Cowhide polypeptide 1.0g / L, chloride ion 20ppm.

[0127] Preparation of 18 micron ultra-low peak HVLP copper foil:

[0128] (1) Preparation of electrolytic solution: copper is added in the solution containing sulfuric acid to obtain electrolytic solution in the copper-dissolving tank; the copper content of described electrolytic solution is 100g / L, and sulfuric acid content is 150g / L, and chloride ion content is 30ppm, The temperature is 70°C.

[0129] (2) Surface grinding of the cathode roller: the cathode roller is mechanically polished, and the surface finish of the cathode roller is 0.1 μm;

[0130] (3) Raw foil electroplating: send the electrolyte to the electrolytic cell, add the additive to the electrolyte, and the flow of the electrolyte is 80m 3 / h, current density ...

Embodiment 3

[0135] An additive for electrolytic copper foil, comprising the following components: fatty amine ethoxy sulfonate 0.015g / L, PN polyethyleneimine alkyl salt 0.015g / L, SP sodium polydithiodipropane sulfonate 0.25g / L L, cowhide polypeptide 0.5g / L, chloride ion 12ppm.

[0136] Preparation of 12 micron ultra-low peak HVLP copper foil:

[0137] (1) Preparation of electrolytic solution: copper is added in the solution containing sulfuric acid to obtain electrolytic solution in copper-dissolving tank; the copper content of described electrolytic solution is 80g / L, and sulfuric acid content is 120g / L, and chloride ion content is 22ppm, The temperature is 55°C;

[0138] (2) Surface grinding of the cathode roller: the cathode roller is mechanically polished, and the surface finish of the cathode roller is 0.15 μm;

[0139] (3) Raw foil electroplating: the electrolyte is sent to the electrolytic cell, the additive is added to the electrolyte, and the flow of the electrolyte is 65m 3 / ...

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PUM

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Abstract

The invention relates to the technical field of electrolytic copper foils, in particular to an additive for electrolytic copper foil, an ultra-low peak HVLP copper foil and a preparation method of theultra-low peak HVLP copper foil. The additive comprises at least four of an acid copper throwing agent, a terahydrozoline thioketone, a monosodium salt, a 3,3'-dithiobis-1-propanesulfonicacidisodiumsalt, a collagen and a cowhide polypeptide as well as chloridion. The additive for the electrolytic copper foil, the ultra-low peak HVLP copper foil and the preparation method of the ultra-low peak HVLP copper foil have the advantages of low roughness, excellent mechanical property and good oxidation resistance.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper foil, in particular to an additive for electrolytic copper foil, ultra-low peak HVLP copper foil and a preparation method thereof. Background technique [0002] At present, mobile communication technology and industry will enter the development stage of the fifth and fifth generation mobile communication (5G). 5G will meet people's requirements for ultra-high data transmission rate and ultra-high mobility. , the millimeter-wave spectrum resources with larger bandwidth will be further opened up. As the usable frequency increases in the future, the concept of high-frequency PCB design is also changing. For example, high-frequency PCBs are increasingly shifting from single- and double-sided boards to multi-layer boards, and complex metallized vias structures (arbitrary layer-to-layer interconnects) are replacing simple metal via or non-metal via structures. [0003] According to the div...

Claims

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Application Information

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IPC IPC(8): C25D1/04C25D3/38
CPCC25D1/04C25D3/38
Inventor 林家宝
Owner 东强(连州)铜箔有限公司
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