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Organosilicon-modified epoxy resin, preparation method thereof and organosilicon-modified epoxy resin adhesive

An epoxy resin and organosilicon technology, applied in the field of organosilicon modified epoxy resin, its preparation, and organosilicon modified epoxy resin adhesive, can solve the problem of harsh synthesis conditions, cumbersome preparation process, and inability to carry out continuous Operation and other problems, to achieve the effect of improved elongation at break, simple process, and obvious effect of high and low temperature resistance

Active Publication Date: 2019-06-07
CHINA SHENHUA ENERGY CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its preparation process is relatively cumbersome. The synthesis of epoxy resin and silicone adopts a separate preparation process and the synthesis conditions are harsh, so continuous operation cannot be carried out.

Method used

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  • Organosilicon-modified epoxy resin, preparation method thereof and organosilicon-modified epoxy resin adhesive
  • Organosilicon-modified epoxy resin, preparation method thereof and organosilicon-modified epoxy resin adhesive
  • Organosilicon-modified epoxy resin, preparation method thereof and organosilicon-modified epoxy resin adhesive

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preparation example Construction

[0042] A preparation method of organosilicon modified epoxy resin, comprising the steps of:

[0043] (1) Under the protection of an inert gas, mix epichlorohydrin with hydrogenated bisphenol A and a catalyst promoter to form a mixed solution; Oxygen resin reaction crude liquid;

[0044] (2) Mix γ-chloropropylmethyldialkoxysilane, phenyltrialkoxysilane and organic solvent at 80-90°C, add dilute hydrochloric acid and react for 4-6 hours, remove the water layer to obtain organic Silicon modifier intermediate;

[0045](3) The bisphenol A epoxy resin reaction crude liquid is contacted with the organic silicon modifier intermediate, and an alkaline solution is added to react, and after separation, washing and drying, a high temperature-resistant and acid-resistant organic silicon modifier is obtained. permanent epoxy resin;

[0046] The alkaline solution described in step (1) and step (3) is an alkali metal hydroxide solution.

[0047] According to the preparation method provide...

Embodiment 1

[0085] (1) In a helium atmosphere protection, add 3mol epichlorohydrin, 0.8mol hydrogenated bisphenol A, and 0.2g glycerol into a vacuum reactor, heat and stir at 40°C to dissolve completely; Concentration is that 35% potassium hydroxide aqueous solution is joined in the reactor, and reaction temperature is 45 ℃, and reaction duration is 2h; Reactor is evacuated to 100KPa, and 70g concentration is added for the second time and is 35% potassium hydroxide solution, and reaction temperature 55°C, the reaction time is 5h;

[0086] (2) Add 0.07mol of γ-chloropropylmethyldiethoxysilane, 0.1mol of phenyltriethoxysilane and 110g of toluene organic solvent into the reaction kettle, heat up to 80°C and stir to mix, drop Add 18 g of dilute hydrochloric acid with a mass concentration of 7%, react for 6 hours, and remove the water layer after cooling to obtain the intermediate of the organosilicon modifier;

[0087] (3) the bisphenol A epoxy resin reaction crude liquid that 50g step (1) m...

Embodiment 2

[0091] (1) In a helium atmosphere protection, add 2.6mol epichlorohydrin, 0.5mol hydrogenated bisphenol A, and 0.2g glycerol trimethyl ether into a vacuum reactor, heat and stir at 45°C to dissolve completely; 50g of sodium hydroxide solution with a mass concentration of 40% was added to the reactor, the reaction temperature was 55°C, and the reaction duration was 1.5h; the reactor was evacuated to 100KPa, and 50g of hydrogen with a mass concentration of 40% was added for the second time Sodium oxide solution, the reaction temperature is 60°C, the reaction time is 4.5h; the reaction kettle is evacuated to 22KPa;

[0092] (2) Add 0.03mol of γ-chloropropylmethyldiethoxysilane, 0.1mol of phenyltriethoxysilane and 100g of toluene organic solvent into the reaction kettle, heat up to 85°C, stir and mix, drop Add 15.5 g of dilute hydrochloric acid with a mass concentration of 6%, react for 5.5 hours, and remove the water layer after cooling to obtain the intermediate of the organosil...

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Abstract

The invention belongs to the field of synthesis and processing of polymer materials, and particularly relates to organosilicon-modified epoxy resin, a preparation method thereof and an organosilicon-modified epoxy resin adhesive. The preparation method comprises the steps: under the protection of inert gas, mixing epoxy chloropropane with hydrogenated bisphenol A and a catalytic assistant, then adding an alkaline solution for a reaction so as to obtain a bisphenol A-epoxy resin reaction crude solution, mixing gamma-chloropropylmethyldialkoxysilane, phenyl trialkoxysilane and an organic solvent, then adding dilute hydrochloric acid for a reaction so as to obtain an organosilicon modifier intermediate, performing contact of the bisphenol A-epoxy resin reaction crude solution with the organosilicon modifier intermediate, adding alkali for a reaction, and performing separation, washing and drying so as to obtain the high temperature-resistant acid corrosion-resistant organosilicon-modifiedepoxy resin. Through the preparation method, preparation of organosilicon and blending of the organosilicon with an epoxy resin crude liquid can be completed in one step, and the operation is simpleand pollution-free; and the obtained adhesive has excellent impact resistance, high temperature resistance and acid corrosion resistance.

Description

technical field [0001] The invention belongs to the field of polymer material synthesis and processing, and in particular relates to a silicone-modified epoxy resin, a preparation method thereof and a silicone-modified epoxy resin adhesive. Background technique [0002] Epoxy resin (EP) has the advantages of excellent mechanical properties, thermal properties, chemical stability and corrosion resistance, as well as its easy processing and low cost. It has been widely used as a matrix material in chemical process equipment; at the same time, due to its It has excellent bonding properties and is widely used in adhesives, coatings and other fields. However, since the cured product of pure epoxy resin has a high cross-linked skeleton structure, and the cured matrix material is brittle, its crack resistance and impact resistance under acid corrosion conditions are poor, which cannot fully meet the material performance requirements. Higher related chemical field. [0003] In rec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/14C08G59/06C09J163/00C09J11/04
Inventor 郭昭华赵宇航王永旺范瑞成刘延红李超郭志峰高进高莹
Owner CHINA SHENHUA ENERGY CO LTD
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