A piezoelectric fiber composite material micro-driver for pipelines and its preparation method
A technology of piezoelectric fibers and composite materials, applied in piezoelectric devices/electrostrictive devices, piezoelectric/electrostrictive/magnetostrictive devices, circuits, etc., can solve problems such as the influence of driving effects
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0031] A piezoelectric fiber composite micro-driver for pipelines, the structure of which is as follows Figure 1-3 As shown, it includes: piezoelectric fiber layer 3, which is composed of laminated piezoelectric ceramic fibers 4, and two adjacent ceramic fibers 4 are bonded by pressure-sensitive adhesive 5, wherein the piezoelectric ceramic fibers are made of 1 mm thick pressure-sensitive adhesive. The electric ceramic sheet is cut into 1*0.5mm rectangular cross-section macrofiber. The pressure-sensitive adhesive 5 used is a thermoplastic pressure-sensitive adhesive. What is used in this embodiment is ethylene-vinyl acetate polymer resin (EVA), with an elastic modulus of 80 MPa, an ultimate strain rate of 200%, and a softening temperature of 90°C. It has good elasticity, flexibility, waterproof and corrosion resistance. Correspondingly, by utilizing the softening property of EVA at 90°C, the complex thermal curing process after casting is abandoned during the preparation, an...
Embodiment 2
[0039] A piezoelectric fiber composite micro-driver for pipelines, comprising laminated piezoelectric ceramic fibers, a piezoelectric fiber layer bonded by pressure-sensitive adhesive between two adjacent ceramic fibers, coated on the piezoelectric fiber layer The epoxy structural adhesive film layer containing dicyandiamide curing agent on the upper and lower surfaces; the interdigitated electrode layer attached to the outer surface of the adhesive film layer. The pressure-sensitive adhesive is a thermoplastic pressure-sensitive adhesive, and polyethylene terephthalate (PET) hot-melt adhesive is used in this embodiment, the strain rate at break is >200%, and the peel strength at 180°C is >4N cm. Softening temperature>80℃. The interdigitated electrode layer is made of polyimide film, and the inner side of the polyimide film is engraved with copper interdigitated electrodes.
[0040] The preparation method of the piezoelectric fiber composite material micro-driver for the pipe...
Embodiment 3
[0046]A piezoelectric fiber composite micro-driver for pipelines, comprising laminated piezoelectric ceramic fibers, a piezoelectric fiber layer bonded by pressure-sensitive adhesive between two adjacent ceramic fibers, coated on the piezoelectric fiber layer The epoxy structural adhesive film layer containing dicyandiamide curing agent on the upper and lower surfaces; the interdigitated electrode layer attached to the outer surface of the adhesive film layer. The pressure-sensitive adhesive is a thermoplastic pressure-sensitive adhesive. In this embodiment, polyamide (PA) hot-melt adhesive is used, with tensile strain rate at break>200%, peel strength at 180°C>4N·cm, and softening temperature at 110°C. The interdigitated electrode layer is made of polyimide film, and the inner side of the polyimide film is engraved with copper interdigitated electrodes. Its preparation method is with embodiment 2.
PUM
Property | Measurement | Unit |
---|---|---|
peel strength | aaaaa | aaaaa |
softening point | aaaaa | aaaaa |
softening point | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com