A kind of preparation method of high thermal conductivity composite filler and polymer-based composite material thereof

Abstract

The invention provides a preparation method of a high thermal conductivity composite filling material and a polymer matrix composite material of the high thermal conductivity composite filling material. The high thermal conductivity composite filling material comprises a sheet-shaped heat conductive filling material and a spheroidic heat conductive filling material; and the surface of the spheroidic heat conductive filling material is coated with the sheet-shaped heat conductive filling material. The preparation method comprises following steps: the sheet-shaped heat conductive filling material and the spheroidic heat conductive filling material are subjected to surface modification respectively, and are dispersed in an organic solvent for heating stirring, so that chemical reaction and bond connection among reactive groups from the filling materials are realized, and self assembling is carried out so as to obtain a structure similar to sesame seed balls, wherein the surface of the spheroidic heat conductive filling material is coated with the sheet-shaped heat conductive filling material. The unique structure is capable of realizing formation of high efficiency heat conductive paths in a composite material filled with the high thermal conductivity composite filling material, so that adding of a small amount of the high thermal conductivity two-dimensional sheet-shaped fillingmaterial is capable of improving the thermal conductivity of the polymer matrix composite material obviously, and heat conduction requirements of preparation of electrical and electronic equipment canbe satisfied.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting composite material preparation, and relates to a high-heat-conducting composite filler and a method for preparing the polymer-based composite material. Background technique [0002] With the development of the electrical and electronic industry towards high integration and high performance, the power per unit area of ​​devices continues to increase, and the accompanying heat generation is also increasing. If electronic and electrical equipment works at a high temperature for a long time, not only its own performance will decline, but the internal components will also undergo accelerated aging, resulting in a greatly reduced lifespan or even direct failure. Therefore, thermal management is very important for electronic and electrical equipment. Polymer-based thermally conductive and insulating composite materials have been widely researched and used in the industry due to their corrosion re...

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Problems solved by technology

[0003] At present, there are mainly two types of methods to prepare filled thermally conductive composite materials: the first type of method is to randomly fill a large amount of traditional thermally conductive fillers (such as alumina, silica, etc.), and to improve the thermal conductivity by increasing the filling amount of fillers. The advantage is that the preparation process is simple and the traditional thermally conductive filler is cheap, and it is easy to industrialized large-scale production. The mechanical properties of the material are severely deteriorated; the second type of method is to introduce advanced thermally conductive fillers with high thermal conductivity (such as boron nitride, graphene, etc.) The thermal conduction network channel composed of the high-performance advanced thermal conductive filler and the thermal conduction channel constructed in the composite material can greatly improve the thermal conductivity of the composite material. The loading amount must reach the percolation threshold in the composite material in order to efficiently exert its thermal conductivity. However, this type of filler is often expensive, which hinders industrial mass production.

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